Abstract: A resistor formed in a well adjacent to a transistor serves as a ballast resistor for the transistor. The transistor is formed in a first region on a substrate. The first region is of a first conductivity type. A well of second conductivity type is formed adjacent to the first region. A gate region is formed over a portion of the first region. Concurrently, a covering is formed over a first area of the well. The covering and the gate region are comprised of the same material. Source/drain regions of the second conductivity type are formed on either side of the gate region. The source/drain regions are of the first conductivity type. A first source/drain region extends into the well. Concurrent to the forming of the source drain regions, a doped region is formed within the well. The doped region and the first source/drain region have the same doping density. The doped region is physically separated from the first source/drain region by the first area of the well.

Abstract: A resistor formed in a well adjacent to a transistor serves as a ballast resistor for the transistor. The transistor is formed in a first region on a substrate. The first region is of a first conductivity type. A well of second conductivity type is formed adjacent to the first region. A gate region is formed over a portion of the first region. Concurrently, a covering is formed over a first area of the well. The covering and the gate region are comprised of the same material. Source/drain regions of the second conductivity type are formed on either side of the gate region. The source/drain regions are of the first conductivity type. A first source/drain region extends into the well. Concurrent to the forming of the source drain regions, a doped region is formed within the well. The doped region and the first source/drain region have the same doping density. The doped region is physically separated from the first source/drain region by the first area of the well.

Abstract: Performance degradation resulting from hot carrier stress is determined using a special test circuit. The test circuit is formed using a string of inverters on an integrated circuit. The string of inverters is connected in series. Every other inverter in the string of inverters uses cascaded transistors so that performance of the inverters with cascaded are not degraded by introduced hot carrier stress. For example, odd numbered inverters are each constructed using cascaded PMOSFETs and cascaded NMOSFETs and even numbered inverters are each constructed using a single PMOSFET and a single NMOSFET. On an input of the string of inverters, a first signal is placed which transitions from logic 0 to logic 1. Propagation delay of the first signal through the string of inverters is measured. Also, a second signal which transitions from logic 1 to logic 0 is placed on the input of the string of inverters. Propagation delay of the second signal through the string of inverters is measured.

Abstract: A method for programming a programmable read only memory (PROM) is useful for a PROM which has a source, a drain and a control gate. A DC signal is placed on the control gate. For example, the DC signal has a voltage of approximately 5 volts. An AC signal is placed on the drain. The AC signal, for example, oscillates between approximately 0 volts and 5 volts and has a frequency of at least 100 Megahertz. As a result, charges tunnel through a tunnel oxide region to an floating gate, thus programming the PROM.