Abstract: A method of fabricating an integral device of a biochip integrated with micro thermo-electric elements and the apparatus thereof is disclosed. The micro thermo-electric biochip includes a micro thermo-electric temperature control unit and a biochip unit, and both of the two units can be manufactured by using the fabricating method. In addition, the biochip unit can be attached to the bottom side of the micro thermo-electric temperature control unit, and it can also be integrated into the micro thermo-electric temperature control unit. Besides, the integral device includes disposable type and non-disposable type.

Abstract: An apparatus for measuring a characteristic and a chip temperature of an LED includes a thermal conductive component. An LED chip is disposed on the thermal conductive component. A temperature control unit is connected to the thermal conductive component for providing a temperature to the thermal conductive component, and therefore providing the temperature to the LED chip via the thermal conductive component. A power-source and voltage-meter unit provides a current to the LED chip, and measures a voltage value of the LED chip. Under a measurement mode, the current is featured with a current waveform having a high current level and a low current level which are alternatively changed, for applying to the LED chip. Measurements are conducted respectively corresponding to the high current level and the low current level, and a correlation curve between the voltage and the temperature can be obtained with the results of measurement.

Abstract: Lighting devices are provided. A lighting device includes a first substrate, a second substrate, a light source and a thermoelectric cooling chip set disposed between the first and second substrates. The first substrate includes a core, a first circuit layer, and a second circuit layer, wherein the first and second circuit layers are disposed on opposite sides of the core. The second substrate comprises a third circuit layer. The light source is disposed on the first substrate and electrically connected to the first circuit layer. The thermoelectric cooling chip set is electrically connected to the second and third circuit layers, to dissipate heat from the light source.

Abstract: A flexible thermoelectric device and a manufacturing method thereof are provided. Flexible substrates are formed by using LIGA process, micro-electro-mechanical process or electroforming technique. The flexible substrates are used to produce thermoelectric device. The structure and the material property of the substrates offer flexible property and tensile property to the thermoelectric device. Thermal transfer enhancement structures such as thermal via or metal diffusion layer are formed on the flexible substrates to overcome the low thermal transfer property of the flexible substrates.

Abstract: An integrated package structure having a solar cell and a thermoelectric element includes a substrate, a first solar cell and a thermoelectric element. The substrate has a first surface. The first solar cell has a second surface, a first electrode disposed on the second surface and a second electrode disposed on the second surface. The second surface faces the first surface. The thermoelectric element has a third electrode and a fourth electrode. The thermoelectric element is disposed between the first surface and the second surface. The first electrode and the second electrode are electrically connected to the third electrode and the fourth electrode respectively. A method of fabricating the integrated package structure having the solar cell and the thermoelectric element is also provided.

Abstract: Lighting devices are provided. A lighting device includes a first substrate, a second substrate, a light source and a thermoelectric cooling chip set disposed between the first and second substrates. The first substrate includes a core, a first circuit layer, and a second circuit layer, wherein the first and second circuit layers are disposed on opposite sides of the core. The second substrate comprises a third circuit layer. The light source is disposed on the first substrate and electrically connected to the first circuit layer. The thermoelectric cooling chip set is electrically connected to the second and third circuit layers, to dissipate heat from the light source.

Abstract: A light emitting diode (LED) package structure including a first substrate, one or more LED chips, a second substrate, and a thermoelectric cooling device is provided. The first substrate has a first surface and a corresponding second surface. The LED chip suitable for emitting a light is arranged on the first surface of the first substrate, and is electrically connected to the first substrate. The second substrate is below the first substrate, and has a third surface and a corresponding fourth surface. The third surface faces the second surface. The thermoelectric cooling device is arranged between the second surface of the first substrate and the third surface of the second substrate for conducting heat generated by the LED chip during operation.

Abstract: A light emitting diode (LED) package structure including a first substrate, an LED chip, a second substrate, and a thermoelectric cooling device is provided. The first substrate has a first surface and a corresponding second surface. The LED chip suitable for emitting a light is arranged on the first surface of the first substrate, and is electrically connected to the first substrate. The second substrate is below the first substrate, and has a third surface and a corresponding fourth surface. The third surface faces the second surface. The thermoelectric cooling device is arranged between the second surface of the first substrate and the third surface of the second substrate for conducting heat generated by the LED chip during operation.

Abstract: The invention discloses an encapsulation comprising a metal substrate, a PCB on the metal substrate, a thermo-electric element in and/or on the PCB, and an LED on the thermo-electric element. Encapsulating methods are also provided by the invention.

Abstract: A light-emitting-diode packaging structure having thermoelectric device, which is applied to the LED unit packaged using the flip chip technology. This is realized by directly building the thermoelectric elements into the solder bump layer of the light-emitting-diode packaging structure to replace a part of the solder bumps, as such raising the heat dissipation efficiency of the light emitting diode unit, enhancing the stability and reliability of light emission of the LED unit, and reducing the difficulties and complexity of the integration of the LED package.

