Abstract: A method of forming a semiconductor package includes forming a thermal conductivity layer and attaching the thermal conductivity layer to a chip. The chip has a first surface and a second surface. The thermal conductivity layer is attached to the first surface of the chip. The thermal conductivity layer provides a path through which heat generated from the chip is dissipated to the ambient. A substrate is attached to the second surface of the chip. A molding compound is formed above the substrate to encapsulate the chip and the thermal conductivity layer.

Abstract: A noble metal nanoparticle can be grown on a semiconductor substrate by contacting a predetermined region of the substrate with a solution including noble metal ions. The predetermined region of the semiconductor substrate can be exposed by applying a polymeric layer over the substrate selectively removing a portion of the polymeric layer. The nanoparticles can be prepared in a predetermined pattern. The nanoparticle can be formed with a barrier separating it from another nanoparticle on the substrate; for example, nanoparticle can be located in a pit etched in the substrate. The size and location of the nanoparticle can be stable at elevated temperatures.

Abstract: A manufacture includes a package structure, a first substrate, and a conductive member of a same material. The package structure includes a chip comprising a conductive pad, a conductive structure over the chip, and a passivation layer over the conductive structure. The passivation layer has an opening defined therein, and the opening exposes a portion of a planar portion of the conductive structure. The first substrate includes a first surface defining a first reference plane and a second surface defining a second reference plane. The conductive member extends across the first reference plane and the second reference plane and into the opening. The conductive member is electrically coupled to the exposed portion of the planar portion.

Abstract: A package for holding a plurality of heterogeneous integrated circuits includes a first chip having a first conductive pad and a first substrate including a first semiconductor, and a second chip having a second conductive pad and a second substrate including a second semiconductor. The second semiconductor is different from the first semiconductor. The package also includes a molding structure in which the first chip and the second chip are embedded, a conductive structure over the first chip and conductively coupled to the first conductive pad and over the second chip and conductively coupled to the second conductive pad, and a passivation layer over the conductive structure. The passivation layer comprises an opening defined therein which exposes a portion of the second chip.

Abstract: An optical element structure and a fabricating process for the same are provided. The optical element fabricating process includes providing a substrate forming thereon a protrusion; and forming an over coating layer over the protrusion and the substrate by a deposition scheme to form an optical element.

Abstract: Embodiments of forming a waveguide structure are provided. The waveguide structure includes a substrate, and the substrate has an interconnection region and a waveguide region. The waveguide structure also includes a trench formed in the substrate, and the trench has a sloping sidewall surface and a substantially flat bottom. The waveguide structure further includes a bottom cladding layer formed on the substrate, and the bottom cladding layer extends from the interconnection region to the waveguide region, and the bottom cladding layer acts as an insulating layer in the interconnection region. The waveguide structure further includes a metal layer formed on the bottom cladding layer on the sloping sidewall surface.

Abstract: An optical element structure and a fabricating process for the same are provided. The optical element fabricating process includes providing a substrate forming thereon a protrusion; and forming an over coating layer over the protrusion and the substrate by a deposition scheme to form an optical element.

Abstract: A method and an apparatus for correcting wireless signal quality are provided. The apparatus includes an abnormality detector and a quality adjuster. The abnormality detector collects multiple measurement values reported by a user equipment (UE), calculates a variation degree value according to the measurement values, and compares the variation degree value with a predetermined threshold value. The measurement values are generated by the UE when the UE measures the wireless signal quality of an evolved node B. The measurement values include a first reference signal receiving quality (RSRQ) of the evolved node B. When the variation degree value is larger than the predetermined threshold value, the quality adjuster corrects the first RSRQ based on the measurement values to generate a second RSRQ of the evolved node B.

Abstract: A structure comprises a substrate having a plateau region and a trench region, a reflecting layer formed over a top surface of the trench region, a first adhesion promoter layer formed over the reflecting layer, a bottom cladding layer deposited over the first adhesion promoter layer, a core layer formed over the bottom cladding layer and a top cladding layer formed over the core layer.

Abstract: An optical bench on substrate includes a substrate and a trench formed inside the substrate and having a sloping side. A reflector layer is formed over the sloping side. An optical component is mounted over the substrate. The reflector layer is configured to reflect an electromagnetic wave to or from the optical component.

Abstract: A method of fabricating a waveguide device is disclosed. The method includes providing a substrate having an elector-interconnection region and a waveguide region and forming a patterned dielectric layer and a patterned redistribution layer (RDL) over the substrate in the electro-interconnection region. The method also includes bonding the patterned RDL to a vertical-cavity surface-emitting laser (VCSEL) through a bonding stack. A reflecting-mirror trench is formed in the substrate in the waveguide region, and a reflecting layer is formed over a reflecting-mirror region inside the waveguide region. The method further includes forming and patterning a bottom cladding layer in a wave-tunnel region inside the waveguide region and forming and patterning a core layer and a top cladding layer in the waveguide region.

