Patents by Inventor Chun-Hung Chen

Chun-Hung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220252850
    Abstract: A lens module includes a plurality of lenses, an annular body and a reflective element. The reflective element, the lenses and the annular are sequentially arranged along an optical axis from an object side to an image side. The lenses include a first lens that is disposed closest to the object side, and a second lens that is disposed closest to the image side. The reflective element is disposed between the object side and the first lens. The annular body is disposed between the object side and the first lens, between the lenses, or between the second lens and the image side. The lens module satisfies 0.5 mm<EPA/PL<5.5 mm where EPA is an area of an entrance pupil of the lens module, and PL is a length of the reflective element.
    Type: Application
    Filed: January 3, 2022
    Publication date: August 11, 2022
    Inventors: Chun-Yu HSUEH, Tsung-Tse CHEN, Chun-Hung HUANG
  • Patent number: 11410594
    Abstract: A method of dynamic bias control of a source driver bases on data wing level for power-saving. In order to cover the operating conditions of various loads under normal operations, the output buffer circuit operation is biased. The method utilizes the display gray scale difference between a previous data line and an immediately subsequent data line to determine the bias current to be used for the output buffer. When the difference between the current data line display gray scale and the previous data line display gray scale is not large, the bias current of the output buffer can be reduced. When the difference between the current data line display gray scale and the previous data line display gray scale is large, the bias current of the output buffer is increased and the current of the output buffer is adjusted according to different load conditions to save power.
    Type: Grant
    Filed: May 20, 2021
    Date of Patent: August 9, 2022
    Assignee: NOVATEK MICROELECTRONICS CORP.
    Inventors: Chun-Hung Chen, Chia-Hsin Tung, Hsin-Hung Ou, Hung-Yi Lin
  • Patent number: 11409062
    Abstract: Provided is an optical transceiver module, comprising a housing, a substrate, an optical receiving device and a plurality of optical transmitting devices. The substrate is disposed in the housing. The optical receiving device is disposed on the substrate. The plurality of optical transmitting devices are connected to the substrate, and the optical transmitting devices are arranged in an alternating manner. The optical transceiver module effectively utilizes the internal space thereof for a compact design and can have a simple structure for manufacturing.
    Type: Grant
    Filed: February 9, 2021
    Date of Patent: August 9, 2022
    Assignee: USENLIGHT CORPORATION
    Inventors: Chun-Yang Chang, Yun-Cheng Huang, Wen-Hsien Li, Cheng-Hung Lu, Ming-Ju Chen, Chang-Cherng Wu
  • Publication number: 20220244802
    Abstract: A touch display apparatus including a body, a display module, a light control element, and a touch module is provided. The body has an opening. The display module is disposed in the body and is suitable for emitting a plurality of image beams toward the opening. The light control element is disposed to overlap the opening of the body and is suitable for reflecting the image beams coming from the display module to an imaging space to display an image frame of the display module. The imaging space and the display module are located on two opposite sides of the light control element. The touch module is disposed on one side of the light control element and is configured to recognize a touch operation of a user in the imaging space.
    Type: Application
    Filed: January 17, 2022
    Publication date: August 4, 2022
    Applicant: CHAMP VISION DISPLAY INC.
    Inventors: Chun-Chien Liao, Hsin-Hung Lee, Hsin-Mao Chung, Ching-Hung Chen
  • Publication number: 20220246107
    Abstract: A gate driving circuit includes a bootstrapping circuit, a pre-charge circuit, and an output control circuit. The bootstrapping circuit is composed of a bootstrapping capacitor and a transistor. A first terminal of the bootstrapping capacitor has a first voltage during a first duration. The pre-charge circuit is connected to the first terminal of the bootstrapping capacitor. The pre-charge circuit boosts the first terminal of the bootstrapping capacitor from the first voltage to a second voltage during a second duration. The bootstrapping circuit boosts the first terminal of the bootstrapping capacitor from the second voltage to a third voltage during a third duration. The output control circuit is connected to the first terminal of the bootstrapping capacitor. The output control circuit boosts the first terminal of the bootstrapping capacitor from the third voltage to a fourth voltage during a fourth duration.
