Patents by Inventor Chun-Kai Liu
Chun-Kai Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11978678Abstract: A display device includes a first substrate, a light-emitting element, a light conversion layer, and a color filter layer. The light-emitting element is disposed on the first substrate. The light conversion layer is disposed on the light-emitting element. In addition, the color filter layer is overlapped the light-emitting element and the light conversion layer.Type: GrantFiled: August 5, 2022Date of Patent: May 7, 2024Assignee: INNOLUX CORPORATIONInventors: Tung-Kai Liu, Tsau-Hua Hsieh, Wei-Cheng Chu, Chun-Hsien Lin, Chandra Lius, Ting-Kai Hung, Kuan-Feng Lee, Ming-Chang Lin, Tzu-Min Yan, Hui-Chieh Wang
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Patent number: 11362014Abstract: A power module including a circuit board, a chip, a first heat-conduction and insulation substrate and a second heat-conduction and insulation substrate is provided. The circuit board includes a board and a metal block embedded in the board and exposed from a first surface and a second surface of the board opposite to one another. The chip is disposed on a side of the second surface of the board corresponding to the metal block, and the chip is electrically and thermally connected to the metal block. The first heat-conduction and insulation substrate is located on a side of the first surface of the board to be disposed on the circuit board. The second heat-conduction and insulation substrate is electrically and thermally connected to the chip.Type: GrantFiled: May 27, 2020Date of Patent: June 14, 2022Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chun-Kai Liu, Yao-Shun Chen, Po-Kai Chiu
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Publication number: 20210210407Abstract: A power module including a circuit board, a chip, a first heat-conduction and insulation substrate and a second heat-conduction and insulation substrate is provided. The circuit board includes a board and a metal block embedded in the board and exposed from a first surface and a second surface of the board opposite to one another. The chip is disposed on a side of the second surface of the board corresponding to the metal block, and the chip is electrically and thermally connected to the metal block. The first heat-conduction and insulation substrate is located on a side of the first surface of the board to be disposed on the circuit board. The second heat-conduction and insulation substrate is electrically and thermally connected to the chip.Type: ApplicationFiled: May 27, 2020Publication date: July 8, 2021Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chun-Kai LIU, Yao-Shun CHEN, Po-Kai CHIU
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Patent number: 10818574Abstract: A plug-in type power module includes a power unit and a heat-transfer unit vertically disposed on the power unit and extending outwardly away from two sides of the power unit. A first ceramic layer is disposed between the power unit and the heat-transfer unit. Therefore, heat generated by the power unit can be transferred from the first ceramic layer to the heat-transfer unit to increase the speed of heat dissipation. A subsystem having the plug-in type power module is also provided.Type: GrantFiled: May 26, 2020Date of Patent: October 27, 2020Assignee: Industrial Technology Research InstituteInventors: Shu-Jung Yang, Yu-Lin Chao, Chun-Kai Liu, Ming Kaan Liang, Jiin Shing Perng
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Publication number: 20200286808Abstract: A plug-in type power module includes a power unit and a heat-transfer unit vertically disposed on the power unit and extending outwardly away from two sides of the power unit. A first ceramic layer is disposed between the power unit and the heat-transfer unit. Therefore, heat generated by the power unit can be transferred from the first ceramic layer to the heat-transfer unit to increase the speed of heat dissipation. A subsystem having the plug-in type power module is also provided.Type: ApplicationFiled: May 26, 2020Publication date: September 10, 2020Inventors: Shu-Jung Yang, Yu-Lin Chao, Chun-Kai Liu, Ming Kaan Liang, Jiin Shing Perng
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Patent number: 10707143Abstract: A plug-in type power module includes a power unit and a heat-transfer unit vertically disposed on the power unit and extending outwardly away from two sides of the power unit. A first ceramic layer is disposed between the power unit and the heat-transfer unit. Therefore, heat generated by the power unit can be transferred from the first ceramic layer to the heat-transfer unit to increase the speed of heat dissipation. A subsystem having the plug-in type power module is also provided.Type: GrantFiled: May 26, 2017Date of Patent: July 7, 2020Assignee: Industrial Technology Research InstituteInventors: Shu-Jung Yang, Yu-Lin Chao, Chun-Kai Liu, Ming Kaan Liang, Jiin Shing Perng
