Patents by Inventor Chun Hsu

Chun Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230116092
    Abstract: Apparatus and methods are provided for reliable multicast transmission with compact protocol stack. In one novel aspect, compact protocol stacks are configured for the UE and the base station handling both the PTM RB and the PTP RB. The compact protocol stack is either configured a compact RLC entity or a compact PDCP entity. The UE monitors a PTM LCH and a PTP LCH and sends feedback to the network with the PTP RB. The base station transmits MBS data packets in the PTM mode to the one or more subscriber UE, monitors feedback report from each subscriber UEs through corresponding PTP RB, and retransmits MBS data packets to one or more UEs through corresponding PTP RBs based on corresponding feedback reports. PTM-to-PTP and PTP-to-PTM mode switches are performed when triggering events are detected. The mode switch notification is sent to UEs via MAC CE or RLC control PDU.
    Type: Application
    Filed: December 9, 2022
    Publication date: April 13, 2023
    Inventors: Xuelong Wang, Yuanyuan Zhang, Per Johan Mikael Johansson, Pradeep Jose, Ming-Yuan Cheng, Chia-Chun Hsu
  • Patent number: 11624949
    Abstract: A display device including a display area and a non-display area is provided. The display area includes a display panel, a switch unit and a first reflective film. The non-display area includes a second reflective film. The switch unit is disposed on the display panel. The first reflective film is disposed between the display panel and the switch unit. When the display device is set in a pattern mode, the display panel does not emit image light. For the pattern mode, the reflectivity in the display area is approximately equal to the reflectivity in the non-display area for ambient light.
    Type: Grant
    Filed: October 29, 2021
    Date of Patent: April 11, 2023
    Assignee: Au Optronics Corporation
    Inventors: Chia-Chun Hsu, Yu-Ping Kuo, Hsiao-Wei Cheng
  • Publication number: 20230108646
    Abstract: A method of providing early paging indication (PEI) for power consumption enhancements in a 5G/NR network is proposed. Under the novel paging reception procedure with PEI, UE can skip PO monitoring if PEI indicates negative. The UE main receiver is typically turned on in every paging cycle, for LOOP, MEAS, and PEI reception. However, if PEI indicates no paging, then UE can turn off its main receiver right after performing measurements. Since PEIs are always transmitted and are located near synchronization signal block (SSB) bursts, power saving can be achieved not only for PO monitoring but also for light sleep between the last SSB/PEI and the PO monitoring gap and state transitions, when no UE in the UE group is paged.
    Type: Application
    Filed: March 12, 2021
    Publication date: April 6, 2023
    Inventors: Li-Chuan TSENG, Wei-De WU, Yi-Ju LIAO, Chi-Hsuan HSIEH, Chia-Chun HSU
  • Publication number: 20230095823
    Abstract: A method of configuring a set of active cells among neighboring cells to reduce latency and interruption for inter-cell mobility is proposed. The set of active cells is an active set of cells among which UE can do fast cell switching. The set of active cells is configured by the network based on UE measurement report or network deployment information. UE maintains the configuration and can perform pre-synchronization to the configured active cells in downlink (DL) only or in both DL and uplink (UL). UE maintains the DL/UL synchronization with the active cells, and applies configuration once UE is indicated to switch to an active cell as the target cell. Because UE maintains the configuration and DL/UL timing of the target cell before receiving the cell-switch command, the mobility latency and interruption time for inter-cell mobility is reduced.
    Type: Application
    Filed: September 14, 2022
    Publication date: March 30, 2023
    Inventors: LI-CHUAN TSENG, Chia-Hao Yu, Kuan-Hung Chou, Chia-Chun Hsu, Yih-Shen Chen
  • Publication number: 20230102334
    Abstract: Methods for a New Radio (NR)-based, Low Earth Orbit (LEO) Non-Terrestrial Networks (NTN) are proposed to improve cell selection and reselection by using satellite assistance information. Different from traditional 5G New Radio systems, the LEO NTN can provide the next cell information along the satellite trajectory using System Information Broadcast (SIB). The assistance information can include satellite's long term ephemeris in the format of Position Velocity (PV) information or details of satellite's other orbital parameters. During TN-NTN join coverage, as TN cells are expected to have a better coverage then NTN cells, the network can assign higher priority to the TN cells over NTN cells. Similarly, for a mobility involving earth-fixed and earth-moving beams (cells), earth-fixed cells can be prioritized over earth-moving beams for cell reselection.
