Abstract: A communication system, a communication method and a positioning device for a frequency management system are provided. The communication system includes at least one positioning device and one or more network devices. The at least one positioning device is configured to generate and broadcast location information. The one or more network devices are configured to receive the location information. The one or more network devices are configured to perform a frequency communication process with the frequency management system by using the received location information as current location information of the one or more network devices.

Abstract: Techniques for storing metadata involve: storing first metadata associated with a system operation in a volatile memory of a storage system while the storage system is in a startup stage. The storage system does not perform read/write requests of a client during the startup stage. Such techniques further involve: suspending the system operation of the storage system during the startup stage in response to determining that the intermediate persistent storage device has failed. Such techniques further involve: storing the first metadata in the volatile memory into the persistent storage device. Such techniques further involve: storing the first metadata into the intermediate persistent storage device in response to determining that the intermediate persistent storage device is available again. Accordingly, the risk of losing metadata when the storage device is powered down can be reduced.

Abstract: An manufacturing method of an electronic device includes: providing a first substrate and a second substrate; attaching an adhesive member onto the first substrate; and performing a curve attaching step, so that the first substrate and the second substrate are attached to each other through the adhesive member to form a curved composite component, wherein the curve attaching step is performed at a temperature of 20 degrees Celsius to 160 degrees Celsius.

Abstract: The present invention discloses a coating device including: a first shell, having a top portion and a side portion; and a second shell, accommodated in the first shell and at least partially divergently extending downwards from the top portion of the first shell. The first shell and the second shell define a first space in between, the second shell defines a second space, and the first space surrounds the second space and the two are not in communication.

Abstract: A semiconductor structure comprises a plurality of gate structures alternately stacked with a plurality of channel layers, and a plurality of spacers disposed on lateral sides of the plurality of gate structures. The respective ones of the plurality of spacers comprise a profile having a first portion comprising a first shape and a second portion comprising a second shape, wherein the first shape is different from the second shape.

Abstract: The present invention relates to the use of a medicament in treatment of a tumor disease. In particular, the present invention provides the use of a biologically active conjugate represented by formula (I) in treatment of a tumor disease. The tumor disease particularly and preferably refers to an unresectable locally advanced or metastatic solid tumor that is refractory according to existing treatment standards, including but not limited to breast cancer, gastric cancer, lung cancer, ovarian cancer, urinary tract epithelial cancer, esophageal cancer, liver cancer, colorectal cancer, cervical cancer, endometrial cancer, pancreatic cancer, and brain tumor.

Abstract: Techniques and systems are provided for improving one or more image capture operations. In some examples, a system determines, based on data from one or more sensors, a movement of an image capture device associated with a capture of a plurality of image frames. The systems adjust a position of at least one object in each of the plurality of image frames based on the movement of the image capture device. The system determines a motion of the at least one object based on a difference in the adjusted position among the plurality of image frames. The system selects a value for at least one image capture parameter associated with the plurality of image frames based on the motion of the at least one object.

Abstract: A molding method of a support rod that first passing a plurality of long fibers through a resin bath for impregnating with resin, then passing the plurality of long fibers impregnated with resin through a bundling hole of a position-constrained vertical plate on a machine to preliminarily form a bundle end; providing a coating layer on the machine, one end of the coating layer obliquely passes through a guiding portion on the position-constrained vertical plate to downwardly contact the bundle end; then placing the one end of the coating layer and the bundle end into a mold cavity of a mold at the same time to form a long rod body; and then cutting the long rod body into multi-segment support rods through a cutting process.

Abstract: A hinge mechanism is provided, including a connecting unit, a hinge unit, and a locking element. The connecting unit has a connecting member and a tubular member. The tubular member is disposed on the connecting member. The hinge unit has a first member, a second member, a shaft, and a rod. The shaft pivotally connects the first member to the second member. The rod is affixed to the second member. The rod extends into the tubular member and has a slot. The locking element is fastened through the tubular member and joined in the slot.

Abstract: A multi-link operation method is provided. The multi-link operation method may be applied to an apparatus. The multi-link operation method may include the following steps. The apparatus may establish a plurality of links with an access point (AP). Then, the apparatus may transmit a reconfiguration request to the AP to add at least one new link to the plurality of links and/or delete at least one link from the plurality of links. Then, the apparatus may receive a reconfiguration response associated with the reconfiguration request from the AP.

Abstract: A data processing method in a distributed system is provided. The method includes: A management node splits a to-be-processed data processing request into a map task and a reduce task. A first worker node executes the map task, and writes intermediate data obtained by executing the map task into a shared storage area. The intermediate data is divided into a plurality of partitions based on a quantity of second worker nodes. Each partition belongs to one second worker node. An aggregation node stores, in a centralized manner, intermediate data that belongs to a same partition in the shared storage area. The second worker node obtains intermediate data of a corresponding partition to execute the reduce task.

