Abstract: A traction battery pack assembling method includes compressing a first cell stack within a first compression fixture, compressing a second cell stack within a second compression fixture, positioning the first cell stack and the first compression fixture next to the second cell stack and the second compression fixture, and inserting the first and second cell stacks into a cell-receiving opening of an enclosure structure by pushing the first and second cell stacks together into the cell-receiving opening.

Abstract: Various embodiments of the present application are directed towards a semiconductor-on-insulator (SOI) substrate. The SOI substrate includes a handle substrate; a device layer overlying the handle substrate; and an insulator layer separating the handle substrate from the device layer. The insulator layer meets the device layer at a first interface and meets the handle substrate at a second interface. The insulator layer comprises a getter material having a getter concentration profile. The handle substrate contains getter material and has a handle getter concentration profile. The handle getter concentration profile has a peak at the second interface and a gradual decline beneath the second interface until reaching a handle getter concentration.

Abstract: A battery pack assembly method includes compressing a first cell stack, compressing a second cell stack, and inserting the first cell stack together with the second cell stack into a cell-receiving opening of an enclosure structure. Another traction battery pack assembly method includes simultaneously inserting a plurality of separate cell stacks into an enclosure structure when the plurality of cell stacks are each compressed by a compression fixture and, after the inserting, compressing the plurality of cell stacks using the enclosure structure.

Abstract: Manufacturing processes are disclosed for assembling traction battery packs that include battery systems, such as cell-to-pack battery systems. An exemplary assembly method includes inserting one or more cell stacks of the cell-to-pack battery system into a cell-compressing opening of an enclosure tray. The method may involve the use of slider plates that provide sliding surfaces that facilitate the insertion of the cell stacks into the cell compressing opening.

Abstract: Cover attachments are disclosed for securing an enclosure cover to a cell row/battery cell separator on traction battery packs that include cell-to-pack battery systems. One or more separators of a cell-to-pack battery system may be configured to separate cell stack rows or battery cells within the cell-to-pack battery system. A cover attachment (e.g., a clip, an adhesive puck, a magnet assembly, a hook and loop assembly, a ball-and-socket assembly, etc.) may connect to a portion of the separator for securing the enclosure cover directly to the cell-to-pack battery system. The combination of the cover attachments and the separators provides for enclosure cover retention at interior regions of the cell-to-pack battery system, maintains the enclosure cover at a spaced distance apart from the battery cells of the cell-to-pack battery system, and creates a desired amount of pack-level stiffness for distributing loads through the cell-to-pack battery system.

Abstract: Manufacturing processes are disclosed for assembling traction battery packs that include cell-to-pack battery systems. An exemplary assembly method includes inserting a cell matrix of the cell-to-pack battery system into a cell-compressing opening of an enclosure tray using a top-down approach. The method may include compressing a plurality of cell stacks to a desired length, compressing the cell stacks together in a transverse direction to form the cell matrix, and then installing the cell matrix as a single unit into the cell-compressing opening of the enclosure tray.

Abstract: A battery pack assembly method includes compressing at least one cell stack, inserting the at least one cell stack into a cell-receiving opening of an enclosure structure, and pushing at least one cell of the at least one cell stack out of the enclosure structure using a pusher. Another traction battery pack assembly method includes moving a cell stack into an enclosure structure from a compression fixture that compresses the cell stack. The cell stack includes a plurality of battery cells. After the moving, the method compresses the cell stack using the enclosure structure. The method then includes establishing electrical connections between the battery cells of the cell stack, and testing the electrical connections prior to securing a busbar to the cell stack.

Abstract: Traction battery packs are disclosed that include cell-to-pack battery systems. A cell stack/cell matrix of the cell-to-pack battery system may be positioned within an irregularly shaped enclosure tray of the traction battery pack. A block insert may be positioned at an interface between the cell stack/cell matrix and an irregularly shaped interior surface of the enclosure tray. The block insert may be configured to facilitate insertion of the cell stack/cell matrix into the enclosure tray, transfer compression loads from the enclosure tray walls to the cell stack/cell matrix, resist battery cell compression loads, etc.

Abstract: A traction battery pack assembly includes battery cells, an enclosure tray, an enclosure cover that is secured to enclosure tray to provide an interior area that houses the plurality of battery cells, and an electronics support plate supported by the enclosure cover. A traction battery electronics support method includes positioning battery cells of a traction battery pack within an enclosure tray of the traction battery pack, connecting at least one electronics module electrically to other components of the traction battery pack. After the connecting, the method includes securing an electronics support plate to an enclosure cover of the traction battery pack. The electronics support plate supports the at least one electronics module.

Abstract: Embodiments are directed to a method for minimizing electrostatic charges in a semiconductor substrate. The method includes depositing photoresist on a semiconductor substrate to form a photoresist layer on the semiconductor substrate. The photoresist layer is exposed to radiation. The photoresist layer is developed using a developer solution. The semiconductor substrate is cleaned with a first cleaning liquid to wash the developer solution from the photoresist layer. A tetramethylammonium hydroxide (TMAH) solution is applied to the semiconductor substrate to reduce charges accumulated in the semiconductor substrate.