    Type: Application
    Filed: March 11, 2021
    Publication date: March 30, 2023
    Inventors: Abhishek ROY, Chia-Chun HSU
  • Publication number: 20230087614
    Abstract: Apparatus and methods are provided for reliable multicast transmission with uplink feedback. In one novel aspect, a unicast RB associated with the multicast RB is configured. In one embodiment, a single protocol stack is configured for the UE to receive MBS data packets from both the PTM RB and the PTP RB. The UE assembles data packets from the multicast RB and the unicast RB at the single UE protocol stack and provides uplink feedback for MBS data reception status through the PTP RB. The uplink feedback is provided by the UE RLC entity with RLC status report or by the UE PDCP entity with PDCP status report. The UE is configured with one LCH for the MBS and monitors a multicast LCH through a G-RNTI and a unicast LCH through a C-RNTI. Alternatively, the UE is configured with a multicast LCH and a unicast LCH.
    Type: Application
    Filed: November 28, 2022
    Publication date: March 23, 2023
    Inventors: Xuelong Wang, Pradeep Jose, Chia-Chun Hsu
  • Patent number: 11609559
    Abstract: A data processing system, including a cyclic correlation establishing module, a data pattern establishing module, and a data pattern alignment module, is provided. The cyclic correlation establishing module receives a plurality of first sensor data, obtained from a first sensor operation performed on processing devices, and receives a table of processing steps and cyclic procedures. The cyclic correlation establishing module obtains a data correlation of the first sensor data according to the number of sample points in a data cycle of the first sensor data and the table to correct the first sensor data. The data pattern establishing module obtains a plurality of first data pattern features from the first sensor data. The data pattern alignment module aligns a plurality of second sensor data obtained from a second sensor operation performed on the processing devices with the first sensor data according to the first data pattern features.
    Type: Grant
    Filed: May 14, 2020
    Date of Patent: March 21, 2023
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Hsin-Chi Chen, Chuang-Hua Chueh, Chun-Fang Chen, Chi-Heng Lin, Chun-Hsu Chen
  • Publication number: 20230079182
    Abstract: Method and user equipment (UE) are provided for early evaluation termination. In particular, a UE can receive a downlink (DL) reference signal (RS) from a network. The UE can measure the DL RS to derive a measurement. Then, the UE can adjust a time value or a count value based on the measurement. The time value is configured by the network for triggering measurement reporting procedure or declaring a radio link failure. The count value is configured by the network for triggering beam failure recovery or random access procedure.
    Type: Application
    Filed: August 1, 2022
    Publication date: March 16, 2023
    Inventors: Yi-Ru Chen, Kuan-Hung Chou, Li-Chuan Tseng, Chia-Chun Hsu
  • Publication number: 20230084017
    Abstract: Apparatus and methods are provided for sidelink relay-based UE-to-network communication. In one novel aspect, the relay UE performs delayed relay forwarding upon determining the remote UE is in the DRX cycle based on the PC5 configuration. The relay UE buffers the relay traffic and/or sends a suspending indication to the base station to request the base station to suspend the relay traffic to the remote UE. In another novel aspect, the relay UE monitors paging occasions configured for itself and receives paging message from the network intended for the remote UE in one non-connected RRC state. The relay UE sends a PC5 paging message to the remote UE that is in the non-connected RRC state through the established SL based on the received paging message. In one embodiment, the network stores the SL association between the relay UE and the remote UE to the network.
    Type: Application
    Filed: November 17, 2022
    Publication date: March 16, 2023
    Inventors: Xuelong Wang, Nathan Edward Tenny, Chia-Chun Hsu, Chun-Fan Tsai, Guan-Yu Lin
  • Patent number: 11602201
    Abstract: A band for securing an electronic device to a user may include a monolithic band body having proximal and distal ends for coupling to a body of the electronic device. The monolithic band body may include an elastic material that is elastically stretchable between (1) a fitted mode where the electronic device is secured to a limb of the user, and (2) a stretched mode for fitting over the limb of the user.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: March 14, 2023
    Assignee: APPLE INC.
