Abstract: A packaging structure including first, second, and third dies, an encapsulant, a circuit structure, and a filler is provided. The encapsulant covers the first die. The circuit structure is disposed on the encapsulant. The second die is disposed on the circuit structure and is electrically connected to the circuit structure. The third die is disposed on the circuit structure and is electrically connected to the circuit structure. The third die has an optical signal transmission area. The filler is disposed between the second die and the circuit structure and between the third die and the circuit structure. A groove is present on an upper surface of the circuit structure. The upper surface includes first and second areas located on opposite sides of the groove. The filler directly contacts the first area. The filler is away from the second area. A manufacturing method of a packaging structure is also provided.

Abstract: A battery charging apparatus includes a battery compartment having a receptacle that is configured to receive a battery pack. The battery charging apparatus includes a first heat exchange module and/or a second heat exchange module. The first heat exchange module includes a plenum surrounding the receptacle, where the plenum includes a chamber to receive a fluid. The plenum also includes a plurality of flow guides disposed in the chamber to define a variable flow passage for the fluid. The second heat exchange module includes a battery connector and a heat sink thermally coupled to the battery connector. The heat sink is arranged to dissipate thermal energy from the battery pack.

Abstract: A magnetoresistive random access memory (MRAM) structure, including a substrate and multiple MRAM cells on the substrate, wherein the MRAM cells are arranged in a memory region adjacent to a logic region. An ultra low-k (ULK) layer covers the MRAM cells, wherein the surface portion of ultra low-k layer is doped with fluorine, and dents are formed on the surface of ultra low-k layer at the boundaries between the memory region and the logic region.

Abstract: A method for manufacturing a package includes generating an electric field between an anode and a cathode in an electroplating solution to electroplate a substrate electrically connected to the cathode; depositing metal on a central region of the substrate with a first deposition rate; depositing metal on an outer region of the substrate with a second deposition rate lower than the first deposition rate; and reducing the first deposition rate.

Abstract: A display device, including a display module, a photodetector, a processor, and an optical structure layer, is provided. The display module is used for displaying an image. The photodetector is electrically connected to the display module and is used for detecting brightness of an ambient light and outputting a sensing signal. The processor is electrically connected to the display module and the photodetector, and is used for receiving the sensing signal and outputting a command signal to the display module according to the sensing signal, so that the display module adjusts brightness of the image according to the command signal. The optical structure layer is disposed on the display module. A glossiness of the optical structure layer is between 4 GU and 35 GU, and a reflectivity of specular component included (SCI) of the optical structure layer is between 3% and 6%.

Abstract: Apparatus and methods are provided for efficient bandwidth adaptation for wideband carrier. In one novel aspect, the UE starts a BWP timer upon detecting one or more BWP timer starting triggering events, resets the BWP timer upon detecting BWP resetting triggering events, and switches to the default BWP upon expiration of the BWP timer. The BWP timer starting triggering events comprises decoding a command to switch away from the default BWP, the detection of end of DL data transmission in DRX mode. In another novel aspect, the UE only decodes the DCI indication for active BWP switching in the first three OFDM symbols of a subframe or a slot. In yet another novel aspect, when the SPS is configured for the serving cell for a UE with multiple BWPs, the SPS is configured for all the BWPs accordingly.

Abstract: Various examples described herein relate to an HMD which comprises an HMD body positioned against a face of a user which includes an IMU to track user location data in an environment. The HMD also comprises a detachable headband assembly including a tracking feature module to construct a map of the environment based on the user location data. The HMD further includes a mechanical mount feature attaching the detachable headband assembly to the HMD body. The mechanical mount feature includes a connection interface to exchange the user location data between the IMU in the HMD body and the tracking feature module in the detachable headband assembly.

Abstract: A method for making a memory device, includes: forming a first dielectric layer over a bottom electrode; forming a first void extending through the first dielectric layer to expose a portion of an upper boundary of the bottom electrode; forming a first conductive structure lining along respective sidewalls of the first void and the exposed portion of the upper boundary of the bottom electrode; filling the first void with the first dielectric layer; and forming a phase change material layer over the first dielectric layer to cause the phase change material layer to contact at least a portion of a sidewall of the first conductive structure.

Abstract: Aspects of the disclosure provide methods and apparatuses for wireless communication. In some embodiments, a first mobile device can receive a first indication of a first transmit activity pattern associated with a second mobile device that transmits data to the first mobile device via a radio interface without passing through a base station. The first mobile device can compute a first receive activity pattern that is inclusive of at least the first transmit activity pattern. The first mobile device monitors the radio interface according to the first receive activity pattern.

Abstract: A signal control method suitable for a touch screen is provided. The signal control method comprises: switching a plurality of scan lines to an enabling voltage level sequentially in a display stage; turning on a plurality of switches sequentially to transmit a plurality of display data to a plurality of data lines when a first scan line of the plurality of scan lines is in an enabled voltage level, wherein a first switch of the plurality of switches is coupled to a first data line of the plurality of data lines, and the first data line corresponds to one of a plurality of dummy lines in a vertical direction, when the first scan line is in the enabled voltage level, the first switch is turned on after other switches are turned on; and setting the plurality of dummy lines to a touch voltage in a touch stage.