Abstract: A method of fabricating an integral device of a biochip integrated with micro thermoelectric elements and the apparatus thereof is disclosed. The micro thermo-electric biochip includes a micro thermoelectric temperature control unit and a biochip unit, and both of the two units can be manufactured by using the fabricating method. In addition, the biochip unit can be attached to the bottom side of the micro thermo-electric temperature control unit, and it can also be integrated into the micro thermoelectric temperature control unit. Besides, the integral device includes disposable type and non-disposable type.

Abstract: A cooling structure of solid state applied to a heat source has a module of thermoelectric transfer and a module of thermo transfer including two structures of passive cooling connected and attached the module of thermoelectric transfer, respectively. One structure of first structure of passive cooling is near heat source and heat generated by the heat source is transferred to another structure of passive cooling through the one structure passive cooling and the module of thermoelectric transfer when electrical power is employed to the module of thermoelectric transfer.

Abstract: The opto-electrical module packaging installs opto-electrical devices on a conductive leadframe to form an opto-electrical module. The opto-electrical module is then packaged using a molding packaging means, forming a transparent plastic base. The transparent plastic base is installed with a convergent lens to focus light. The leadframe has a plurality of pins and is mounted on the circuit board by soldering. This forms a packaging structure without bare pins exposed to the environment. In addition, the leadframe has a precision alignment structure extending outward as the alignment mechanism when assembled with a fiber connector. The precision packaging procedure provides a precision alignment of the converging lens and the opto-electrical devices at the same time.

Abstract: The present invention discloses a micro thermoelectric device and manufacturing method thereof, and the manufacturing method comprises the steps of providing a substrate and depositing a barrier layer on the substrate, using the barrier layer as a mask to etch a pattern on the barrier layer to form a plurality of openings, adopting a reactive ion etching (RIE) method to remove the barrier layer and smoothing the curvature of the corner of each groove, depositing a metal conductive wire layer, coating an adhesive layer in said each groove by a surface mount technology (SMT), placing a plurality of thermoelectric materials individually into each groove, repeating steps (a) to (f) to produce another substrate, and connecting the two substrates into an aligned position.

Abstract: A passive alignment packaging structure for opto-electrical devices and optic fiber connectors provides a passive alignment packaging structure for opto-electrical devices and optic fiber connectors. The passive alignment packaging is of great benefit to automatic assembly in lowering the manufacturing cost and satisfying the requirement of a precisely aligned optical path. The invention connects the silicon substrate for installing an opto-electrical device to a leadframe by soldering. The surface tension of the melted soldering tin helps self-alignment in the horizontal direction. A guiding pin penetrates through the leadframe and the through hole of a lens support for installing a micro lens set to have vertical alignment. The opto-electrical device, the micro lens set, and the optic fiber connector are thus precisely aligned. The leadframe and the through hole on the lens support have alignment and stress relaxation designs to reduce deformation.

Abstract: The present invention generally relates to optical communication systems, and more particularly, to an apparatus combining microelectromechanical systems (MEMS) elements and optical wavelength division multiplexing/demultiplexing (WDM) elements for optical wavelength selective add/drop application. Wherein, optical fiber arrays or optical planar waveguide arrays are used as the input terminal and the output terminal of multiple optical signals. Moreover, 1×N one-dimensional micro-mirror arrays manufactured by using the MEMS technology are applied to change the transmitting directions of the optical signal of each channel between the input terminals and the output terminals, thus, it achieves the purpose of switching the optical signals from one channel of input terminals to another corresponding channel of output terminals.

Abstract: A three-dimensional stacked heat spreader assembly is provided which includes an upper heat spreader of generally rectangular shape having a first edge portion extending downwardly; a lower heat spreader of generally rectangular shape having a second edge portion extending upwardly; a cavity formed in-between the upper heat spreader and the lower heat spreader by engaging the first edge portion and the second edge portion together adapted for receiving an electronic device.

Abstract: A passive alignment packaging structure for opto-eletrical devices and optic fiber connectors provides a passive alignment packaging structure for opto-electrical devices and optic fiber connectors. The passive alignment packaging is of great benefit to automatic assembly in lowering the manufacturing cost and satisfying the requirement of a precisely aligned optical path. The invention connects the silicon substrate for installing an opto-electrical device to a leadframe by soldering. The surface tension of the melted soldering tin helps self-alignment in the horizontal direction. A guiding pin penetrates through the leadframe and the through hole of a lens support for installing a micro lens set to have vertical alignment. The opto-electrical device, the micro lens set, and the optic fiber connector are thus precisely aligned. The leadframe and the through hole on the lens support have alignment and stress relaxation designs to reduce deformation.

Abstract: The opto-electrical module packaging installs opto-electrical devices on a conductive leadframe to form an opto-electrical module. The opto-electrical module is then packaged using a molding packaging means, forming a transparent plastic base. The transparent plastic base is installed with a convergent lens to focus light. The leadframe has a plurality of pins and is mounted on the circuit board by soldering. This forms a packaging structure without bare pins exposed to the environment. In addition, the leadframe has a precision alignment structure extending outward as the alignment mechanism when assembled with a fiber connector. The precision packaging procedure provides a precision alignment of the converging lens and the opto-electrical devices at the same time.