    Type: Application
    Filed: March 12, 2021
    Publication date: August 4, 2022
    Inventors: Po-Lun CHEN, Chun-Ta CHEN, Chih-Lin LIAO, Fu-Cheng WEI, Po-Tsun LIU, Guang-Ting ZHENG, Ping-Hung HSIEH
  • Patent number: 11404348
    Abstract: A semiconductor package carrier board, a method for fabricating the same, and an electronic package having the same are provided. The method includes forming on a circuit structure a graphene layer that acts as an insulation heat dissipating layer. Since the heat conductivity of the graphene layer is far greater than the heat conductivity of ink (about 0.4 W/m·k), which is used as solder resist, the heat of the semiconductor package carrier board can be conducted quickly, and thus can avoid the problem that the heat will be accumulated on the semiconductor package carrier board.
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: August 2, 2022
    Assignee: PHOENIX PIONEER TECHNOLOGY CO., LTD.
    Inventors: Pao-Hung Chou, Chun-Hsien Yu, Shih-Ping Hsu, Wen-Chang Chen
  • Publication number: 20220238341
    Abstract: A semiconductor structure includes a semiconductor fin extending from a substrate, a source/drain (S/D) feature disposed over the semiconductor fin, a silicide layer disposed over the S/D feature, where the silicide layer extends along a sidewall of the S/D feature, and an etch-stop layer (ESL) disposed along a sidewall of the silicide layer.
    Type: Application
    Filed: April 18, 2022
    Publication date: July 28, 2022
    Inventors: Chun-Hsiung Lin, Shih-Cheng Chen, Chih-Hao Wang, Jung-Hung Chang, Jui-Chien Huang
  • Patent number: 11392246
    Abstract: The disclosure provides a method for driving an OLED touch-and-display device, a driving circuit, and the OLED touch-and-display device. The method includes: dividing each display frame into at least one display period and at least one touch detection period which are alternated; during each display period, generating sequentially-shifted gate driving signals and sequentially-shifted light-emission control signals, and sequentially applying them to at least a part of gate driving lines of the plurality and corresponding light-emission control lines; during each touch detection period: suspending the generation of gate driving signals or also suspending the generation of light-emission control signals; adjusting the average display luminance of a plurality of rows of pixels within a predetermined time period, so that the display luminance is uniform, and the gate driving signal for each row of pixels and the light-emission control signal of the light-emission control line maintain a preset timing relationship.
    Type: Grant
    Filed: May 6, 2021
    Date of Patent: July 19, 2022
    Assignee: NOVATEK MICROELECTRONICS CORP.
    Inventors: Chun-Hung Chen, Kai-Wen Shao, Feng-Lin Chan, Shuo-Wen Jang
  • Publication number: 20220217841
    Abstract: A circuit board is manufactured by mounting a first circuit layer, mounting a conductive bump on the first circuit layer, covering the first circuit layer with a first dielectric layer which exposes the conductive bump, mounting a second dielectric layer on the first dielectric layer with a second dielectric layer opening that exposes the conductive bump, and finally, mounting a second circuit layer on the surface of the second dielectric layer and in the second dielectric layer opening. Since the surface roughness of the second dielectric layer and the second dielectric layer opening is low, it is unlikely to form nano voids between the second dielectric layer and the second circuit layer, and the second circuit layer may be attached to the second dielectric layer firmly, which is an advantage for fine line circuit disposal.
    Type: Application
    Filed: February 25, 2021
    Publication date: July 7, 2022
    Inventors: Chun Hung KUO, Kuo Ching CHEN
  • Patent number: 11377752
    Abstract: A mono-crystalline silicon growth method includes: providing a furnace, a supporting base and a crucible which do not rotate relative to the furnace, and a heating module disposed at an outer periphery of the supporting base. After solidifying a liquid surface of a silicon melt in the crucible to form a crystal, the heating power of the heating module is successively reduced to appropriately adjust the temperature around the crucible to effectively control a temperature gradient of a thermal field around the crucible, so as to form a mono-crystalline silicon ingot by solidifying the silicon melt.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: July 5, 2022
    Assignee: GlobalWafers Co., Ltd.
