PATTERN PROCESSING METHOD OF A WORKPIECE'S SURFACE

Abstract

A pattern processing method of a workpiece surface includes at least the following steps. A first anodized process is performed to a workpiece, wherein a surface of the workpiece includes at least one flat portion and at least one curved portion. A patterned film including a releasable substrate and an acid-base resistant ink layer disposed thereon is provided, wherein a surface of the releasable substrate on which the acid-base resistant ink layer is disposed faces the workpiece. A force is applied to an edge of the patterned film to adhere the patterned film the workpiece smoothly, so as to transfer a pattern of the acid-base resistant ink layer to the workpiece. The releasable substrate is removed. The workpiece is etched and the acid-base resistant ink layer is removed; and a second anodized process is performed to form a dichromatic anode three-dimensional texture.

Description

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the priority benefit of Taiwan application serial no. 99120097, filed on Jun. 21, 2010. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.

BACKGROUND

1. Field of the Disclosure

This disclosure is related to a processing method of a workpiece surface, and in particular to a three-dimensional pattern processing method of a workpiece surface.

2. Description of Related Art

Aluminum, titanium, and alloys thereof have advantages such as high strength and light weight, so that they are widely applied in fields such as aeronautics, electronics, and communication. For example, in order to enhance the appearance and visual effects of laptop computers or cell phones, the cases thereof may be processed by anodized processing techniques to increase the diversity of the patterns on the cases.

However, in conventional anodized processing techniques, although the voltages of the two electrodes may be adjusted to manipulate the color of a surface oxide layer, the thickness of the oxide layer is uniform and does not render a stereoscopic impression showing protrusions and concaves. In addition, although methods of obtaining oxide films of different colors by adopting a plurality of anodized processes and coloring processes have been subsequently developed, these methods can only be performed to the same flat surface. Hence, when the same method is performed on a curved surface, problems of discontinuity of color patterns and stereoscopic impressions occur.

SUMMARY

The disclosure provides a pattern processing method of a three-dimensional workpiece surface. The method is capable of solving problems of misalignment between segments of a pattern on a three-dimensional surface.

The disclosure provides a pattern processing method of a workpiece surface. The method includes at least the following steps. Performing a first anodized process to a workpiece, wherein a surface of the workpiece includes at least one flat portion and at least one curved portion; providing a patterned film including a releasable substrate and an acid-base resistant ink layer disposed thereon, wherein a surface of the releasable substrate on which the acid-base resistant ink layer is disposed faces the workpiece; applying a force to an edge of the patterned film, so that the patterned film adheres to the flat portion and the curved portion of the surface of the workpiece, and that a pattern of the acid-base resistant ink layer is transferred onto the surface of the workpiece; removing the releasable substrate; etching the workpiece and removing the acid-base resistant ink layer; and performing a second anodized process, so that a dichromatic anode three-dimensional texture is formed on the surface of the workpiece.

According to an embodiment of the pattern processing method of the workpiece surface provided by the disclosure, the first anodized process is a hard anodized process.

According to an embodiment of the pattern processing method of the workpiece surface provided by the disclosure, a thickness of a first anode layer formed by the first anodized process is greater than a thickness of a second anode layer formed by the second anodized process.

According to an embodiment of the pattern processing method of the workpiece surface provided by the disclosure, an acid-base resistance of the first anode layer formed by the first anodized process is greater than an acid-base resistance of the second anode layer formed by the second anodized process.

According to an embodiment of the pattern processing method of the workpiece surface provided by the disclosure, a scratch resistance of the first anode layer formed by the first anodized process is greater than a scratch resistance of the second anode layer formed by the second anodized process.

According to an embodiment of the pattern processing method of the workpiece surface provided by the disclosure, a step of heating the patterned film is included before adhering the patterned film to the workpiece, so that the patterned film is softened by heat.

According to an embodiment of the pattern processing method of the workpiece surface provided by the disclosure, the patterned film adheres to the surface of the workpiece by way of a vacuum suction process. When performing the vacuum suction process to the workpiece and the patterned film, an edge of the patterned film further adheres to a fixture under the workpiece.

According to an embodiment of the patterned processing method of the workpiece surface provided by the disclosure, a width of the dichromatic anode three-dimensional texture on the curved portion of the surface is slightly greater than a width of the dichromatic anode three-dimensional texture on the flat portion of the surface.

According to an embodiment of the patterned processing method of the workpiece surface provided by the disclosure, there is at least one slit at a position where the patterned film corresponds to the curved portion of the surface of the workpiece.

According to an embodiment of the patterned processing method of the workpiece surface provided by the disclosure, when etching the workpiece, a portion of the first anode layer not covered by the acid-base resistant ink layer is etched.

According to an embodiment of the patterned processing method of the workpiece surface provided by the disclosure, the flat portion and the curved portion are connected continually.

Due to the above, the pattern processing method of the workpiece surface provided by the disclosure is capable of solving the problems of misalignment between segments of surface patterns or the problems of ink permeation at junctions between flat and curved portions of the surface. Hence the pattern on the surface of the workpiece displays a continuous stereoscopic impression and clear contour.

