Abstract: Disclosed is a cooling fluid path structure for a superconducting rotating machine, which includes: a fixed inlet fluid path fixed together with the fluid supply means; a rotating inlet fluid path adjacently connected to an outlet of the fixed inlet fluid path, which is for transferring the cooling fluid transferred from the fixed inlet fluid path to a cooling fluid path inlet provided in the rotor while rotating together with the rotor; a rotating outlet fluid path rotating together with the rotor, to which the cooling fluid discharged from a cooling fluid path outlet of the rotor is transferred; and a fixed outlet fluid path adjacently connected to the rotating outlet fluid path, which is for transferring the cooling fluid transferred from the rotating outlet fluid path to the fluid supply means while being fixed together with the fluid supply means, wherein the rotating outlet fluid path and the fixed outlet fluid path are disposed in such a manner that they surround outside of the rotating inlet fluid pat

Abstract: A method of manufacturing a capacitor-embedded printed circuit board that includes fabricating a capacitor substrate having at least one inner electrode formed on one side of a dielectric layer; aligning a semi-cured insulation layer with one side of a core layer, and aligning the capacitor substrate with the semi-cured insulation layer such that the inner electrode faces the semi-cured insulation layer; and collectively stacking the core layer, the semi-cured insulation layer, and the capacitor substrate.

Abstract: An apparatus for defending a Distributed Denial of Service (DDoS) attack from a mobile terminal is provided. The apparatus includes a monitoring unit, a transmission/non-transmission inquiry unit, and a critical file management unit. The monitoring unit monitors all network data transmitted from a mobile terminal to the outside based on the current mode of the mobile terminal. The transmission/non-transmission inquiry unit asks a user whether to transmit corresponding network data to the outside based on the results of monitoring. The critical file management unit manages a critical file which includes information about at least one protocol used by the mobile terminal and at least one service provided using the protocol.

Abstract: A method of operation of a communication system includes: utilizing an estimation module estimating a log-likelihood ratio for a transmission; and utilizing a slicing module, coupled to the estimation module, slicing a constellation by: reading the log-likelihood ratio from the estimation module, defining a threshold within the constellation, and adjusting the threshold based on the log-likelihood ratio for determining a symbol.

Abstract: A photonic quantum ring (PQR) laser includes an active layer having a multi-quantum-well (MQW) structure and etched lateral face. The active layer is formed to be sandwiched between p-GaN and n-GaN layers epitaxially grown on a reflector disposed over a support substrate. A coating layer is formed over an outside of the lateral faces of the active alyer, and upper electrode is electrically connected to an upper portion of the n-GaN layer, and a distributed Bragg reflector (DBR) is formed over the n-GaN layer and the upper electrode. Accordingly, the PQR laser is capable of oscillating a power-saving vertically dominant 3D multi-mode laser suitable for a low power display device, prevent the light speckle phenomenon, and generate focus-adjusted 3D soft light.

Abstract: Disclosed is a semiconductor light emitting device. The semiconductor light emitting device includes an n-type semiconductor layer, a p-type semiconductor layer, and an active layer disposed therebetween, and a surface plasmon layer disposed between the active layer and at least one of the n-type and p-type semiconductor layers, including metallic particles and an insulating material, and including a conductive via for electrical connection between the active layer and the at least one of the n-type and p-type semiconductor layers, wherein the metallic particles are enclosed by the insulating material to be insulated from the at least one of the n-type and p-type semiconductor layers. The semiconductor light emitting device can achieve enhanced emission efficiency by using surface plasmon resonance. Using the semiconductor light emitting device, the diffusion of a metal employed for surface plasmon resonance into the active layer can be minimized.

Abstract: A printed circuit board with an electronic component embedded printed circuit board and a manufacturing method thereof are disclosed. According to an embodiment of the present invention, the method of manufacturing a printed circuit board with an embedded electronic component having a groove formed on one surface thereof and an electrode formed inside the groove includes: forming a first circuit pattern on one surface of a first metal layer; pressing the first metal layer against a first insulator; forming a first conductive protrusion by selectively etching the other surface of the first metal layer; and mounting a first electronic component by disposing a conductive adhesive layer such that an electrode of the first electronic component and the first conductive protrusion are electrically connected to each other. Thus, an electronic component without its electrode protruded outward can be mounted easily and reliably and the manufacturing time can be shortened.

