Patents by Inventor Chun-Hung Chen

Chun-Hung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240124844
    Abstract: The present disclosure provides a method for preparing a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors, the composition prepared by the method, and use of the composition for treating arthritis. The composition of the present disclosure achieves the effect of treating arthritis through various efficacy experiments.
    Type: Application
    Filed: October 4, 2023
    Publication date: April 18, 2024
    Inventors: Chia-Hsin Lee, Po-Cheng Lin, Yong-Cheng Kao, Ming-Hsi Chuang, Chun-Hung Chen, Chao-Liang Chang, Kai-Ling Zhang
  • Publication number: 20240128127
    Abstract: A semiconductor device includes a single diffusion break (SDB) structure dividing a fin-shaped structure into a first portion and a second portion, an isolation structure on the SDB structure, a first spacer adjacent to the isolation structure, a metal gate adjacent to the isolation structure, a shallow trench isolation (STI around the fin-shaped structure, and a second isolation structure on the STI. Preferably, a top surface of the first spacer is lower than a top surface of the isolation structure and a bottom surface of the first spacer is lower than a bottom surface of the metal gate.
    Type: Application
    Filed: December 28, 2023
    Publication date: April 18, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chih-Kai Hsu, Ssu-l Fu, Chun-ya Chiu, Chi-Ting Wu, Chin-HUNG Chen, Yu-Hsiang Lin
  • Patent number: 11958996
    Abstract: A protection tape includes a base film, an antistatic layer and an adhesive layer. The antistatic layer is located on the base film. The surface impedance of the antistatic layer is less than 1E+9?, and the antistatic layer includes a first resin and conductive materials dispersed in the first resin. The conductive materials include at least one of metal ions and carbon. The adhesive layer is located on a corona treated surface of the base film. The protection tape provided by the present disclosure has the advantage of having resistant to corona treatment.
    Type: Grant
    Filed: July 14, 2022
    Date of Patent: April 16, 2024
    Assignee: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Chun-Che Tsao, Cheng-Hung Chen
  • Patent number: 11963300
    Abstract: A panel device including a substrate, a conductor pad, a turning wire, and a circuit board is provided. The substrate has a first surface and a second surface connected to the first surface while a normal direction of the second surface is different from a normal direction of the first surface. The conductor pad is disposed on the first surface of the substrate. The turning wire is disposed on the substrate and extends from the first surface to the second surface. The turning wire includes a wiring layer in contact with the conductor pad and a wire covering layer covering the wiring layer. The circuit board is bonded to and electrically connected to the wire covering layer. A manufacturing method of a panel device is also provided herein.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: April 16, 2024
    Assignee: Au Optronics Corporation
    Inventors: Chun-Yueh Hou, Hao-An Chuang, Fan-Yu Chen, Hsi-Hung Chen, Yun Cheng, Wen-Chang Hsieh, Chih-Wen Lu
  • Publication number: 20240118806
    Abstract: Systems, devices, methods, and circuits for managing content addressable memory (CAM) devices. In one aspect, a semiconductor device includes: a memory cell array configured to store data in memory cells, and a circuitry coupled to the memory cell array and configured to execute a search operation in the memory cell array according to a search instruction. The search instruction includes at least one of search data or an option code, and the option code specifies, for the search operation, at least one of a search length or a search depth.
    Type: Application
    Filed: October 6, 2022
    Publication date: April 11, 2024
    Applicant: Macronix International Co., Ltd.
    Inventors: Chin-Hung Chang, Ken-Hui Chen, Chun-Hsiung Hung
  • Patent number: 11953942
    Abstract: A foldable electronic device having multiple screens is provided. The foldable electronic device includes a first screen, a worm rod, a moving member, at least one second screen, and at least one linking rod. The worm rod is rotatably disposed on the first screen. The moving member is coupled to the worm rod to move along the worm rod when the worm rod rotates. The second screen is movably disposed on the first screen. The linking rod is pivotally connected between the moving member and the second screen. When the moving part moves along the worm rod, the second screen is driven to move away from or closed to the worm rod by the linking rod, so that the second screen moves out of the first screen or is accommodated behind the first screen.
