Abstract: An electronic device including a first body, a second body, a linking member, a plurality of keys, and an actuating module is provided. The first body has a display surface and the second body is adapted to be connected to the first body. The linking member is disposed within the second body. The keys are movably connected to the second body. The actuating module is disposed within the second body and located between the linking member and the keys. The linking member moves via a relative movement between the first body and the second body, so that the actuating module pushes the keys to move from the inside of the second body to the outside of the second body.

Abstract: Provided is a circuit board having a tie bar buried therein. The circuit board includes a dielectric stack, at least a first tie bar, at least a first gold finger and at least a first microvia. The dielectric stack includes a first dielectric layer and a second dielectric layer. The first dielectric layer is located on the second dielectric layer. The dielectric stack includes a wireline region and a gold finger region. The first tie bar is buried in the gold finger region between the first dielectric layer and the second dielectric layer. The at least a first gold finger is located in the gold finger region on the first dielectric layer. The first microvia is located in the gold finger region in the first dielectric layer, and electrically connects the first gold finger to the first tie bar.

Abstract: An electronic device includes a first body and a second body. The first body includes a first main body and a first magnetic element fixed in the first main body. The second body includes a second main body, a supporting unit, a second magnetic element, and a third magnetic element. The second main body is adapted to hold the first body. The supporting unit is pivoted to the second main body. The second magnetic element is fixed in the second main body. The third magnetic element is slidably configured in the second main body to restrict a rotation of the supporting unit relative to the second main body. When the first body leans against the second main body, the third magnetic element is subject to a magnetic attraction force from the first magnetic element and escapes from the supporting unit, so that the supporting unit supports the first body.

Abstract: A memory module pair includes first and second memory modules. Each of the first and second memory modules includes a circuit board having opposite first and second side edges and a front edge, along which a plurality of pins are arranged. Each circuit board of the first and second memory modules has a key notch formed closer to the first side edge than to the second side edge. The circuit board of the first memory module has a corner notch that is formed on the front edge and the first side edge, while the circuit board of the second memory module has a corner notch that is formed on the front edge and the second side edge.

Abstract: A portable electronic device adapted to be detachably connected to a cradle having a containing cavity is provided, wherein an inner wall of the containing cavity has a recess. The portable electronic device includes a body and a locking-and-releasing mechanism disposed in the body and including a driving unit and a latch. The driving unit is disposed in the body. The latch is connected to the driving unit and suitable for being driven by the driving unit to protrude out of the body or hide in the body. When the portable electronic device is disposed in the containing cavity, the driving unit drives the latch to protrude out of the body and be engaged with the recess. When the portable electronic device is going to be detached from the containing cavity, the driving unit drives the latch to be disengaged from the recess and move back in the body.

Abstract: An electronic device including a first body, an input module and a functional element is provided. The input module is movably disposed on the first body and adapted to be moved between a first position and a second position. The functional element is disposed on the input module. When the input module is located at the first position, the functional element is concealed in the first body. When the input module is located at the second position, the functional element is exposed outside the first body.

Abstract: A pattern processing method of a workpiece surface includes at least the following steps. A first anodized process is performed to a workpiece, wherein a surface of the workpiece includes at least one flat portion and at least one curved portion. A patterned film including a releasable substrate and an acid-base resistant ink layer disposed thereon is provided, wherein a surface of the releasable substrate on which the acid-base resistant ink layer is disposed faces the workpiece. A force is applied to an edge of the patterned film to adhere the patterned film the workpiece smoothly, so as to transfer a pattern of the acid-base resistant ink layer to the workpiece. The releasable substrate is removed. The workpiece is etched and the acid-base resistant ink layer is removed; and a second anodized process is performed to form a dichromatic anode three-dimensional texture.

Abstract: A heat sink assembly for dissipating heat from a fully buffered dual inline memory module includes a first heat-dissipating sheet, a second heat-dissipating sheet and at least one clip. The first heat-dissipating sheet covers the fully buffered dual inline memory module. The clip holds the first heat-dissipating sheet and the second heat-dissipating sheet between which the fully buffered dual inline memory module is sandwiched.

Abstract: A heat sink assembly for dissipating heat from a fully buffered dual inline memory module includes a first heat-dissipating sheet, a second heat-dissipating sheet and at least one clip. The first heat-dissipating sheet covers the fully buffered dual inline memory module. The clip holds the first heat-dissipating sheet and the second heat-dissipating sheet between which the fully buffered dual inline memory module is sandwiched.