Abstract: Disclosed herein is a touch panel. A touch panel according to a first preferred embodiment of the present invention includes: a base member; a transparent electrode formed in an active area of the base member; an insulator formed in a bezel area of the base member, and convexly protruded from the base member; and an electrode wiring formed on an exposed surface of the insulator. In addition, a touch panel according to a second preferred embodiment of the present invention includes: a base member having a groove portion formed such that an exposed surface thereof has a concave curved surface; a transparent electrode formed in an active area; and an electrode wire connected to one end or both ends of the transparent electrode and formed on the exposed surface of the groove portion.

Abstract: The present invention relates to the use of an alpha-defensin in the manufacture of a medicament for the treatment, amelioration or prevention of a disease caused by Bacillus anthracis (B anthracis) infection. Furthermore, methods for the treatment of an B. anthracis infection as well as methods of protection against a B. anthracis infection, e.g. a vaccination are described.

Abstract: Disclosed are a semiconductor package and a manufacturing method thereof. The semiconductor package can include a semiconductor substrate, having one surface on which a conductive pad is formed; an insulating layer, being formed on one surface of the semiconductor substrate; a metal post, penetrating through the conductive pad, the semiconductor substrate, and the insulating layer; and an outer-layer circuit, being electrically connected to the metal post. With the present invention, it can become unnecessary to form an additional via for electrically connecting both surfaces of the semiconductor substrate, thereby simplifying the manufacturing process, reducing the manufacturing cost, and improving the coupling reliability.

Abstract: A method of manufacturing a capacitor-embedded printed circuit board, the method including providing a substrate on which a first metal layer, a dielectric layer and an adhesive resin layer are stacked on the order thereof; etching a part of the first metal layer to form a first electrode and a first circuit pattern; compressing a surface of the substrate, on which the first electrode is formed, onto a core board by interposing an insulation resin layer; forming a second electrode and a second circuit pattern on the adhesive resin layer; stacking an insulation board on the substrate such that the second electrode and the second circuit pattern are covered; and forming a third circuit pattern on the insulation board.

Abstract: Disclosed herein is a superconducting field coil of a homopolar type superconducting synchronous machine. The superconducting synchronous machine includes a superconducting field coil which comprises a single or double pancake coil formed by winding a superconducting wire, a core-type rotor which is made of a magnetic material, and an armature winding excited to three phases on a surface of a core of a stator. The field coil of the homopolar type superconducting synchronous machine is not rotated when the machine is in operation. Thus, there is no part for coupling the rotating field coil to a stationary cryo-cooler for cooling a refrigerant, so that the structure is simple, reliability is high, and various cooling methods are available.

Abstract: A capacitor and a method of manufacturing the capacitor are disclosed. The capacitor may include a board, a polymer layer formed on one side of the board, a circuit pattern selectively formed over the polymer layer, and a titania nanosheet corresponding with the circuit pattern. Embodiments of the invention can provide flatness in the board, and allows the copper of the board to maintain its functionality as an electrode while increasing the adhesion to the titania nanosheet. The titania nanosheet may thus be implemented on a patterned board in a desired shape, number of layers, and thickness.

Abstract: Disclosed herein is a resistive type touch panel according to a preferred embodiment of the present invention. The resistive type touch panel includes a transparent substrate; a transparent electrode formed on one surface of the transparent substrate and made of a conductive polymer; and a plurality of conductive balls formed on the transparent electrode and having conductivity. According to the present invention, the conductive balls are included in the transparent electrode made of the conductive polymer to improve the conductivity of the transparent electrode and the conductive balls are formed on the transparent electrode at a predetermined interval, thereby making it possible to constantly maintain the thickness of the transparent electrode. Further, the conductive balls are formed on the transparent electrode to reduce the contact resistance value generated when the resistive type touch panel is touched, thereby making it possible to improve the reliability of the operation of the touch panel.