    Inventors: Scott W. Slabaugh, Tatsuya Sano, Jen-Chun Hsu, Osamu Yabe, Zaki Moustafa, Motohide Hatanaka, Hsiang Hung Chen, Eiryo Shiraishi
  • Patent number: 11600894
    Abstract: Provided is a rapid over-the-air (OTA) production line test platform, including a device under test (DUT), an antenna array and two reflecting plates. The DUT has a beamforming function. The antenna array is arranged opposite to the DUT, and emits beams with beamforming. Two reflecting plates are disposed opposite to each other, and are arranged between the DUT and the antenna array. The beam OTA test of the DUT is carried out by propagation of the beams between the antenna array, the DUT and the two reflecting plates. Accordingly, the test time can be greatly shortened and the cost of test can be effectively reduced. In addition to the above-mentioned rapid OTA production line test platform, platforms for performing the OTA production line test by using horn antenna arrays together with bending waveguides and using a 3D elliptic curve are also provided.
    Type: Grant
    Filed: October 13, 2021
    Date of Patent: March 7, 2023
    Assignee: TMY Technology Inc.
    Inventors: Su-Wei Chang, Chueh-Jen Lin, Wen-Tsai Tsai, Shun-Chung Kuo, Yang Tai, Wei-Yang Chen, Chien-Tse Fang, Po-Chia Huang, Jiun-Wei Wu, Yu-Cheng Lin, Shao-Chun Hsu
  • Patent number: 11601944
    Abstract: Apparatus and methods are provided for virtual carrier operation in wireless systems with large carrier bandwidth. In one novel aspect, virtual carrier (VC) with a block of physically contiguous radio resources within a component carrier is configured. In one embodiment, the UE configures a downlink (DL) common virtual carrier (CVC) and an uplink (UL) CVC, which carry control information for the UE, and one or more DL/UL dedicated VCs (DVCs), which carry data services. In one embodiment, the UE obtains the CVC configuration information including the channel bandwidth and the physical location through system information. In another embodiment, the UE obtains DVC configuration through an RRC-layer signaling. In another novel aspect, the UE obtains a VC configuration switch command through either a MAC signal or a PHY signal, and subsequently reconfigures one or more configured VCs based on the received switch command.
    Type: Grant
    Filed: June 23, 2022
    Date of Patent: March 7, 2023
    Assignee: MediaTek INC.
    Inventors: Pei-Kai Liao, Chia-Chun Hsu, Tao Chen
  • Publication number: 20230062848
    Abstract: A semiconductor device manufacturing system and a method for manufacturing semiconductor device are provided. The semiconductor device manufacturing system includes a substrate processing device and a processor. The substrate processing device includes a processing chamber, a gas supply module and a gas source. The processor is configured to monitor and control the gas supplied into the substrate processing device.
    Type: Application
    Filed: August 30, 2021
    Publication date: March 2, 2023
    Inventors: WEI-CHUN HSU, YUNG-LI TSAI, SHENG-WEI WU, CHIH-HAO CHAO, YU-HAO HUANG
  • Publication number: 20230066030
    Abstract: A calibration method for emulating a Group III-V semiconductor device, a method for determining trap location within a Group III-V semiconductor device and method for manufacturing a Group III-V semiconductor device are provided. Actual tape-out is performed according to an actual process flow of the Group III-V semiconductor device for manufacturing the Group III-V semiconductor devices and PCM Group III-V semiconductor device. Actual electrical performances of the Group III-V semiconductor devices and the PCM Group III-V semiconductor device are obtained and the actual electrical performances of the Group III-V semiconductor devices and the PCM Group III-V semiconductor device are compared to determine locations where one or more traps appear.
    Type: Application
    Filed: August 31, 2021
    Publication date: March 2, 2023
    Inventors: CHIA-CHUNG CHEN, SHUFANG FU, KUAN-HUNG LIU, CHIAO-CHUN HSU, FU-YU SHIH, CHI-FENG HUANG, CHU FU CHEN
  • Publication number: 20230063851
    Abstract: Provided are a semiconductor device and a method for manufacturing the same, and a semiconductor package. The semiconductor device includes a die stack and a cap substrate. The die stack includes a first die, second dies stacked on the first die, and a third die stacked on the second dies. The first die includes first through semiconductor vias. Each of the second dies include second through semiconductor vias. The third die includes third through semiconductor vias. The cap substrate is disposed on the third die of the die stack. A sum of a thickness of the third die and a thickness of the cap substrate ranges from about 50 ?m to about 80 ?m.