    Type: Grant
    Filed: February 18, 2021
    Date of Patent: April 9, 2024
    Assignee: Acer Incorporated
    Inventors: Hui-Ping Sun, Yen-Chou Chueh, Chun-Hung Wen, Chun-Hsien Chen
  • Publication number: 20240111138
    Abstract: A catadioptric optical membrane, which is disposed on a surface of a substrate, includes a reflection membrane and a matting membrane. The reflection membrane is disposed on an effective optical path area of the substrate and includes a reflection metal membrane and a reflection oxidation membrane. The reflection oxidation membrane includes a first reflection oxidation membrane and a second reflection oxidation membrane. The reflection metal membrane is farther away from the substrate than the first reflection oxidation membrane. The second reflection oxidation membrane is farther away from the substrate than the reflection metal membrane. The matting membrane is disposed on a non-effective optical path area of the substrate. The matting membrane includes a deep-color membrane and a first anti-reflection membrane. The deep-color membrane includes a deep-color metal membrane and a deep-color oxidation membrane. The deep-color membrane is farther away from the substrate than the first anti-reflection membrane.
    Type: Application
    Filed: September 27, 2023
    Publication date: April 4, 2024
    Inventors: Wen-Yu TSAI, Shih-Han CHEN, Chun-Yen CHEN, Cheng-Yu TSAI, Chun-Hung TENG
  • Publication number: 20240111330
    Abstract: A foldable electronic device is provided, including a first body, a second body, a supporting member, a first hinge connecting the first body and the supporting member, a second hinge connecting the supporting member and the second body, and a gravity-type latch movably disposed in the supporting member. The first body and the supporting member are rotated relatively to be folded or unfolded via the first hinge, and the second body and the supporting member are rotated relatively to be folded or unfolded via the second hinge. In a transforming process of the first body folding to the supporting member and together unfolding relative to the second body, the gravity-type latch is latched onto the first body once the unfolding angle is less than a predetermined value, and the gravity-type latch is de-latched from the first body once the unfolding angle is equal to or greater than the predetermined value.
    Type: Application
    Filed: May 4, 2023
    Publication date: April 4, 2024
    Applicant: Acer Incorporated
    Inventors: Jui-Yi Yu, Chun-Hsien Chen, Hui-Ping Sun, Chun-Hung Wen, Yen-Chou Chueh
  • Publication number: 20240111339
    Abstract: A cabling structure of a foldable electronic device includes a first body, a second body, a hinge module connecting the first body and the second body, a sliding member movably disposed in the second body, a flexible electrical connecting member connected to the first body, the second body, and the sliding member and being driven when the first body and the second body are rotated relatively, and a restoring module disposed in the second body and providing a force to the sliding member. The first body and the second body are rotated relatively to each other through the hinge module. When being rotated relatively to each other, the first body and the second body drive the flexible electrical connecting member and the sliding member. The restoring module restores the sliding member and the flexible electrical connecting member via the force.
    Type: Application
    Filed: May 8, 2023
    Publication date: April 4, 2024
    Applicant: Acer Incorporated
    Inventors: Hui-Ping Sun, Jui-Yi Yu, Chun-Hung Wen, Yen-Chou Chueh, Chun-Hsien Chen
  • Patent number: 11947090
    Abstract: A lens module includes a plurality of lenses, an annular body and a reflective element. The reflective element, the lenses and the annular are sequentially arranged along an optical axis from an object side to an image side. The lenses include a first lens that is disposed closest to the object side, and a second lens that is disposed closest to the image side. The reflective element is disposed between the object side and the first lens. The annular body is disposed between the object side and the first lens, between the lenses, or between the second lens and the image side. The lens module satisfies 0.5 mm<EPA/PL<5.5 mm where EPA is an area of an entrance pupil of the lens module, and PL is a length of the reflective element.