Abstract: A method and apparatus for joint noise and echo cancellation of a two microphone system subject to cross-talk. The method includes estimating the reference output by removing the cross-talk and the estimated echo from the reference channel, when an echo is detected in the reference echo signal, adapting filters H13 and H23 by NLMS, when the estimated primary output includes speech, adapting filters H12 and H21 by de-correlation, when neither echo nor speech is detected, adapting filter H12 is adapted by NLMS, obtaining the primary output and the reference output by post-filtering of the estimated primary output and the estimated reference output, respectively, and utilizing the primary output and the reference output for canceling the echo and noise of a two microphone system subject to cross-talk.

Abstract: A nitride semiconductor light emitting device, and a method of manufacturing the same are disclosed. The nitride semiconductor light emitting device includes a substrate, an n-type nitride semiconductor layer disposed on the substrate and including a plurality of V-shaped pits in a top surface thereof, an active layer disposed on the n-type nitride semiconductor layer and including depressions conforming to the shape of the plurality of V-shaped pits, and a p-type nitride semiconductor layer disposed on the active layer and including a plurality of protrusions on a top surface thereof. Since the plurality of V-shaped pits are formed in the top surface of the n-type nitride semiconductor layer, the protrusions can be formed on the p-type nitride semiconductor layer as an in-situ process. Accordingly, the resistance to ESD, and light extraction efficiency are enhanced.

Abstract: A printed circuit board with an electronic component embedded printed circuit board and a manufacturing method thereof are disclosed. According to an embodiment of the present invention, the method of manufacturing a printed circuit board with an embedded electronic component having a groove formed on one surface thereof and an electrode formed inside the groove includes: forming a first circuit pattern on one surface of a first metal layer; pressing the first metal layer against a first insulator; forming a first conductive protrusion by selectively etching the other surface of the first metal layer; and mounting a first electronic component by disposing a conductive adhesive layer such that an electrode of the first electronic component and the first conductive protrusion are electrically connected to each other. Thus, an electronic component without its electrode protruded outward can be mounted easily and reliably and the manufacturing time can be shortened.

Abstract: The present invention relates to a GaN based nitride based light emitting device improved in Electrostatic Discharge (ESD) tolerance (withstanding property) and a method for fabricating the same including a substrate and a V-shaped distortion structure made of an n-type nitride semiconductor layer, an active layer and a p-type nitride semiconductor layer on the substrate and formed with reference to the n-type nitride semiconductor layer.

Abstract: Disclosed herein are conductive film including: a base member; N transparent electrodes formed on one surface of the base member, the N transparent electrodes being arranged in a second direction of the base member, while being extended in a first direction of the base member; and electrode wirings each correspondingly connected to one end or both ends of the N transparent electrodes and including wiring portions configured of a plurality of wirings extended in a third direction of the base member and bent and extended in the second direction of the base member and insulating portions having the wiring portions impregnated therein and formed on an upper surface of one side or both sides of the transparent electrode and a manufacturing method thereof. Accordingly, the plurality of wirings are formed in a three-dimensional shape vertically in the insulating portion rather than a plane of the base member, making it possible to reduce the area of a non-display region due to the electrode wirings.

Abstract: Disclosed herein are a touch panel and a method of manufacturing the same. The touch panel 100 according to the present invention includes a transparent substrate 110; a discoloring layer 120 formed on one surface of the transparent substrate 110; and a transparent electrode 130 formed on the discoloring layer 120, wherein the transparent electrode 130 is patterned to have an opening 135 and the discoloring layer 120 selectively discolors only the portion 125 corresponding to the opening 135 into color corresponding to the transparent electrode 130. The present invention uses the discoloring layer 120 discolored into color corresponding to the transparent electrode 130 to prevent the recognition of the patterned transparent electrode 130 by a user, thereby making it possible to the improve visibility of the touch panel 100.