In order to make the aforementioned and other features and advantages of the disclosure more comprehensible, embodiments accompanying figures are described in detail below.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a further understanding of the disclosure, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the disclosure and, together with the description, serve to explain the principles of the disclosure.

FIG. 1 is a schematic workflow diagram of a pattern processing method of a three-dimensional workpiece surface according to an embodiment of the disclosure

FIG. 2 is a schematic cross-sectional diagram of the workpiece after a first anodized process.

FIG. 3 is a schematic diagram of disposing a patterned film on the workpiece.

FIG. 4 is a schematic diagram of adhering the patterned film to the workpiece.

FIG. 5 is a schematic diagram of the workpiece after removing a releasable substrate.

FIG. 6 is a schematic diagram of etching the workpiece and removing an acid-base resistant ink layer.

FIG. 7 is a schematic diagram of the workpiece in FIG. 6 after etching and after removing the acid-base resistant ink layer.

FIG. 8 is a schematic diagram of the workpiece after a second anodized process has been performed thereto.

FIG. 9 is a schematic three-dimensional diagram of the workpiece after the second anodized process has been performed thereto.

DESCRIPTION OF EMBODIMENTS

Pleaser refer to FIG. 1, which is a schematic workflow diagram of a pattern processing method of a three-dimensional workpiece surface according to an embodiment of the disclosure. Referring to both FIGS. 1 and 2, as shown in a step S110, a first anodized process is performed to a workpiece 100. As shown in the figures, a surface of the workpiece 100 is a three-dimensional surface which includes at least one flat portion 110 and at least one curved portion 120. In this embodiment, the flat portion 110 and the curved portion 120 are continually. According to the present embodiment, the first anodized process is a hard anodized process, so as to form a first anode layer L1 on the surface of the workpiece 100, wherein a thickness of the first anode layer L1 is about 30 micrometers (μm).

Next, please refer to FIGS. 1 and 3. As shown in a step S120, a patterned film 200 is provided. The patterned film 200 includes a releasable substrate 210 and an acid-base resistant ink layer 220 disposed on the releasable substrate 210, wherein the releasable substrate 210 is a flexible substrate. According to the present embodiment, a holding device (not shown) is used to hold an edge of the patterned film 200, so as to dispose a surface of the patterned film 200 on which the acid-base resistant ink layer 220 is located to face the workpiece 100.

As shown in FIGS. 1 and 4, in a step S130, a force F is applied to the edge of the patterned film 200, so as to adhere the patterned film 200 to the workpiece 100.

According to an embodiment of the disclosure, the workpiece 100 which has undergone the first anodized process is disposed on a fixture 300, and a vacuum suction device (not shown) is used to continuously suck air out from a space between the workpiece 100 and the patterned film 200. After the patterned film 200 adheres to the flat portion 110 of the surface of the workpiece 100, since the vacuum suction device still continuously sucks air, thereby exerting the force F to the edge of the patterned film 200, the patterned film 200 adheres to the first anode layer L1 on the curved portion 120 of the surface of the workpiece 100 smoothly. In addition, before adhering the patterned film 200 to the workpiece 100 by vacuuming, a heating light tube (not shown) may also be used to heat the patterned film 200, so that the softened patterned film 200 adheres to the workpiece 100 more easily by vacuuming.

It should be additionally mentioned that an area of the patterned film 200 may be greater than an area of the workpiece 100, so that the edge of patterned film 200 further adheres to the fixture 300 under the workpiece 100, thereby enhancing the degree of adherence between the patterned film 200 and the workpiece 100.

Moreover, the patterned film 200 may also have at least one slit (not shown), and the slit is disposed at a position for cooperation with the curved portion 120 of the surface of the workpiece 100. When the patterned film 200 adheres to the workpiece 100, two connecting portions of the patterned film 200 which are located at two sides of the slit are connected to each other to form a continuous pattern. The patterned film 200 matches the contour of the workpiece 100 more easily and tightly adheres to the curved portion 120.

The acid-base resistant ink layer 220 is then transferred to the surface of the workpiece 100. Different methods such as applying a heated air current, external pressure, or ultraviolet light to the patterned film 200 are used according to a material of the acid-base resistant ink layer 220, so that the acid-base resistant ink layer 220 is transferred to the surface of the workpiece 100.

Please refer to FIGS. 1 and 5. As shown in a step S140, the releasable substrate 210 is removed, whereas the acid-base resistant ink layer 220 remains on the surface of the workpiece 100.

Please refer to FIGS. 1, 6, and 7. As shown in a step S150, the workpiece 100 is etched, and the acid-base resistant ink layer 220 is removed. According to the present embodiment, a portion of the first anode layer L1 not covered by the acid-base resistant ink layer 220 is etched, and the first anode layer L1 that is etched forms a plurality of concave parts C. The surface of the workpiece 100 is exposed by the concave parts C. Next, the acid-base resistant ink layer 220 is removed.

Still referring to FIGS. 1, 8, and 9, as shown in a step S160, a second anodized process is performed, so that a dichromatic anode three-dimensional texture is formed on the surface of the workpiece.

