Abstract: A laptop computer including a circuit board, a connector, and a fan is provided. The circuit board has a plurality of first electrically conducting members. The connector has a body and a plurality of clamping terminals and pogo pin terminals extended from the body. The clamping terminals and the pogo pin terminals are electrically connected to each other and located at two opposite sides of the body. The clamping terminals clamp the circuit board and are electrically connected to the first electrically conductive members. The fan has a plurality of second electrically conducting members, and the pogo pin terminals are respectively abutted against abutting surfaces of the second electrically conducting members, such that the circuit board is electrically connected to the fan via the connector, wherein each of the abutting surfaces is tilted relative to a plane where the pogo pin terminals are arranged.

Abstract: The image device includes a plurality of micro-lens sets and an imaging device. The micro-lens sets are arranged in an array. The micro-lens sets receive a display image and respectively generate a plurality of image beams. Transmission directions of the image beams are not parallel to each other. The imaging device receives the image beams, focuses the image beams to respectively generate a plurality of image beams, and projects the image beams to a target zone, so that each of the image beams is imaged in the target zone.

Abstract: A laptop computer including a first casing, a first sub-circuit board, an input module, a second casing, a motherboard, and a bridge circuit board is provided. The first sub-circuit board is disposed at the first casing. The input module is disposed at the first casing and electrically connected to the first sub-circuit board. The motherboard is disposed at the second casing. The first casing and the second casing are assembled together, such that the first sub-circuit board, the bridge circuit board, and the motherboard are partially overlapped, and the first sub-circuit board is electrically connected to the motherboard via the bridge circuit board.

Abstract: A laptop computer including a first body, a circuit board disposed in the first body, a second body, a display module disposed in the second body, a hinge connected to the first and the second bodies, and a mezzanine connector is provided. The first and the second bodies are pivoted to each other to be folded or unfolded via the hinge. The mezzanine connector is clamped between the hinge and the circuit board, and is electrically connected between the display module and the circuit board.

Abstract: Disclosed is a positioning device for a woodworking milling machine, which is designed to mount the machine on a track device. The positioning device has a mounting platform, a guide sleeve assembly, guide columns, a drive unit, and a lead screw. The mounting platform includes a base plate with a through hole slightly larger than the spindle head to allow the spindle head to pass through the through hole. The guide sleeve assembly is connected to the spindle head, while the guide columns are connected to the base plate and extend upwardly, pivotally passing through the guide sleeve assembly. The drive unit is connected to the mounting platform and drives the lead screw to rotate. The lead screw is parallel to the guide columns and threaded through the guide sleeve assembly to enable the guide sleeve assembly to move the spindle head vertically.

Abstract: A laptop computer including a casing, an inner frame, and a plurality of electronic modules is provided. The inner frame is detachably assembled to the casing and forms a plurality of receiving zones separated from each other. The electronic modules are respectively disposed in the receiving zones and connected to each other via a plurality of flexible electrical conducting members, and the electrical conducting members pass through a recess structure of the inner frame.

Abstract: An image display device including a first lens set, a diffractive optical element (DOE), a second lens set and a coupler. The first lens receives a display image, and converts the display image into multiple image beams parallel to each other. The diffractive optical element receives the image beams, diffracts the image beams and generate multiple image sub-beams. The second lens set receives each of the image sub-beams corresponding to each of the image beams. The second lens set provides a focus length, and focuses the image sub-beams according to the focus length to generate multiple zoomed image sub-beams corresponding to each of the image beams. The coupler receives the zoomed image sub-beams, reflects the zoomed image sub-beams to a target plane, and causes the zoomed image sub-beams to form multiple image imaging points on the target plane.

Abstract: A continuous plasma processing system with adjustable electrode includes a frame shape carrier plate for holding a to-be-processed object, a loading chamber for inputting the to-be-processed object, a processing chamber, and an unloading chamber for outputting the finished object. The processing chamber has a first electrode, a second electrode, and a moving device controlling the second electrode to move between an electrically disconnected position and an electrically conducted position. When the second electrode is away from the first electrode and does not contact the to-be-processed object, the second electrode is at the electrically disconnected position. When the second electrode moves toward the first electrode to push the to-be-processed object to leave the frame shape carrier plate, the second electrode is at the electrically conducted position. The plasma electric field is prevented from being affected by particles on the carrier plate.

Abstract: Some embodiments relate to a method that includes depositing a first layer of hard mask material over a layer of dielectric material; etching the first layer of the hard mask material, the etched first layer of hard mask material including an etched portion having a first lateral dimension; depositing a second layer of the hard mask material over the first layer of the hard mask material; etching at least a portion of the second layer of the hard mask material, while allowing a remaining portion of the hard mask material, to expose a portion of the layer of the dielectric material that has a second lateral dimension less than the first lateral dimension; and etching a trench into the layer of the dielectric material at the exposed portion of the layer of the dielectric material.