    Type: Application
    Filed: August 30, 2021
    Publication date: March 2, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: I-Chun Hsu, Yan-Zuo Tsai, Chia-Yin Chen, Yang-Chih Hsueh, Yung-Chi Lin, Tsang-Jiuh Wu, Wen-Chih Chiou
  • Publication number: 20230066690
    Abstract: A display device including a display area and a non-display area is provided. The display area includes a display panel, a switch unit and a first reflective film. The non-display area includes a second reflective film. The switch unit is disposed on the display panel. The first reflective film is disposed between the display panel and the switch unit. When the display device is set in a pattern mode, the display panel does not emit image light. For the pattern mode, the reflectivity in the display area is approximately equal to the reflectivity in the non-display area for ambient light.
    Type: Application
    Filed: October 29, 2021
    Publication date: March 2, 2023
    Applicant: Au Optronics Corporation
    Inventors: Chia-Chun Hsu, Yu-Ping Kuo, Hsiao-Wei Cheng
  • Publication number: 20230058295
    Abstract: A semiconductor structure includes a ceramic substrate, a first bonding layer, a second bonding layer, a cavity, and a semiconductor layer. The ceramic substrate includes holes on its surface. The first bonding layer is disposed on the surface of the ceramic substrate, and the second bonding layer is bonded to the first bonding layer. The cavity is disposed above the hole and enclosed by the first bonding layer and the second bonding layer. The semiconductor layer extends over the cavity and is disposed along the surface of the second bonding layer.
    Type: Application
    Filed: August 22, 2021
    Publication date: February 23, 2023
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: Yang Du, Yung-Fong Lin, Tsung-Hsiang Lin, Yu-Chieh Chou, Cheng-Tao Chou, Yi-Chun Lu, Chun-Hsu Chen
  • Patent number: 11581795
    Abstract: A current sensing circuit includes an inductor current sensing circuit and a processing circuit. The inductor current sensing circuit senses an inductor current of a direct current to direct current (DC-to-DC) converter to generate a first sensed current signal, wherein an average value of the first sensed current signal is not a constant under different input voltages of the DC-to-DC converter. The processing circuit generates a second sensed current signal, wherein the first sensed current signal is involved in generation of the second sensed current signal, the second sensed current signal is involved in current-mode control of the DC-to-DC converter, and an average value of the second sensed current signal is a constant under said different input voltages of the DC-to-DC converter.
    Type: Grant
    Filed: July 6, 2021
    Date of Patent: February 14, 2023
    Assignee: MEDIATEK INC.
    Inventors: Wei-Chung Chen, Kuo-Chun Hsu
  • Patent number: 11581199
    Abstract: A wafer drying method that detects molecular contaminants in a drying gas as a feedback parameter for a multiple wafer drying process is disclosed. For example, the method includes dispensing, in a wafer drying module, a drying gas over a batch of wafers. Further, the method includes collecting the drying gas from an exhaust of the wafer drying module and determining the concentration of contaminants in the drying gas. The method also includes re-dispensing the drying gas over the batch of wafers if the concentration of contaminants is greater than a baseline value and transferring the batch of wafers out of the wafer drying module if the concentration is equal to or less than the baseline value.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: February 14, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wei-Chun Hsu, Sheng-Wei Wu, Shu-Yen Wang
  • Publication number: 20230041659
    Abstract: A method is provided to support remote UE transmitting recommended bit rate query to the base station via the processing of relay UE. In one novel aspect, a new sidelink MAC CE is introduced to indicate the desired bit rate for a specific sidelink logical channel or for a specific Uu/SL radio bearer. In one novel aspect, after receiving the recommended bit rate query MAC CE, the relay UE forwards the MAC CE of this remote UE to the base station over Uu interface after adding information related to remote UE identity. In one novel aspect, the recommended bit rate query MAC CE, when received by the relay UE, is mapped to a specific uplink logical channel priority value or a specific uplink logical channel priority level, which can be used to compare priority with other UL data or UL MAC CE.
    Type: Application
    Filed: July 29, 2022
    Publication date: February 9, 2023
    Inventors: Guan-Yu Lin, Xuelong Wang, Nathan Edward Tenny, Chia-Chun Hsu