Abstract: A noble metal nanoparticle can be grown on a semiconductor substrate by contacting a predetermined region of the substrate with a solution including noble metal ions. The predetermined region of the semiconductor substrate can be exposed by applying a polymeric layer over the substrate selectively removing a portion of the polymeric layer. The nanoparticles can be prepared in a predetermined pattern. The nanoparticle can be formed with a barrier separating it from another nanoparticle on the substrate; for example, nanoparticle can be located in a pit etched in the substrate. The size and location of the nanoparticle can be stable at elevated temperatures.

Abstract: An input method applied to an electronic device which can execute a text editing function is disclosed. The input method includes following steps: triggering a multi-function calling unit to execute an auxiliary input function which provides at least one application module when the text editing function is executed; selecting and executing the application module; and providing an assistance function. When the auxiliary input function is executed, the text editing function continues being executed. According to the disclosure, users can use multi-function operation while information input with a portable electronic device. That is, users do not need to jump out from the window of the input program to the computer operation system to look up for another assistant program, but can edit a document efficiently and smoothly.

Abstract: A noble metal nanoparticle can be grown on a semiconductor substrate by contacting a predetermined region of the substrate with a solution including noble metal ions. The predetermined region of the semiconductor substrate can be exposed by applying a polymeric layer over the substrate selectively removing a portion of the polymeric layer. The nanoparticles can be prepared in a predetermined pattern. Nanowires having a predetermined diameter and a predetermined position can be grown from the nanoparticles.

Abstract: A method for forming gas barriers on electronic devices is provided. The fabrication method includes: providing a first substrate having at least one electronic device thereon; providing a second substrate and forming a gas barrier over the second substrate; disposing the second substrate over the first substrate, wherein the gas barrier faces the electronic device; providing an electromagnetic wave light source over the second substrate; and irradiating the second substrate by the electromagnetic wave light source to transfer the gas barrier to the electronic device and cover the electronic device.

Abstract: A noble metal nanoparticle can be grown on a semiconductor substrate by contacting a predetermined region of the substrate with a solution including noble metal ions. The predetermined region of the semiconductor substrate can be exposed by applying a polymeric layer over the substrate selectively removing a portion of the polymeric layer. The nanoparticles can be prepared in a predetermined pattern. The nanoparticle can be formed with a barrier separating it from another nanoparticle on the substrate; for example, nanoparticle can be located in a pit etched in the substrate. The size and location of the nanoparticle can be stable at elevated temperatures.

Abstract: A noble metal nanoparticle can be grown on a semiconductor substrate by contacting a predetermined region of the substrate with a solution including noble metal ions. The predetermined region of the semiconductor substrate can be exposed by applying a polymeric layer over the substrate selectively removing a portion of the polymeric layer. The nanoparticles can be prepared in a predetermined pattern. Nanowires having a predetermined diameter and a predetermined position can be grown from the nanoparticles.

Abstract: A hot-swappable auxiliary battery module, a hot-swappable auxiliary system and a hot-swap auxiliary method swap are provided. The hot-swappable auxiliary battery module is applied to an electronic device including a first battery, a battery connector, and a first power jack. The first battery is connected to the battery connector to provide power for the electronic device to operate. The hot-swappable auxiliary battery module includes a second battery and a power cable. The second battery is capable of being connected to the battery connector. One end of the power cable is capable of being connected with the first power jack, and the other end of the power cable is connected with the second battery to provide power to the electronic device, so that the operation of the electronic device continues when the first battery is disconnected from the battery connector.

Abstract: Contact management systems and methods are provided. The contact management system includes a storage unit, a display unit, and a processing unit. The storage unit includes a plurality of photos. The display unit displays the photos. The processing unit receives a selection corresponding to one of the photos, and recognizes at least one candidate photo from the photos according to a recognition method, wherein the candidate photo is identical to the selected photo. The processing unit displays the at least one candidate photo via the display unit, and receives a selection corresponding to one of the at least one candidate photo. The processing unit sets the selected candidate photo as an identifier of a contact.

Abstract: A method for forming gas barriers on electronic devices is provided. The fabrication method includes: providing a first substrate having at least one electronic device thereon; providing a second substrate and forming a gas barrier over the second substrate; disposing the second substrate over the first substrate, wherein the gas barrier faces the electronic device; providing an electromagnetic wave light source over the second substrate; and irradiating the second substrate by the electromagnetic wave light source to transfer the gas barrier to the electronic device and cover the electronic device.