Abstract: A display device, including a first display panel, a second display panel, and a first optical structure layer, is provided. The first display panel has a first display surface emitting light toward a first direction. The second display panel has a second display surface emitting light toward a second direction, wherein the first direction is different from the second direction. The first optical structure layer is disposed on the first display panel, wherein a glossiness of the first optical structure layer is between 4 GU and 35 GU, and a reflectivity of specular component included (SCI) of the first optical structure layer is between 3% and 6%. The display device provided by the disclosure can reduce the influence of ambient light from the outside on a displayed image.

Abstract: In some embodiments, a semiconductor fabrication tool is provided. The semiconductor fabrication tool includes a first heating plate arranged within a processing chamber and a second heating plate arranged within the processing chamber vertically over the first heating plate. A first exhaust port is arranged within the processing chamber and a second exhaust port arranged within the processing chamber vertically over the first exhaust port. The first exhaust port is in communication with the first heating plate and is coupled to a first exhaust output. The second exhaust port is in communication with the second heating plate and is coupled to a second exhaust output. A first control element is configured to control a first exhaust pressure at the first exhaust port and a second control element is configured to control a second exhaust pressure at the second exhaust port.

Abstract: In some embodiments, the present disclosure relates to a processing tool that includes a wafer chuck disposed within a hot plate chamber and having an upper surface is configured to hold a semiconductor wafer. A heating element is disposed within the wafer chuck and is configured to increase a temperature of the wafer chuck. A motor is coupled to the wafer chuck and configured to rotate the wafer chuck around an axis of rotation extending through the upper surface of the wafer chuck. The processing tool further includes control circuitry coupled to the motor and configured to operate the motor to rotate the wafer chuck while the temperature of the wafer chuck is increased to form a piezoelectric layer from a sol-gel solution layer on the semiconductor wafer.

Abstract: A capsule endoscope, an endoscope system, and an image correction method are provided. The capsule endoscope includes an image sensor and a posture sensor. The image sensor is coupled to a processor and obtains a sensed image. The posture sensor is coupled to the processor and obtains three-axis data. The processor calculates a screen rotation angle according to the three-axis data and corrects the sensed image according to the screen rotation angle. A first axis and a second axis of the corrected sensed image rotate toward an actual vertical axis and an actual horizontal axis.

Abstract: A UE includes an application processor that generates application data to be transmitted to a base station. The UE also includes a modem that determines a downlink active time period. The modem or the application processor determines whether the application data is available before the downlink active time period. The modem or the application processor withholds the transmission of the application data to the base station until the downlink active time period. The modem transmits the application data to the base station during the downlink active time period.

Abstract: The present disclosure relates to an image sensor having a photodiode surrounded by a back-side deep trench isolation (BDTI) structure, and an associated method of formation. In some embodiments, a plurality of pixel regions is disposed within an image sensing die and respectively comprises a photodiode configured to convert radiation into an electrical signal. The photodiode comprises a photodiode doping column with a first doping type surrounded by a photodiode doping layer with a second doping type that is different than the first doping type. A BDTI structure is disposed between adjacent pixel regions and extending from the back-side of the image sensing die to a position within the photodiode doping layer. The BDTI structure comprises a doped liner with the second doping type and a dielectric fill layer. The doped liner lines a sidewall surface of the dielectric fill layer.

Abstract: A display device includes a display panel and an optical structure layer. The optical structure layer is disposed on the display panel. A glossiness of the optical structure layer is between 4 GU and 35 GU, and a reflectivity of specular component included (SCI) of the optical structure layer is between 3% and 6%. The display device disclosed in the disclosure may reduce an influence of a displayed image from ambient light from the outside.

Abstract: Apparatus and methods are provided for efficient bandwidth adaptation for wideband carrier. In one novel aspect, the UE starts a BWP timer upon detecting one or more BWP timer starting triggering events, resets the BWP timer upon detecting BWP resetting triggering events, and switches to the default BWP upon expiration of the BWP timer. The BWP timer starting triggering events comprises decoding a command to switch away from the default BWP, the detection of end of DL data transmission in DRX mode. In another novel aspect, the UE only decodes the DCI indication for active BWP switching in the first three OFDM symbols of a subframe or a slot. In yet another novel aspect, when the SPS is configured for the serving cell for a UE with multiple BWPs, the SPS is configured for all the BWPs accordingly.

Abstract: An image sensor includes a semiconductor substrate, a gate dielectric layer, a gate electrode, a protection oxide film, and a nitride hard mask. The gate dielectric layer is over the semiconductor substrate. The gate electrode is over the gate dielectric layer. An entirety of a first portion of the gate dielectric layer directly under the gate electrode is of uniform thickness. The protection oxide film is in contact with a top surface of the gate electrode. The gate dielectric layer extends beyond a sidewall of the protection oxide film. The nitride hard mask is in contact with a top surface of the protection oxide film.

Abstract: Methods and apparatus are provided for EPS fallback status report by the modem to the upper layers. In one embodiment, the mobile terminal (MT) initiates a 5G voice call, detects an EPSFB triggered by the wireless network, identifies one or more EPSFB status and sends one or more EPSFB status indicators to at least one upper layer based on the identified one or more EPSFB status. In one embodiment, the EPS fall back is a redirection procedure. In another embodiment, the EPS fallback is a handover procedure. In yet another embodiment, the one or more EPSFB status indictors comprising a redirection to EPS started indicator, a handover to EPS started indicator, a redirection to EPS failed indicator, a handover to EPS failed indicator, a redirection to EPS success indicator, and a handover to EPS success indicator. In one embodiment, the MT sends EPSFB status indicators using AT command.