Abstract: A first and second patterned circuit layer are formed on a first surface and a second surface of a base material. A first adhesive layer is formed on the first patterned circuit layer. A portion of the first surface is exposed by the first patterned circuit layer. The metal reflection layer covers the first insulation layer and a reflectance thereof is greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer, and the first adhesive layer is disposed between the first patterned circuit layer and the first insulation layer. A transparent adhesive layer and a protection layer are formed on the metal reflection layer. The transparent adhesive layer is disposed between the metal reflection layer and the protection layer. The protection layer comprises a transparent polymer. The light transmittance is greater than or equal to 80%.

Abstract: Various embodiments of the present disclosure are directed towards a sensor device comprising a photodetector with a simplified manufacturing process. A semiconductor substrate comprises an avalanche region at which a p-type region and an n-type region form a PN junction. An inner absorption layer is recessed into the semiconductor substrate, wherein the inner absorption layer has a bottom protrusion protruding towards the avalanche region. A peripheral absorption layer is on a sidewall of the inner absorption layer and a bottom of the inner absorption layer and further extends from the sidewall to the bottom protrusion. The inner absorption layer and the peripheral absorption layer share a common semiconductor material and have a smaller bandgap than the semiconductor substrate. Further, the peripheral absorption layer has a doping concentration that is elevated relative to a doping concentration of the inner absorption layer.

Abstract: Apparatuses, systems, and techniques are presented to generate digital content. In at least one embodiment, one or more neural networks are used to generate video information based at least in part upon voice information and a combination of image features and facial landmarks corresponding to one or more images of a person.

Abstract: A semiconductor device includes a first metal layer, a second metal layer, and an inter-metal dielectric layer disposed between the first metal layer and the second metal layer. The inter-metal dielectric layer includes: a first dielectric layer disposed on the first metal layer and in direct contact with the first metal layer, wherein the first dielectric layer has a stress value less than 0; a second dielectric layer disposed on the first dielectric layer, wherein the second dielectric layer has a stress value greater than 0; and a third dielectric layer disposed on the second dielectric layer, wherein the third dielectric layer has a stress value less than 0. A thickness of the third dielectric layer is greater than a thickness of the second dielectric layer, and the thickness of the second dielectric layer is greater than a thickness of the first dielectric layer.

Abstract: A light-emitting diode LED driver and a LED driving device including the LED driver are provided. The light-emitting diode LED driver includes a decoding circuit that receives a data signal and decodes the data signal to generate display data used to drive LEDs to emit light and display and a recovered clock signal. Further provided is an encoding circuit that encodes the decoded display data by using the recovered clock signal to generate an encoded data signal, where the data signal is encoded in a first encoding format, and the encoded data signal is encoded in a second encoding format.

Abstract: A light emitting device includes an epitaxial structure and first and second electrodes on a side of the epitaxial structure. The epitaxial structure includes a first-type semiconductor layer, an active layer, and a second-type semiconductor layer. The active layer is disposed between the first-type semiconductor layer and the second-type semiconductor layer. The first electrode is disposed on the epitaxial structure to be electrically connected with the first-type semiconductor layer. The second electrode is disposed on the epitaxial structure to be electrically connected with the second-type semiconductor layer. The second electrode is in ohmic contact with a second-type window sublayer of the second-type semiconductor layer.

Abstract: This disclosure discloses an optical sensing device. The device includes a carrier body; a first light-emitting device disposed on the carrier body; and a light-receiving device including a group III-V semiconductor material disposed on the carrier body, including a light-receiving surface having an area, wherein the light-receiving device is capable of receiving a first received wavelength having a largest external quantum efficiency so the ratio of the largest external quantum efficiency to the area is ?13.

Abstract: A semiconductor package includes a conductive pillar and a solder. The conductive pillar has a first sidewall and a second sidewall opposite to the first sidewall, wherein a height of the first sidewall is greater than a height of the second sidewall. The solder is disposed on and in direct contact with the conductive pillar, wherein the solder is hanging over the first sidewall and the second sidewall of conductive pillar.

Abstract: The present disclosure relates to an integrated chip. The integrated chip includes a substrate having a first semiconductor material. A second semiconductor material is disposed on the first semiconductor material and a passivation layer is disposed on the second semiconductor material. A first doped region and a second doped region extend through the passivation layer and into the second semiconductor material. A silicide is arranged within the passivation layer and along tops of the first doped region and the second doped region.

Abstract: A waterproof electrical connector includes a connector body and a waterproof cap. The connector body includes a mating island surrounded by a ring groove. The mating island defines a mating face and plural passageways. The passageways receive conductive terminals and penetrate through the mating face. A soft cushion is set inside the waterproof cap. The connector body includes a collar portion. The collar portion is higher than the mating face and forms an entrance cavity around the ring groove. When the cap covers the connector body, the soft cushion penetrates into the entrance cavity to press and seal the mating face.