    Type: Grant
    Filed: January 3, 2022
    Date of Patent: April 2, 2024
    Assignees: SINTAI OPTICAL (SHENZHEN) CO., LTD., ASIA OPTICAL CO., INC.
    Inventors: Chun-Yu Hsueh, Tsung-Tse Chen, Chun-Hung Huang
  • Patent number: 11950016
    Abstract: The present invention provides a control method of a receiver. The control method includes the steps of: when the receiver enters a sleep/standby mode, continually detecting an auxiliary signal from an auxiliary channel to generate a detection result; and if the detection result indicates that the auxiliary signal has a preamble or a specific pattern, generating a wake-up control signal to wake up the receiver before successfully receiving the auxiliary signal having a wake-up command.
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: April 2, 2024
    Assignee: MEDIATEK INC.
    Inventors: Chun-Chia Chen, Chih-Hung Pan, Chia-Chi Liu, Shun-Fang Liu, Meng-Kun Li, Chao-An Chen
  • Patent number: 11943935
    Abstract: A layout pattern of a magnetoresistive random access memory (MRAM) includes a substrate having a first cell region, a second cell region, a third cell region, and a fourth cell region and a diffusion region on the substrate extending through the first cell region, the second cell region, the third cell region, and the fourth cell region. Preferably, the diffusion region includes a H-shape according to a top view.
    Type: Grant
    Filed: September 26, 2022
    Date of Patent: March 26, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chun-Yen Tseng, Shu-Ru Wang, Yu-Tse Kuo, Chang-Hung Chen, Yi-Ting Wu, Shu-Wei Yeh, Ya-Lan Chiou, Chun-Hsien Huang
  • Publication number: 20240098932
    Abstract: A foldable electronic device, including a first body, a second body, an air valve movably disposed in the first body, at least one triggering member, and a hinge connecting the first body and the second body, is provided. The first body has multiple openings respectively located at two opposite surfaces. The triggering member is movably disposed in the first body and has a part exposed outside the first body. The air valve and the triggering member are mutually on moving paths of each other. The first body and the second body are rotated to be folded or unfolded relative to each other by the hinge. A part of the triggering member is suitable for bearing a force such that the triggering member drives the air valve, so that the air valve opens or closes the openings.
    Type: Application
    Filed: July 19, 2023
    Publication date: March 21, 2024
    Applicant: Acer Incorporated
    Inventors: Hui-Ping Sun, Jui-Yi Yu, Chun-Hung Wen, Yen-Chou Chueh, Yu-Ming Lin, Chun-Hsien Chen
  • Publication number: 20240096781
    Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.
    Type: Application
    Filed: March 20, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Ti Lu, Hao-Yi Tsai, Chia-Hung Liu, Yu-Hsiang Hu, Hsiu-Jen Lin, Tzuan-Horng Liu, Chih-Hao Chang, Bo-Jiun Lin, Shih-Wei Chen, Hung-Chun Cho, Pei-Rong Ni, Hsin-Wei Huang, Zheng-Gang Tsai, Tai-You Liu, Po-Chang Shih, Yu-Ting Huang
  • Publication number: 20240096861
    Abstract: A semiconductor package assembly is provided. The semiconductor package assembly includes first semiconductor die, a second semiconductor die and a memory package. The first semiconductor die and the second semiconductor die are stacked on each other. The first semiconductor die includes a first interface and a third interface. The first interface overlaps and is electrically connected to the second interface arranged on the second semiconductor die. The third interface is arranged on a first edge of the first semiconductor die. The memory package is disposed beside the first semiconductor die, wherein the memory package is electrically connected to the first semiconductor die by the third interface.