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Patent number: 10492344Abstract: A power module including a plurality of substrates, a plurality of power devices, and a heat dissipation assembly is provided. The substrates are located on different planes and surround an axis. Each of the substrates extends along the axis. The power devices electrically connected with each other are disposed on the substrates respectively. The heat dissipation assembly is disposed on the substrates and opposite to the power devices. Heat generated from the power devices is transferred to the heat dissipation assembly through the substrates.Type: GrantFiled: September 15, 2017Date of Patent: November 26, 2019Assignee: Industrial Technology Research InstituteInventors: Chun-Kai Liu, Yu-Lin Chao
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Patent number: 10288696Abstract: An intelligent diagnosis system for a power module. The system includes a power module, a hardware checking module and a diagnostic module. The power module has a temperature sensing element for obtaining a temperature difference between a starting minimum temperature and a current temperature. The hardware checking module has a current sensing element, a voltage sensing element and a magnetic coupling closed loop detection element for obtaining the current, the output voltage and the input voltage of the power module, and the hardware loop status, respectively. The diagnostic module calculates the number of cycles that have been operated, a measured impedance and an instantaneous power based on those measurement results, and calculating a risk index based on the number of cycles that have been operated, the temperature difference, the measured impedance, the instantaneous power and the hardware loop status, thereby determining the accumulation of the abnormality index record.Type: GrantFiled: November 16, 2016Date of Patent: May 14, 2019Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chih-Chung Chiu, Chih-Ming Tzeng, Li-Ling Liao, Yu-Lin Chao, Chih-Ming Shen, Ming-Kaan Liang, Chun-Kai Liu, Ming-Ji Dai
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Patent number: 10051742Abstract: A power module and a manufacturing method thereof are provided, and the power module includes a carrier substrate, an interconnection layer, a first chip, a second chip, a ceramic bonding substrate, a top interconnection layer and a lead frame. The interconnection layer is disposed on the carrier substrate. The first chip and the second chip are disposed on the interconnection layer, and electrically connected to the interconnection layer. The ceramic bonding substrate is disposed on the interconnection layer, and is disposed in between the first chip and the second chip so as to separate the first chip from the second chip. The top interconnection layer is disposed on the ceramic bonding substrate, covers the first chip and the second chip, and is electrically connected to the first chip and the second chip. The lead frame is disposed on the top interconnection layer and electrically connected to the top interconnection layer.Type: GrantFiled: December 10, 2015Date of Patent: August 14, 2018Assignee: Industrial Technology Research InstituteInventors: Shu-Jung Yang, Yu-Lin Chao, Heng-Chieh Chien, Chun-Kai Liu
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Publication number: 20180136287Abstract: An intelligent diagnosis system for a power module. The system includes a power module, a hardware checking module and a diagnostic module. The power module has a temperature sensing element for obtaining a temperature difference between a starting minimum temperature and a current temperature. The hardware checking module has a current sensing element, a voltage sensing element and a magnetic coupling closed loop detection element for obtaining the current, the output voltage and the input voltage of the power module, and the hardware loop status, respectively. The diagnostic module calculates the number of cycles that have been operated, a measured impedance and an instantaneous power based on those measurement results, and calculating a risk index based on the number of cycles that have been operated, the temperature difference, the measured impedance, the instantaneous power and the hardware loop status, thereby determining the accumulation of the abnormality index record.Type: ApplicationFiled: November 16, 2016Publication date: May 17, 2018Inventors: Chih-Chung CHIU, Chih-Ming TZENG, Li-Ling LIAO, Yu-Lin CHAO, Chih-Ming SHEN, Ming-Kaan LIANG, Chun-Kai LIU, Ming-Ji DAI