Abstract: A semiconductor device includes a gate structure, source/drain regions, source/drain contacts, a gate dielectric cap, an etch stop layer, and a gate contact. The gate structure is over a substrate. The source/drain regions are at opposite sides of the gate structure. The source/drain contacts are over the source/drain regions, respectively. The gate dielectric cap is over the gate structure and has opposite sidewalls interfacing the source/drain contacts.

Abstract: Systems, methods, and computer-readable media are provided for generating a unique ID for a sensor in a network. Once the sensor is installed on a component of the network, the sensor can send attributes of the sensor to a control server of the network. The attributes of the sensor can include at least one unique identifier of the sensor or the host component of the sensor. The control server can determine a hash value using a one-way hash function and a secret key, send the hash value to the sensor, and designate the hash value as a sensor ID of the sensor. In response to receiving the sensor ID, the sensor can incorporate the sensor ID in subsequent communication messages. Other components of the network can verify the validity of the sensor using a hash of the at least one unique identifier of the sensor and the secret key.

Abstract: An intellectual quality management method is disclosed. A heatmap risk interface is created according to the required data and the parameter configuration which are calculated using a time dependent risk priority number (RPN) equation. An intellectual audit scheduling algorithm is defined via the heatmap risk interface to automatically generate at least one audit plan. An audit program corresponding to the audit plan is performed and a plurality of problem points are selected. Intellectual root cause category recommendation is performed to the questions points. intellectual corrective actions and preventive action recommendations are performed to the problem points according to the intellectual root cause category recommendation to obtain at least one optimum corrective action and at least one preventive action.

Abstract: A method includes: forming a masking layer on a backside of a substrate, the substrate including pixel regions having photodetectors, transistors being positioned on or in a frontside of the substrate; forming a mask opening in the masking layer by exposing the masking layer to patterned light, the opening including: mask pixel regions that mask the pixel regions; and mask protrusion regions that extend from the mask pixel regions toward a mask crossroad region; forming a substrate opening in the substrate by etching the substrate through the mask opening; and forming an isolation structure in the substrate opening.

Abstract: A thermal imaging apparatus for measuring a temperature of a target in a monitored area comprises a thermal imager, an optical image capturing device and a computing processing device. The thermal imager is configured to capture a thermal image of the monitored area. The optical image capturing device is configured to capture optical images of the monitored area. The computing processing device is configured to determine one of the optical images as a determined optical image synchronizing with the thermal image according to positions of blocks corresponding to the target in the thermal image and the optical images, perform calculation according to the thermal image and the determined optical image to obtain a measured distance between the target and the thermal imaging apparatus, and perform calibration according to the measured distance and the thermal image to obtain a calibrated temperature value of the target.

Abstract: A release mechanism is disclosed that can facilitate safely and efficiently removing an expansion card from a computing device. The release mechanism can be installed on a motherboard around an expansion slot, and can include an opening that permits access to the expansion slot to allow an expansion card to be installed therein. When removal of the expansion card is desired, a handled of the release mechanism can be pulled, causing contact surfaces of the release mechanism to push the expansion card away from the expansion slot with even force, removing the need to tilt the expansion card.

Abstract: A mechanism is disclosed having an actuating element, a longitudinal axis, a plunger having at least one first blocking feature and at least one second blocking feature, a plunger force device, a blocking structure rotatable about the longitudinal axis from a first blocking structure position, in which one of the at least one first blocking feature is allowed to pass by the blocking structure and one of the at least one second blocking feature is prevented from passing by the blocking structure, and a second blocking structure position, in which one of the at least one second blocking feature is allowed to pass by the blocking structure, and a transmission configured to transmit a transition of the actuating element between a ready state and a dosing state to a rotation of the blocking structure from the first blocking structure position to the second blocking structure position.

Abstract: The disclosed technology relates to intent driven network management. A system is configured to maintain an inventory store comprising records for a set of network entities in a network, wherein each network entity in the set of network entities is associated with a record in the inventory store. The system receives a user intent statement comprising an action and a flow filter representing network data flows on which the action is to be applied and queries, based on the flow filter, the inventory store to identify a plurality of network entities in the set of network entities to which the user intent statement applies. The system generates a plurality of network policies that implement the user intent statement based on the plurality of network entities and the action and enforces the plurality network policies.

Abstract: A method comprises forming a source/drain contact over a source/drain region; forming an etch stop layer over the source/drain contact and an interlayer dielectric (ILD) layer over the etch stop layer; performing a first etching process to form a via opening extending through the ILD layer and a recess in the etch stop layer; oxidizing a sidewall of the recess in the etch stop layer; after oxidizing the sidewall of the recess in the etch stop layer, performing a second etching process to extend the via opening down to the source/drain contact; and after performing the second etching process, forming a source/drain via in the via opening.

Abstract: A riser bracket assembly for supporting at least one expansion card horizontally over a motherboard is disclosed. The riser bracket assembly may support different types of expansion cards. The assembly includes a first component half having a registration feature to mate with a first type of riser board. A second component half is attachable to the first component half. The second component half has a registration feature to mate with a second type of riser board. A riser board has an edge connector insertable into a socket on the motherboard. The riser board includes an expansion card connector connectable to the at least one expansion card. The riser board supports either the first component half or the second component half.