Abstract: The present invention discloses a novel electrode-catalyst for direct methanol fuel cell prepared by introducing a carbon precursor into pores of a wormhole-like molecular sieve template, carbonizing the carbon precursor, removing the molecular sieve template to obtain a wormhole-like mesoporous carbon having a high specific surface of 800-1000 m2/g and a pore size of 4-5 nm, and depositing catalyst metal such as Pt—Ru on the mesoporous carbon.

Abstract: A manufacturing method of a color filter including following steps is provided. First, a partition is formed on a substrate to form a plurality of pixel regions on the substrate. Next, a color pigment is provided along a continuous pigment-providing route, so as to form the color pigment on a sequence of pixel regions among the plurality of pixel regions and the partition. The method mentioned above can prevent the unfilled phenomenon of the pigment around the corners of the pixel region. Besides, a liquid crystal display panel having the color filter is also provided.

Abstract: A semiconductor interconnect structure having reduced hillock formation and a method for forming the same are provided. The semiconductor interconnect structure includes a conductor formed in a dielectric layer. The conductor includes at least three sub-layers, wherein the ratio of the impurity concentrations in neighboring sub-layers is preferably greater than about two.

Abstract: A method for manufacturing metal nano particles having a hollow structure is provided. First, a suitable reducing agent is added into a first metal salt solution, and first metal ions are reduced to form first metal nano particles. Next, after the reducing agent is decomposed, a second metal salt solution with a higher reduction potential than that of the first metal is added. Then, the first metal particles are oxidized to form first metal ions when the second metal ions are reduced on the surface of the first metal by electrochemical oxidation reduction reaction, and thus, second metal nano particles having a hollow structure and a larger surface area are obtained. The method is simple and the metal nano particles with uniform particle size are obtained by this method.

Abstract: An optical head to access data on an optical recording medium, which has two data storage densities, includes two sets of optical path systems to provide two optical paths that are crossed. Each optical path system includes a laser light generation unit, a light guiding unit, a converging objective lens and a photo detector. The light guiding unit is located on the optical path of the laser light generation unit, to direct the laser light to pass through the converging objective lens and focus on the data side of the optical recording medium to carry optical data signals from the data side. The laser light returns to the light guiding unit and travels along the optical path and is received by the photo detector.

Abstract: An interface apparatus and a method of writing an extended display identification data (EDID) are provided. The interface apparatus includes a data processing unit, a memory unit and a switching unit. The memory unit is coupled to a connector corresponding to the memory unit and the data processing unit via the switching unit. When the interface apparatus is being initialized, the data processing unit detects whether or not the EDID stored in the memory unit is correct. If the EDID stored in the memory unit is incorrect, the data processing unit rewrites the EDID to the memory unit.

Abstract: A winding machine includes a frame with a main axis fixed on. A winding tray is engaged on the main axis and defines long slots. Winding spindles pass through the long slots respectively and stretch forward. An unloading mechanism includes a basic tray and a sub-tray mounted on the main axis. The basic tray defines through-holes and guiding holes. The unloading mechanism further includes unloading units, and each unloading unit has a panel member pivotally connected to the basic tray. The panel member defines an arc track and integrates with a connecting member connected to the basic tray by helical springs and engaging with the winding spindle. A sliding pillar slidably located in the front of the basic tray projects forward to form a supporting element configuring a first idler wheel. A pushing block is moveably received in the through-hole. A front end thereof protrudes out of the through-hole and defines an inclined guide surface and a back end extends to be fixed on the sub-tray.

Abstract: A semiconductor device is provided. A transistor is formed on a substrate, and a metal silicide layer is formed on the surface of a gate conductor layer and a source/drain region. Next, a surface treatment process is performed to selectively form a protection layer on the surface of the metal silicide layer. Then, a spacer of the transistor is partially removed using the protection layer as a mask, so as to reduce the width of the spacer. Then, a stress layer is formed on the substrate.

Abstract: A method for cutting a printed circuit board includes providing a printed circuit board including a cutting region having a plurality of metal conducting wires, disposing a patterned first protection layer on the printed circuit board surface and exposing the metal conducting wires in the cutting region, forming a conducting layer on a surface of the metal conducting wires, disposing a second protection layer on the cutting region, performing a cutting process in the cutting region, and removing the second protection layer.

Abstract: A delay locked loop (DLL) circuit in which situations of lock to multiple periods of a reference signal is determined by a lock detector using dummy delay elements and a duty cycle correction circuit (DCC). The lock detector, the dummy delay elements and the delay control circuit are used in a path parallel to the delay elements which generate the desired delayed signals having different delays in relation to the reference signal. Due to the use of the parallel path, the throughput performance of the DLL circuit is not impeded. In an embodiment, separate charge pumps are used by a phase comparator and the lock detector used in the parallel path.