Abstract: A two-electrode continuous plasma processing system includes a processing chamber having a clamping device, a moving device, a first and a second electrodes, and a first and a second radio frequency power sources. When an object moves into a processing space of the processing chamber, the moving device controls the second electrode to drive the object to move toward the first electrode, and actuates the second electrode and the clamping device to clamp and fix the object. The first radio frequency power source provides the first electrode with a first radio frequency energy to control the density of plasma. The second radio frequency power source provides the second electrode with a second radio frequency energy to control the ion energy of the plasma. Therefore, the plasma is efficiently stabilized, lowering the probability of object damage.

Abstract: A method of operating a computing system comprises defining a zoned namespace for non-volatile memory (NVM) of a memory device of the computing system, the zoned namespace including multiple NVM zones of multiple non-overlapping logical block addresses (LBAs) of the NVM, mapping persistence logging (PLOG) identifiers (IDs) to the NVM zones, a PLOG ID identifying a PLOG zone of one or more NVM zones, and performing a PLOG-specific access operation on a PLOG zone of the NVM in response to a PLOG-specific command received from a host device of the computing system.

Abstract: A manufacturing method of a semiconductor device includes at least the following steps. A sacrificial substrate is provided. An epitaxial layer is formed on the sacrificial substrate. An etch stop layer is formed on the epitaxial layer. Carbon atoms are implanted into the etch stop layer. A capping layer and a device layer are formed on the etch stop layer. A handle substrate is bonded to the device layer. The sacrificial substrate, the epitaxial layer, and the etch stop layer having the carbon atoms are removed from the handle substrate.

Abstract: This disclosure provides data processing methods, apparatuses, and systems. In an implementation, a method comprises receiving, by a first data processing unit (DPU), a memory allocation request from a first service process in a computing node that comprises the first DPU, wherein the first DPU stores memory address assignment information that indicates a virtual memory address corresponding to a physical memory allocated by a storage node to the computing node. Determining, by the first DPU based on the memory address assignment information and in the virtual memory address corresponding to the physical memory allocated by the storage node to the computing node, a virtual memory address range assigned to the first service process, and when the first DPU receives a data storage request from the first service process, sending, by the first DPU, a write data request to the second DPU over a communication link between the first DPU and the second DPU.

Abstract: In some embodiments, a method for forming a semiconductor device is provided. The method includes etching a substrate to form a recess within a surface of the substrate. An epitaxial material is formed within the recess, a capping structure is formed on the epitaxial material, and a capping layer is formed onto the capping structure. The capping layer laterally extends past an outermost sidewall of the capping structure. Dopants are implanted into the epitaxial material. Implanting the dopants into the epitaxial material forms a first doped region having a first doping type and a second doped region having a second doping type.

Abstract: A semiconductor package includes a conductive pillar and a solder. The conductive pillar has a first sidewall and a second sidewall opposite to the first sidewall, wherein a height of the first sidewall is greater than a height of the second sidewall. The solder is disposed on and in direct contact with the conductive pillar, wherein the solder is hanging over the first sidewall and the second sidewall of conductive pillar.

Abstract: A computer vision processing system is provided. The system includes one or more target devices and a processing unit. The target devices are configured to run the executable code of an image processing pipeline. The processing unit is configured to receive a series of application programming interface (API) calls and create a raw graph accordingly, redraw the raw graph into a compilable graph by sequentially processing each node, and compile the compilable graph into the executable code of the image processing pipeline. The series of API calls includes at least one tiling API call to set at least one of the nodes and at least one of the data objects as tileable. Each tileable node corresponds to multiple parallel processing nodes in multiple branches in the compilable graph, and each tileable data object corresponds to multiple tile data objects in the branches in the compilable graph.

Abstract: A harvesting assembly for harvesting a tissue graft from surrounding tissue is disclosed including a guide. The guide includes a means for fixedly engaging with an anterior surface of the tendon. The guide also includes a means of guiding a cutting blade along a preferred trajectory into and along a length of the tendon. The guide also includes a means of guiding a truncating blade along a preferred trajectory across a width of tendon. The cutting blade may include two parallel blades for forming lateral sides of the tendon graft simultaneously. Each of the two parallel blades may define a leading edge that extends along at least a 90 degree arc that is equidistant from a stop on the cutting blade. The stop in combination with the guide may limit a cut depth into the tendon for a range of cutting blade handle elevation angles.

Abstract: An image display device including a first optical element, multiple microlens arrays and a second optical element is provided. The first optical element receives a display image and generates multiple image beams parallel to each other. The microlens arrays respectively receive the image beams, deflect the image beams to generate multiple first light beams, and focuses the first light beams on a first focusing plane. The second optical element is disposed between the first focusing plane and a target area, receives the first light beams, deflects the first light beams to generate multiple second light beams, focuses the second light beams on a second focusing plane, and projects the second light beams to focus on the target area.

Abstract: A frequency selective coupler configured as a harmonic rejection filter includes an electromagnetic element configured to electromagnetically couple to a signal path between an output of a power amplifier and an antenna, an impedance network coupled between an isolated port of the coupler and ground, the impedance network configured to provide a harmonic filter response, and an electrically unconnected coupled port connected to the electromagnetic element.