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Patent number: 9915184Abstract: A waste heat exchanger may include an inner tube, an outer tube, a fin assembly and a plurality of heat electric modules The inner tube has a plurality of holes. Disposed inside the inner tube is a plurality of inlet channels and a plurality of outlet channels. The plurality of inlet channels and the plurality of outlet channels are disposed to correspond to each other. The plurality of inlet channels and the plurality of outlet channels are connected to the plurality of holes. A fluid flows through the plurality of inlets and the plurality of holes to get into the outlet channels. The outer tube is disposed outside the inner tube. The conductive assembly is positioned between the inner tube and the outer tube. The conductive assembly is disposed on an outside surface of the inner tube and an inside surface of the outer tube.Type: GrantFiled: December 15, 2014Date of Patent: March 13, 2018Assignee: Industrial Technology Research InstituteInventors: Wei-Kuo Han, Chun-Kai Liu
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Publication number: 20180040798Abstract: A structure of a thermoelectric module including at least one substrate, a thermoelectric device and an insulation protection structure is provided. The thermoelectric device is disposed on the substrate. The insulation protection structure surrounds the thermoelectric device. The thermoelectric device includes at least three electrode plates, first type and second type thermoelectric materials and a diffusion barrier structure. First and second electrode plates among the three electrode plates are disposed on the substrate. The first type thermoelectric material is disposed on the first electrode plate. The second type thermoelectric material is disposed on the second electrode plate. A third electrode plate among the three electrode plates is disposed on the first type and second type thermoelectric materials. The diffusion barrier structure is disposed on two terminals of each of the first type and second type thermoelectric materials.Type: ApplicationFiled: September 30, 2017Publication date: February 8, 2018Applicant: Industrial Technology Research InstituteInventors: Li-Ling Liao, Ming-Ji Dai, Chun-Kai Liu, Cheng-Heng Kao, Cheng-Chieh Li, Jeffrey Snyder, Fivos Drymiotis
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Publication number: 20180007815Abstract: A power module including a plurality of substrates, a plurality of power devices, and a heat dissipation assembly is provided. The substrates are located on different planes and surround an axis. Each of the substrates extends along the axis. The power devices electrically connected with each other are disposed on the substrates respectively. The heat dissipation assembly is disposed on the substrates and opposite to the power devices. Heat generated from the power devices is transferred to the heat dissipation assembly through the substrates.Type: ApplicationFiled: September 15, 2017Publication date: January 4, 2018Applicant: Industrial Technology Research InstituteInventors: Chun-Kai Liu, Yu-Lin Chao
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Publication number: 20170345735Abstract: A plug-in type power module includes a power unit and a heat-transfer unit vertically disposed on the power unit and extending outwardly away from two sides of the power unit. A first ceramic layer is disposed between the power unit and the heat-transfer unit. Therefore, heat generated by the power unit can be transferred from the first ceramic layer to the heat-transfer unit to increase the speed of heat dissipation. A subsystem having the plug-in type power module is also provided.Type: ApplicationFiled: May 26, 2017Publication date: November 30, 2017Inventors: Shu-Jung Yang, Yu-Lin Chao, Chun-Kai Liu, Ming Kaan Liang, Jiin Shing Perng
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Patent number: 9807914Abstract: A power module including a plurality of substrates, a plurality of power devices, and a heat dissipation assembly is provided. The substrates are located on different planes and surround an axis. Each of the substrates extends along the axis. The power devices electrically connected with each other are disposed on the substrates respectively. The heat dissipation assembly is disposed on the substrates and opposite to the power devices. Heat generated from the power devices is transferred to the heat dissipation assembly through the substrates.Type: GrantFiled: July 1, 2015Date of Patent: October 31, 2017Assignee: Industrial Technology Research InstituteInventors: Chun-Kai Liu, Yu-Lin Chao
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Publication number: 20170171978Abstract: A power module and a manufacturing method thereof are provided, and the power module includes a carrier substrate, an interconnection layer, a first chip, a second chip, a ceramic bonding substrate, a top interconnection layer and a lead frame. The interconnection layer is disposed on the carrier substrate. The first chip and the second chip are disposed on the interconnection layer, and electrically connected to the interconnection layer. The ceramic bonding substrate is disposed on the interconnection layer, and is disposed in between the first chip and the second chip so as to separate the first chip from the second chip. The top interconnection layer is disposed on the ceramic bonding substrate, covers the first chip and the second chip, and is electrically connected to the first chip and the second chip. The lead frame is disposed on the top interconnection layer and electrically connected to the top interconnection layer.Type: ApplicationFiled: December 10, 2015Publication date: June 15, 2017Inventors: Shu-Jung Yang, Yu-Lin Chao, Heng-Chieh Chien, Chun-Kai Liu