When performing the second anodized process, the second anode layer L2 is formed on the concave parts C of the first anode layer L1. If the first anode layer L1 is compared with the second anode layer L2, the first anode layer L1 has a greater thickness (the first anode layer L1 is about 30 μm thick, and the second anode layer L2 is about 3 μm thick), and a color of the second anode layer L2 should preferably be lighter than a color of the first anode layer L1.

Since a hard anode process is adopted for the first anode layer L1, the first anode layer L1 has advantages such as having a longer life span and being harder, scratch resistant, and acid-base resistant. In other words, an acid-base resistance of the first anode layer L1 is greater than n acid-base resistance of the second anode layer L2, and a scratch resistance of the first anode layer L1 is greater than a scratch resistance of the second anode layer L2. The first anode layer L1 is able to extend deep into pores on the surface of the workpiece 100, thereby enhancing bonding effects with the workpiece 100. When the second anodized process is performed afterwards, the second anode layer L2 is only formed on the surface of the workpiece 100 that is exposed by the concave parts C of the first anode layer L1, and does not easily cover the un-etched portions of the first anode layer L1.

In summary, in the workpiece processed by the pattern processing method of the three-dimensional workpiece surface, through at least the above steps, the patterned film continuously adheres to the surface of the workpiece by the vacuum suction process. Even if the surface of the workpiece includes portions which are connected but not linearly continuous, curved surfaces, or surfaces of other shapes, the continuous pattern of the acid-base resistant ink layer is still completely transferred to the first anode layer which is fabricated on the flat portion and the curved portion connected to the flat portion. Compared with conventional art, the continuity of the pattern is enhanced. Moreover, by performing a plurality of anodized processes, anode layers of different thicknesses are formed, so that the pattern renders a stereoscopic impression showing protrusions and concaves and has a clear contour. In other words, the workpiece processed by the pattern processing method of the workpiece surface provided by the disclosure has patterns with advantages such as clear contours and a continuous stereoscopic impression, and does not have the disadvantages such as the surface of the workpiece being divided into linearly discontinuous flat portions and curved portions or discontinuous stereoscopic impressions.

Although the disclosure has been described with reference to the above embodiments, it will be apparent to one of the ordinary skill in the art that modifications to the described embodiment may be made without departing from the spirit of the disclosure. Accordingly, the scope of the disclosure will be defined by the attached claims instead of the above detailed descriptions.

Claims

1. A pattern processing method of a workpiece surface, comprising:

performing a first anodized process to a surface of a workpiece, wherein the surface of the workpiece comprises at least one flat portion and at least one curved portion;

providing a patterned film, comprising a releasable substrate and an acid-base resistant ink layer disposed on the releasable substrate, wherein a surface of the releasable substrate on which the acid-base resistant ink layer is disposed faces the workpiece;

applying a force to an edge of the patterned film to adhere the patterned film to the flat portion and the curved portion of the surface of the workpiece, so that a pattern on the acid-base resistant ink layer is transferred onto the surface of the workpiece;

removing the releasable substrate;

etching the workpiece and removing the acid-base resistant ink layer; and

performing a second anodized process, so that a dichromatic anode three-dimensional texture is formed on the surface of the workpiece.

2. The pattern processing method of the workpiece surface as claimed in claim 1, wherein the first anodized process is a hard anodized process.

3. The pattern processing method of the workpiece surface as claimed in claim 1, wherein a thickness of a first anode layer formed by the first anodized process is greater than a thickness of a second anode layer formed by the second anodized process.

4. The pattern processing method of the workpiece surface as claimed in claim 1, wherein an acid-base resistance of a first anode layer formed by the first anodized process is greater than an acid-base resistance of a second anode layer formed by the second anodized process.

5. The pattern processing method of the workpiece surface as claimed in claim 1, wherein a scratch resistance of a first anode layer formed by the first anodized process is greater than a scratch resistance of a second anode layer formed by the second anodized process.

6. The pattern processing method of the workpiece surface as claimed in claim 1, further comprising a step of heating the patterned film before adhering the patterned film to the workpiece, so that the patterned film is softened by heat.

7. The pattern processing method of the workpiece surface as claimed in claim 1, wherein a method of adhering the patterned film to the surface of the workpiece is a vacuum suction process.

8. The pattern processing method of the workpiece surface as claimed in claim 7, wherein when performing the vacuum suction process to the workpiece and the patterned film, the edge of the patterned film further adheres to a fixture under the workpiece.

9. The pattern processing method of the workpiece surface as claimed in claim 1, wherein a width of the dichromatic anode texture disposed on the curved portion is slightly greater than a width of the dichromatic anode texture disposed on the flat portion.

10. The pattern processing method of the workpiece surface as claimed in claim 1, wherein there is at least one slit at a position where the patterned film corresponds to the curved portion of the surface of the workpiece.

11. The pattern processing method of the workpiece surface as claimed in claim 1, wherein when etching the workpiece, a portion of the first anode layer not covered by the acid-base resistant ink layer is etched.

12. The pattern processing method of the workpiece surface as claimed in claim 1, wherein the flat portion and the curved portion are connected continually.