    Type: Application
    Filed: August 23, 2023
    Publication date: March 21, 2024
    Inventors: Che-Hung KUO, Hsiao-Yun CHEN, Wen-Pin CHU, Chun-Hsiang HUANG
  • Patent number: 11934223
    Abstract: A foldable electronic device, including a first body having a first shaft member, at least one second body having a second shaft member, and a latching member, is provided. The first shaft member and the second shaft member are coaxially pivoted together. The first shaft member has a recess. The second shaft member has a locking hole. The latching member is movably disposed in the recess and the locking hole, so that when the latching member leaves the locking hole, the first body and the second body are relatively pivoted through the first shaft member and the second shaft member, or when the latching member moves into the locking hole, the latching member interferes with the first shaft member and the second shaft member to block the first body and the second body from relatively pivoting.
    Type: Grant
    Filed: May 30, 2022
    Date of Patent: March 19, 2024
    Assignee: Acer Incorporated
    Inventors: Hui-Ping Sun, Chun-Hung Wen, Yen-Chou Chueh, Chun-Hsien Chen
  • Publication number: 20240088293
    Abstract: An n-type metal oxide semiconductor transistor includes a gate structure, two source/drain regions, two amorphous portions and a silicide. The gate structure is disposed on a substrate. The two source/drain regions are disposed in the substrate and respectively located at two sides of the gate structure, wherein at least one of the source/drain regions is formed with a dislocation. The two amorphous portions are respectively disposed in the two source/drain regions. The silicide is disposed on the two source/drain regions, wherein at least one portion of the silicide overlaps the two amorphous portions.
    Type: Application
    Filed: October 5, 2022
    Publication date: March 14, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chun-Ya Chiu, Ssu-I Fu, Chin-Hung Chen, Jin-Yan Chiou, Wei-Chuan Tsai, Yu-Hsiang Lin
  • Publication number: 20240069618
    Abstract: The disclosure provides a power management method. The power management method is applicable to an electronic device. The electronic device is electrically coupled to an adapter, and includes a system and a battery. The adapter has a feed power. The battery has a discharge power. The power management method of the disclosure includes: reading a power value of the battery; determining a state of the system; and discharging power to the system, when the system is in a power-on state and the power value is greater than a charging stopping value, by using the battery, and controlling, according to the discharge power and the feed power, the adapter to selectively supply power to the system. The disclosure further provides an electronic device using the power management method.
    Type: Application
    Filed: April 27, 2023
    Publication date: February 29, 2024
    Inventors: Wen Che CHUNG, Hui Chuan LO, Hao-Hsuan LIN, Chun TSAO, Jun-Fu CHEN, Ming-Hung YAO, Jia-Wei ZHANG, Kuan-Lun CHEN, Ting-Chao LIN, Cheng-Yen LIN, Chunyen LAI
  • Publication number: 20240072137
    Abstract: A first transistor includes a first gate, a first source/drain, and a first source/drain contact disposed over the first source/drain. The first gate has a first dimension measured in a first lateral direction. The first source/drain contact has a second dimension measured in the first lateral direction. A second transistor includes a second gate, a second source/drain, and a second source/drain contact disposed over the second source/drain. The second gate has a third dimension measured in the first lateral direction. The second source/drain contact has a fourth dimension measured in the first lateral direction. A first ratio of the first dimension and the second dimension is different from a second ratio of the third dimension and the fourth dimension.
    Type: Application
    Filed: August 31, 2022
    Publication date: February 29, 2024
    Inventors: Li-Hui Chen, Chun-Hung Chen, Jhon Jhy Liaw
  • Patent number: 11908864
    Abstract: In a method of manufacturing a semiconductor device, a first-conductivity type implantation region is formed in a semiconductor substrate, and a carbon implantation region is formed at a side boundary region of the first-conductivity type implantation region.
    Type: Grant
    Filed: November 1, 2021
    Date of Patent: February 20, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Hung Chen, Chih-Hung Hsieh, Jhon Jhy Liaw