    Inventors: Chun-Hung Chen, Hsing-Pang Wang, Wen-Ching Hsu, I-Ching Li
  • Publication number: 20220210930
    Abstract: A flexible display device includes: first and second casings; a frame movably assembled to the second casing; and a flexible display having first and second ends opposite to each other and first and second display areas. The second casing is movably assembled to the first casing to form a drawer configuration and slide relative to the first casing to switch between drawn-out and retracted states. The first end is connected to the first casing. The second end to the frame. In the retracted state, the flexible display is bent so the second display area is contained in the first and second casings. In a process from the retracted state to the drawn-out state, the second casing is drawn out from the first casing and drives the frame to move in the same direction to expand and flatten the second display area. A portable electronic device is also provided.
    Type: Application
    Filed: September 2, 2021
    Publication date: June 30, 2022
    Applicant: Acer Incorporated
    Inventors: Chun-Hung Wen, Chun-Hsien Chen, Hui-Ping Sun, Yen-Chou Chueh
  • Publication number: 20220208958
    Abstract: A capacitor structure comprises a substrate having a first side and a second side opposite to the first side; a plurality of first trenches formed on the first side of the substrate; a plurality of second trenches formed on the second side of the substrate; a first capacitor extending along the first side and into the first trenches; and a second capacitor extending along the second side and into the second trenches.
    Type: Application
    Filed: December 29, 2020
    Publication date: June 30, 2022
    Inventors: Teng-Chuan HU, Chu-Fu LIN, Chun-Hung CHEN
  • Publication number: 20220204698
    Abstract: The present invention provides a polyimide comprising a structural unit, which comprises a first structural unit represented by formula (1) and a second structural unit represented by formula (2), wherein A, D and E are defined herein. A polyimide film formed by the polyimide has a low linear thermal expansion coefficient.
    Type: Application
    Filed: August 17, 2021
    Publication date: June 30, 2022
    Applicant: MICROCOSM TECHNOLOGY CO., LTD.
    Inventors: Steve Lien-chung Hsu, Chun-Heng Chen, Bo-Hung Lai, Yu-Chiao Shih
  • Patent number: 11372267
    Abstract: A contact lens product includes a contact lens and a buffer solution. The contact lens is immersed in the buffer solution, and the buffer solution includes a cycloplegic agent.
    Type: Grant
    Filed: January 13, 2020
    Date of Patent: June 28, 2022
    Assignee: LARGAN MEDICAL CO., LTD.
    Inventors: En-Ping Lin, Wei-Yuan Chen, Chun-Hung Teng
  • Patent number: 11372198
    Abstract: A device for adjusting interpupillary distance is provided. The device for adjusting interpupillary distance includes an adjustment bottom, a housing, and an adjustment support. The housing is disposed on the adjustment bottom. The housing includes a base, a holder, and a deformation part disposed between the base and the holder. The holder moves relative to the base via the deformation part. The adjustment support is connected to the holder and the adjustment bottom.
    Type: Grant
    Filed: March 31, 2020
    Date of Patent: June 28, 2022
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chun-Lung Chen, Han-Chih Hu, Shan-Peng Lai, Yu-Han Liu, Chun-Hung Liu
  • Patent number: 11353991
    Abstract: The disclosure provides a method for driving an OLED touch-and-display device, a driving circuit, and an OLED touch-and-display device. The method includes: generating gate driving signals that are sequentially shifted based on the first clock signal (GCK); sequentially applying the gate driving signals that are sequentially shifted to the plurality of GLs; writing display data in a display driving period for each row of pixels, to the row of pixels, wherein a time length of the display driving period depends on a corresponding gate driving signal and is smaller than the clock cycle; and for a display driving period for each of at least one row of pixels, setting a touch detection period corresponding to the display driving period or corresponding to the display driving period for previous row of pixels at least partially overlapping with the display driving period in time.