Abstract: A photo-detecting device includes a first semiconductor layer, a second semiconductor layer located on the first semiconductor layer, a light-absorbing layer located between the first semiconductor layer and the second semiconductor layer, an insulating layer located on the second semiconductor layer, and an electrode structure located on the insulating layer. The second semiconductor layer includes a first region having a first conductivity-type and a second region having a second conductivity-type different from the first conductivity-type. The first region is surrounded by the second region, and includes a geometric center and an interface between the first region and the second region. The insulating layer covers the first region and the second region. The electrode structure includes an outer sidewall located on the second region. In a top view, the interface is located between the geometric center and the outer sidewall.

Abstract: An electrostatic discharge protection device is provided. The electrostatic discharge protection device includes first and second N-type and P-type and third P-type doped regions in the first and second N-type well regions in a P-type semiconductor substrate. First and second P-type well regions are in the first N-type well region. Third N-type, fourth P-type and N-type and fifth P-type doped regions are in the first and second P-type well regions. Fifth N-type and sixth P-type doped regions are in the third P-type well region in the second N-type well region. The first and second N-type doped regions are directly electrically connected to the fifth and sixth P-type doped regions, respectively. The first P-type and fifth N-type, the second P-type and third N-type, and the third P-type doped region and the fourth N-type and P-type doped regions are electrically connected to input/output, power supply and ground terminals.

Abstract: A semiconductor device including a semiconductor die, a first conductive pad, a second conductive pad, a first connector structure and a second connector structure is provided. The first conductive pad is disposed on the semiconductor die, wherein the first conductive pad has a first lateral dimension. The second conductive pad is disposed on the semiconductor die, wherein the second conductive pad has a second lateral dimension. The first connector structure is disposed on the first conductive pad, wherein the first connector structure has a third lateral dimension greater than the first lateral dimension. The second connector structure is disposed on the second conductive pad, wherein the second connector structure has a fourth lateral dimension smaller than the second lateral dimension.

Abstract: A dual-mode Bluetooth terminal configured to receive a first input from a user, send a first BLE pairing advertisement message in response to the first input, where an address type in the first BLE pairing advertisement message is public, an advertisement address in the first BLE pairing advertisement message is a fixed advertisement address, and the first BLE pairing advertisement message carries an identifier used to indicate that the first dual-mode Bluetooth terminal does not support bit rate/enhanced data rate (BR/EDR), receive a second input from the user, enter a conventional Bluetooth discoverable mode in response to the second input, receive a paging message, and send a paging response in response to the paging message, where the paging response carries a media access control (MAC) address of the first dual-mode Bluetooth terminal, and the first input is different from the second input.

Abstract: Methods and devices for tissue fixation. A cortical button with a rib between two slotted openings. The rib increases the cortical button structural rigidity without increasing palpability. An adjustable loop construct with two discrete locking passages that provides manageable loop reduction and improved tissue coupling. The adjustable loop construct may be coupled to tissue via a passing construct. An assembly with a reduction bar, a button and an adjustable loop construct, the assembly provided assembled in a first configuration that disassembles to guide steps of tissue fixation. The reduction bar may be assembled to the reduction bar for reducing the adjustable loop construct.

Abstract: An apparatus comprising: a first plurality of inputs representing an activation input vector; a second plurality of inputs representing a weight input vector; an analog multiplier-and-accumulator to generate a first analog voltage representing a first multiply-and-accumulate result for the said first inputs and the second inputs; a voltage multiplier that takes the said first analog voltage and produces a second analog voltage representing, a second multiply-and-accumulate result by multiplying at least one scaling factor to the first analog voltage; an analog to digital converter configured to convert the said second analog voltage multiply-and-accumulate result into a digital signal using a limited-precision operation during a neural network inference operation; and a hardware controller configured to determine the at least one scaling factor based on the first multiply-and-accumulate result, or a software controller configured to determine the at least one scaling factor based on the first multiply-and-acc

Abstract: A handle (200) for use with a power tool (100) having a coupling portion (204) and a gripping portion (206). a connector (228) for connecting the gripping portion (206) to the coupling portion (204), and a resilient deformable member (256) provided with and extended along the gripping portion (206). The coupling portion (204) is configured to detachably couple the handle (200) to the power tool (100). The gripping portion (206) is in connection with the coupling portion (204) for gripping by a user. The resilient deformable member (256) and the gripping portion (206) are integrated along length for simultaneous deformation.

Abstract: A manufacturing method of a semiconductor device includes at least the following steps. A sacrificial substrate is provided. An etch stop layer is formed on the sacrificial substrate. A portion of the etch stop layer is oxidized to form an oxide layer between the sacrificial substrate and the remaining etch stop layer. A capping layer is formed on the remaining etch stop layer. A device layer is formed on the capping layer. A first etching process is performed to remove the sacrificial substrate. A second etching process is performed to remove the oxide layer. A third etching process is performed to remove the remaining etch stop layer. A power rail is formed on the capping layer opposite to the device layer.

Abstract: A semiconductor device and a method of forming the same are provided. The semiconductor device includes a die structure including a plurality of die regions and a plurality of first seal rings. Each of the plurality of first seal rings surrounds a corresponding die region of the plurality of die regions. The semiconductor device further includes a second seal ring surrounding the plurality of first seal rings and a plurality of connectors bonded to the die structure. Each of the plurality of connectors has an elongated plan-view shape. A long axis of the elongated plan-view shape of each of the plurality of connectors is oriented toward a center of the die structure.