Abstract: A protective packaging for protecting an LED module from being damaged during transportation, includes a housing containing the LED module therein and a cover slidably fixed in the housing to cover a top opening of the housing. The housing defines a room to receive the LED module therein. A bottom portion of the housing is concaved to form a space, in which a thermal interface material bonded on the LED module is accommodated. An end of the housing is closed to abut against an end of the cover, and an opposite end of the housing is partially opened to receive an opposite end of the cover. The protective packaging is made from an antistatic plastic and has a wall thickness larger than 0.5 mm.

Abstract: An LED lamp includes a heat sink, an LED module attached to a top surface of the heat sink in a thermal conductive relationship therewith and a cover coupled to the top surface of the heat sink and covering the LED module. The heat sink is column-shaped and has a central axis. The heat sink comprises a conducting member and a plurality of spaced and parallel fins extending outwardly from the conducting member. A distance between each of inner edges of the fins and the central axis is gradually decreased from the top surface to a bottom surface of the heat sink.

Abstract: A heat dissipation device includes a heat sink and a fixing base for securing the heat sink to a heat-generating device. The heat sink includes a base and a pair of flanges formed on two opposite sides of the base. The fixing base includes a pair of side plates formed on a first set of two opposite sides thereof. A pair of resilient barbs extends inwards from an end portion of each side plate. The fixing base is placed on the heat sink and the resilient barbs tightly clasp first two opposite sides of the heat-generating device to press the base of the heat sink towards the heat-generating device. The flanges of the base of the heat sink abut second two opposite sides of the heat-generating device to avoid movement of the heat sink along a direction perpendicular to the flanges.

Abstract: Ester prodrugs of phorbol compounds for the treatment of viral infections, neoplastic diseases, inflammatory reactions, and use as analgesics, wherein the phorbol compounds are derivatized with a -x-o-c(o)-R? group linked to the 6-carbon of the phorbol residue.

Abstract: An LED lamp includes a top cover, a heat sink, and a conducting member, a plurality of light bars and a light cover. The top cover has a plate and a head extending upwardly from a centre of the plate. The heat sink has a conducting tube coupled to the plate of the top cover and a plurality of fins extending outwardly from the conducting tube. The conducting member is received in and thermally contacts with the conducting tube, and has a top surface attached to the plate and an inner surface on which the plurality of light bars are mounted. The inner surface is oriented downwardly and concaved from a bottom of the conducting member. Each light bar has a printed circuit board and a plurality of LEDs thereon.

Abstract: An LED lamp includes a first heat sink, a pair of second heat sinks arranged at two opposite sides of the first heat sink, a plurality of heat pipes connecting the first heat sink to the pair of second heat sinks, and an LED module mounted on the first heat sink. With the help of good heat conducting capability of the heat pipes, heat generated by LEDs of the LED module can be conducted to the first heat sink and the pair of second heat sinks rapidly, which then dissipate the heat to the ambient air. Each second heat sink consists of a plurality of sheets defining a plurality of gaps therebetween; the gaps extend through top and bottom of each second heat sink. Each second heat sink has a lower portion below a bottom surface of the first heat sink.

Abstract: An LED lamp includes a heat sink, a plurality of vapor chambers mounted on the heat sink and an LED module mounted on the vapor chambers. The heat sink includes a base, a plurality of fins extending from a first surface of the base and a triangular ridge formed on a second surface opposite to the first surface of the base. The vapor chambers are mounted on the ridge of the base. The LEDs over two slopes of the ridge are oriented slantwise outwardly, thereby increasing an irradiation angle and area of the LED lamp.

Abstract: An LED lamp includes a heat sink, a plurality of LED modules mounted on the heat sink, a bracket connecting with the heat sink and a cover covering over the heat sink. The heat sink includes a curved base plate and a plurality of fins extending from an inner surface of the base plate. The LED modules are mounted on an outer surface of the base plate, whereby the LED modules radiate light on different directions. The bracket is located above the fins and includes two connecting bars to respectively connect two ends of the base plate. The cover covers over the outer surface of the base plate to protect the LED modules. Heat generated by the LED modules is absorbed by base plate of the heat sink and dissipated into ambient air via the fins thereof.