Abstract: The present invention relates to a platform door control apparatus based on a double 2-vote-2 architecture, including a security communication and logic processing module, a driver collection module, and a maintenance module, the security communication and logic processing module is separately connected to the driver collection module and the maintenance module, and both the security communication and logic processing module and the driver collection module are devices using the double 2-vote-2 architecture. Compared with the prior art, the present invention has the following advantages of effectively improving linkage efficiency of a signal system and a platform door system, and the like.

Abstract: A technique includes displaying, by a computer using a graphical interface, a map of a geographical area, where the map includes political boundaries. The technique includes displaying, by the computer, graphical images on the map representing a plurality of aspects that are associated with the management of a plurality of projects as corresponding geographical features on the map. The technique includes graphically segregating, by the computer, the plurality of projects on the map using the political boundaries; receiving input, via interaction with the displayed map; and changing, by the computer, in response to the interaction, how a given aspect of the plurality of aspects of a given project of the plurality of projects is represented on the map.

Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.

Abstract: A quantum dot composite structure and a method for forming the same are provided. The quantum dot composite structure includes: a glass particle including a glass matrix and a plurality of quantum dots located in the glass matrix, wherein at least one of the plurality of quantum dots includes an exposed surface in the glass matrix; and an inorganic protective layer disposed on the glass particle and covering the exposed surface.

Abstract: A computer-implemented system for identifying a patient for a trial may include at least one processor. The at least one processor may be programmed to receive an indication of a selected trial, the selected trial being associated with a testing status criterion; access a plurality of patient records associated with a patient of a plurality of patients; determine, using a machine learning model and based on unstructured information from one at least one of the patient records, a likelihood of an occurrence of genomic testing for the patient; determine a genomic testing status of the patient based on the determined likelihood of the occurrence of genomic testing; determine that the genomic testing status satisfies the testing status criterion; and include the patient in a subset of the plurality of patients based on the genomic testing status satisfying the testing status criterion.

Abstract: Devices and methods are provided for controlling dead-time of a direct current to direct current (DC-DC) converter. A control circuit includes a first transistor having a source/drain terminal coupled to an output voltage of the DC-DC converter configured to provide current based on the output voltage. The control circuit also includes a digital up/down counter having an output terminal electrically coupled to an input terminal of a delay cell of the DC-DC converter. A current sensing circuit of the control circuit is electrically coupled to an input terminal of the digital up/down counter configured to receive the current and drive the digital up/down counter based on the current.

Abstract: Piston mode Lamb wave resonators are disclosed. A piston mode Lamb wave resonator can include a piezoelectric layer, such as an aluminum nitride layer, and an interdigital transducer on the piezoelectric layer. The piston mode Lamb wave resonator has an active region and a border region, in which the border region has a velocity with a lower magnitude than a velocity of the active region. The border region can suppress a transverse mode.

Abstract: The present disclosure provides a speaker diaphragm and a speaker. The diaphragm includes a thermoplastic polyester elastomer film layer, a thermoplastic polyester elastomer being a copolymer composed of a hard segment A of polyester and a soft segment B of polyether or aliphatic polyester, wherein the thermoplastic polyester elastomer film layer has Young's modulus of 1-1000 MPa, with an elastic recovery rate after 10% strain being greater than or equal to 80%. The speaker diaphragm has a good stiffness, a good damping performance and a good resilience.

Abstract: A physiological signal measurement system, a physiological signal measurement method, and a mobile device protective case are provided. The physiological signal measurement system includes a first electrode, a second electrode, a reference electrode, an impedance front-end circuit module and a dynamic signal matching module. The first electrode, the second electrode and the reference electrode are used to obtain a first sensing signal and a second sensing signal. The impedance front-end circuit module is used to detect a first impedance of the first electrode and a second impedance of the second electrode, and obtain an original differential signal according to the first sensing signal and the second sensing signal. The dynamic signal matching module is used to obtain a calibration sequence according to the first impedance, the second impedance and the original differential signal, and obtain a compensated calibration sequence according to the calibration sequence and the original differential signal.

Abstract: Disclosed are a vibrating diaphragm of a sound-producing apparatus and the sound-producing apparatus. The vibrating diaphragm includes at least one elastomer layer, wherein the elastomer layer is made of butadiene rubber; the butadiene rubber is any one of nickel butadiene rubber, rare earth butadiene rubber and cobalt butadiene rubber, and a content of cis-form is greater than 80% to 100%. The vibrating diaphragm of the present disclosure can maintain excellent acoustic performance under extreme conditions of low temperature. (FIG.