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Patent number: 9635302Abstract: An active pixel sensor device and the method thereof include an active pixel sensing array and a synchronous reading circuit. The active pixel sensing array is formed by a plurality of sensing pixels disposed in a form of an array. Each sensing pixel has a power terminal. The synchronous reading circuit connects to the power terminals of all sensing pixels, detects a summation of currents flowing through all sensing pixels, converts the summation of currents to an output signal, and outputs the output signal that represents the optical sensing information. In addition to reading each sensing pixel, the active pixel sensor device further controls the synchronous reading circuit to read the output signal corresponding to the summation of currents of all sensing pixels. The active pixel sensor device using the same active pixel sensing array can be applied to large-area sensing.Type: GrantFiled: July 6, 2015Date of Patent: April 25, 2017Assignee: ELAN MICROELECTRONICS CORPORATIONInventors: Po-Hao Wu, Chun-Kai Liu
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Patent number: 9418921Abstract: A power module includes a first substrate, at least two power elements, at least one first conductive structure and at least one leadframe. The first substrate includes a dielectric frame, two first fan-out circuit structure layers and two dielectric plates. The two first fan-out circuit structure layers are respectively disposed on two opposite surfaces of the dielectric frame, the two dielectric plates are respectively disposed on the two first fan-out circuit structure layers, each of the dielectric plates has at least one opening, and the opening and the corresponding first fan-out circuit structure layer form a concavity. The two power elements are respectively embedded in the two concavities. The two power elements are electrically connected to each other through the first conductive structure. The leadframe disposed at the first substrate is electrically connected to the two power elements, and is partially extended outside the first substrate.Type: GrantFiled: December 11, 2015Date of Patent: August 16, 2016Assignee: Industrial Technology Research InstituteInventors: Shu-Jung Yang, Yu-Lin Chao, Heng-Chieh Chien, Chun-Kai Liu
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Publication number: 20160172285Abstract: A power module includes a first substrate, at least two power elements, at least one first conductive structure and at least one leadframe. The first substrate includes a dielectric frame, two first fan-out circuit structure layers and two dielectric plates. The two first fan-out circuit structure layers are respectively disposed on two opposite surfaces of the dielectric frame, the two dielectric plates are respectively disposed on the two first fan-out circuit structure layers, each of the dielectric plates has at least one opening, and the opening and the corresponding first fan-out circuit structure layer form a concavity. The two power elements are respectively embedded in the two concavities. The two power elements are electrically connected to each other through the first conductive structure. The leadframe disposed at the first substrate is electrically connected to the two power elements, and is partially extended outside the first substrate.Type: ApplicationFiled: December 11, 2015Publication date: June 16, 2016Inventors: Shu-Jung Yang, Yu-Lin Chao, Heng-Chieh Chien, Chun-Kai Liu
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Publication number: 20160163950Abstract: A structure of a thermoelectric module including at least one substrate, a thermoelectric device and an insulation protection structure is provided. The thermoelectric device is disposed on the substrate. The insulation protection structure surrounds the thermoelectric device. The thermoelectric device includes at least three electrode plates, first type and second type thermoelectric materials and a diffusion barrier structure. First and second electrode plates among the three electrode plates are disposed on the substrate. The first type thermoelectric material is disposed on the first electrode plate. The second type thermoelectric material is disposed on the second electrode plate. A third electrode plate among the three electrode plates is disposed on the first type and second type thermoelectric materials. The diffusion barrier structure is disposed on two terminals of each of the first type and second type thermoelectric materials.Type: ApplicationFiled: December 8, 2014Publication date: June 9, 2016Inventors: Li-Ling Liao, Ming-Ji Dai, Chun-Kai Liu, Cheng-Heng Kao, Cheng-Chieh Li, Jeffrey Snyder, Fivos Drymiotis