Abstract: A vacuum circuit interrupter having a pole unit structure and an operating mechanism structured to move the vacuum circuit interrupter contacts between a first, closed position, wherein a movable contact is coupled to, and in electrical communication with, a fixed contact, and a second, open position wherein the movable contact is spaced from, and not in electrical communication with, the fixed contact, as well as being structured to rotate a housing assembly rotatable portion between a first position, wherein a rotatable terminal is coupled to, and in electrical communication with, a line terminal, and a second position, wherein the rotatable terminal is coupled to, and in electrical communication with, a grounded terminal.

Abstract: A heat dissipation device includes a heat sink and a fixing base for securing the heat sink to a heat-generating device. The heat sink includes a base and a pair of flanges formed on two opposite sides of the base. The fixing base includes a pair of side plates formed on a first set of two opposite sides thereof. A pair of resilient barbs extends inwards from an end portion of each side plate. The fixing base is placed on the heat sink and the resilient barbs tightly clasp first two opposite sides of the heat-generating device to press the base of the heat sink towards the heat-generating device. The flanges of the base of the heat sink abut second two opposite sides of the heat-generating device to avoid movement of the heat sink along a direction perpendicular to the flanges.

Abstract: A heat dissipation device includes a heat sink (10), a fan holder (20) located on the heat sink and a fan (30) mounted on the fan holder. The heat sink includes a plurality of fins (14) extending therefrom and defines two slots (16) in two opposite outmost fins thereof. The fan holder includes two brackets (200) each having a positioning rib (212) engaged in a corresponding slot of the heat sink and resisting the outmost fin to thereby mount the fan holder to the heat sink.

Abstract: When scanning a patient to generate an image thereof, radio frequency (RF) coil modules are scalably coupled to each other using a plurality of clips to form flat or polygonal coil arrays that are placed on or around the patient or a portion thereof. A user assesses the volume to be imaged, identifies a coil array configuration of suitable size and shape and employs clips of one or more pre-determined angles to construct the identified coil array configuration, which is placed on or about the volume. Coil modules are coupled to a preamplifier interface box (PIB), which provides preamplified coil signal(s) to a patient imaging device, such as an MRI scanner. Small arrays are constructible to accommodate pediatric patients and/or smaller animals. Modules are hermetically sealed, can be sanitized between uses, and discarded at end-of-life. In one aspect, the modular coil array, clips, and PIB are maintained in an isolated contamination zone, separate from the patient imaging device.

Abstract: Compounds represented by the formula where R1, R2, R3, R4, R5, and Q are as defined herein, exhibit activity against infectious pathogens.

Abstract: A heat dissipation device includes a heat sink (10), a fan holder (20) located on the heat sink and a fan (30) mounted on the fan holder. The heat sink includes a plurality of fins (14) extending therefrom and defines two slots (16) in two opposite outmost fins thereof. The fan holder includes two brackets (200) each having a positioning rib (212) engaged in a corresponding slot of the heat sink and resisting the outmost fin to thereby mount the fan holder to the heat sink.

Abstract: Compounds represented by the formula (I), where R1, R2, R3, R4, R5, and Q are as defined herein, exhibit activity against infectious pathogens

Abstract: In one embodiment, a polycide fuse is provided that includes: a polysilicon layer; a silicide layer formed on the polysilicon layer; and a silicon nitride layer formed on the silicide layer by RTCVD, the silicon nitride layer having a relatively low hydrogen concentration and relatively low mechanical stress.

Abstract: Compounds represented by the formula (I), where R1, R2, R3, R4, R5, and Q are as defined herein, exhibit activity against infectious pathogens.