Abstract: An electroless plating method and the apparatus for performing the same are provided. The method includes providing a plating solution; contacting a front surface of the wafer with the plating solution; and incurring a plating reaction substantially simultaneously on an entirety of the front surface of the wafer. The step of incurring a plating reaction substantially simultaneously includes lift-dispense electroless plating and face-down immersion.

Abstract: A system for buffering articles in transport is provided. The system comprises a buffer module configured to buffer articles and a computing system. The buffer module includes a first conveyor configured to transport the articles and a transference node configured to transfer the articles between the first conveyor and an external location. The computing system is configured to maintain an inventory list including a present location of each of the articles buffered by the buffer module. The computing system is further configured to control operation of the buffer module to transfer a selected article among the buffered articles to the external location.

Abstract: An electronic casing and a method of manufacturing the same are provided. The method includes the following steps. Step (a): a metal laminate and a die of a predetermined shape are provided. The metal laminate comprises a metal top layer and a metal bottom layer that are bonded by interface atom diffusion. Step (b): the metal laminate is processed to form a casing blank by using the die, and the casing blank has at least one turning portion. Step (c): a profiler of a predetermined shape and an electromagnetic forming device are provided. Step (d): the casing blank is attached to the profiler, and the electromagnetic forming device is disposed at a position corresponding to the turning portion. Step (e): the electromagnetic forming device is activated, so that the casing blank has a shape corresponding to the predetermined shape of the profiler.

Abstract: Provided is an image sensor device including a substrate with a pixel region and a peripheral region. A first isolation structure is formed on the substrate in the pixel region. The first isolation structure includes a trench having a first depth. A second isolation structure is formed on the substrate in the peripheral region. The second isolation structure includes a trench having a second depth. The first depth is greater than the second depth.

Abstract: A system for controlling photoflash includes a signal processing unit, a calculating unit, a photoflash module and an adjusting unit. The photoflash module includes a capacitor. The signal processing unit is configured for analyzing image information to get a current brightness value of the image, and the calculating unit is configured for calculating a first photoflash time of the photoflash module based on a first voltage value of the capacitor via analyzing the current brightness value. The adjusting unit is configured for adjusting the first photoflash time to get a second photoflash time according to a second voltage value of the capacitor, and outputting the second photoflash time to the photoflash module to control flashing of the photoflash module.

Abstract: A method is used for adjusting a tilt of an optical pickup head. The method includes: identifying initial coordinates of the first static spot, the second static spot, and the dynamic spot in an image generated from three reflected light beams from the optical pickup head; turning one of the adjustable screws a predetermined calibrated rotation angle; recording current coordinates of the first static spot, the second static spot, and the dynamic spot in another image generated from three reflected light beams from the optical pickup head; calculating a total needed rotation angle of the one adjustable screw according to the initial coordinates, the predetermined calibrated rotation angle, and the current coordinates; and turning the one adjustable screw a remaining rotation angle computed by subtracting the predetermined calibrated rotation angle from the total needed rotation angle. An adjusting system is also disclosed.

Abstract: An exemplary method for optimizing a recording signal of an optical recording apparatus to record data onto a disc, the recording signal having a first pulse-width parameter, the method includes selecting an initial value of the first pulse-width parameter; generating adjusted values based on the initial value to record test data onto the disc respectively; measuring mark lengths of lands; determining average lengths of the mark lengths of lands; determining differences between the average lengths and a predetermined standard length; linear curve fitting the adjusted values and the differences employing the following linear curve fitting equation: Y=AX+B to obtain the constants A and B, wherein X represents the adjusted values, Y represents the differences; determining and storing an optimum value of the first pulse-width parameter to be used for recording the data onto the disc, this optimum value equals to ?B/A. An optical recording apparatus is also provided.

Abstract: An optical actuator is disclosed. The optical actuator includes a seat bearing the optical element, a yoke comprising an end, a suspension system comprising at least one spring sheet connecting the seat and the end, and a driving device moving the seat relative to the yoke. The spring sheet constrains the movement of the seat. The spring sheet includes an inner connecting portion connected to the seat, an outer connecting portion surrounding the inner connecting portion and connected to the end, and a spring structure disposed between the inner and outer connecting portions and connecting the inner and outer connecting portions.

Abstract: Provided is a semiconductor device and a method for its fabrication. The device includes a semiconductor substrate, a first silicide in a first region of the substrate, and a second silicide in a second region of the substrate. The first silicide may differ from the second silicide. The first silicide and the second silicide may be an alloy silicide.

Abstract: A method for non-volatile memory fabrication is provided, in which a substrate is provided, a bottom electrode is formed on the substrate, a solution with precursors of Zr and Sr is coated on the bottom electrode, the solution on the bottom electrode surface is dried and then fired to form a resistor layer of SrZrO3, and a top electrode is formed on the resistor layer.