    Type: Grant
    Filed: May 6, 2021
    Date of Patent: June 7, 2022
    Assignee: NOVATEK MICROELECTRONICS CORP.
    Inventors: Chun-Hung Chen, Kai-Wen Shao, Feng-Lin Chan, Shuo-Wen Jang
  • Patent number: 11348884
    Abstract: An organic interposer includes interconnect-level dielectric material layers embedding redistribution interconnect structures, at least one dielectric capping layer overlying a topmost interconnect-level dielectric material layer, a bonding-level dielectric layer overlying the at least one dielectric capping layer, and a dual-layer inductor structure, which may include a lower conductive coil embedded within the topmost interconnect-level dielectric material layer, a conductive via structure vertically extending through the at least one dielectric capping layer, and an upper conductive coil embedded within the bonding-level dielectric layer and comprising copper.
    Type: Grant
    Filed: November 13, 2020
    Date of Patent: May 31, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Wei-Han Chiang, Ming-Da Cheng, Ching-Ho Cheng, Wei Sen Chang, Hong-Seng Shue, Ching-Wen Hsiao, Chun-Hung Chen
  • Publication number: 20220157744
    Abstract: An organic interposer includes interconnect-level dielectric material layers embedding redistribution interconnect structures, at least one dielectric capping layer overlying a topmost interconnect-level dielectric material layer, a bonding-level dielectric layer overlying the at least one dielectric capping layer, and a dual-layer inductor structure, which may include a lower conductive coil embedded within the topmost interconnect-level dielectric material layer, a conductive via structure vertically extending through the at least one dielectric capping layer, and an upper conductive coil embedded within the bonding-level dielectric layer and comprising copper.
    Type: Application
    Filed: November 13, 2020
    Publication date: May 19, 2022
    Inventors: Wei-Han CHIANG, Ming-Da CHENG, Ching-Ho CHENG, Wei Sen CHANG, Hong-Seng SHUE, Ching-Wen HSIAO, Chun-Hung CHEN
  • Publication number: 20220149039
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first fin structure and an adjacent second fin structure protruding from the semiconductor substrate and an isolation structure formed in the semiconductor substrate and in direct contact with the first fin structure and the second fin structure. The first fin structure and the second fin structure each include a first portion protruding above a top surface of the isolation structure, a second portion in direct contact with a bottom surface of the first portion, and a third portion extending from a bottom of the second portion. A top width of the third portion is different than a bottom width of the third portion and a bottom width of the second portion.
    Type: Application
    Filed: January 25, 2022
    Publication date: May 12, 2022
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ta-Chun LIN, Tien-Shao CHUANG, Kuang-Cheng TAI, Chun-Hung CHEN, Chih-Hung HSIEH, Kuo-Hua PAN, Jhon-Jhy LIAW
  • Patent number: 11326272
    Abstract: A mono-crystalline silicon growth apparatus includes a furnace, a support base, a crucible, a heating module disposed outside of the crucible, and a heat adjusting module above the crucible. The heat adjusting module includes a diversion tube, a plurality of heat preservation sheets, and a hard shaft. The diversion tube includes a tube body and a carrying body connected to the tube body. The heat preservation sheets are sleeved around the tube body and are stacked and disposed on the carrying body. The hard shaft passes through the tube body and does not rotate. The hard shaft includes a water flow channel disposed therein and a clamping portion configured to clamp a seed crystal. Therefore, a fluid injected into the water flow channel takes away the heat near the clamping portion. A heat adjusting module and a hard shaft of the mono-crystalline silicon growth apparatus are provided.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: May 10, 2022
    Assignee: GlobalWafers Co., Ltd.
    Inventors: Chun-Hung Chen, Hsing-Pang Wang, Wen-Ching Hsu, I-Ching Li