Abstract: A thin heat pipe structure includes a main body having a chamber. The chamber has a wick structure and a working fluid provided therein, and internally defines an evaporating section and at least one condensing section. The condensing section is extended towards at least one or two ends of the evaporating section. The wick structure is provided with at least one groove. The groove is extended through the wick structure along a thickness direction of the main body to connect to two opposite wall surfaces of the chamber, and also extended along a length direction of the main body to communicate with the condensing section and the evaporating section. With these arrangements, the thin heat pipe structure has an extremely small overall thickness and is flexible.

Abstract: A fan impeller structure and a cooling fan thereof. The fan impeller structure consisting of a hub and a flow guide body. The hub has an extension section extending from outer circumference of the hub. The extension section has a first face and a second face. An axial center of the flow guide body is defined with an axial line. A fitting section outward extends from the axial line. A spoiler section is connected to the fitting section in a direction away from the axial line. The spoiler section is formed with multiple axial perforations that communicate with multiple radial perforations. The flow guide body is disposed on the first or second face of the extension section of the hub. The flow guide body is employed to replace the blades of conventional cooling fan. The perforations of the flow guide body can forcedly guide air in a narrow space.

Abstract: A thin heat pipe structure includes a main body having a chamber. The chamber has a wick structure and a working fluid provided therein, and internally defines an evaporating section and at least one condensing section. The condensing section is extended towards at least one or two ends of the evaporating section. The wick structure is provided with at least one groove. The groove is extended through the wick structure along a thickness direction of the main body to connect to two opposite wall surfaces of the chamber, and also extended along a length direction of the main body to communicate with the condensing section and the evaporating section. With these arrangements, the thin heat pipe structure has an extremely small overall thickness and is flexible.

Abstract: A cleaning apparatus includes a case and a cleaning head. The cleaning head is disposed on the case, and provided with a plurality of tines. The tines are separately arranged abreast. The tines are used to extend into gaps between plural conductive terminals of a semiconductor product for cleaning the semiconductor product.

Abstract: A heat pipe fixing structure includes a heat pipe, a carrier body and a first fixing member. The heat pipe has a main body having a first side and a second side. The carrier body has a channel having an open side and a closed side. The heat pipe is disposed in the channel with the first and second sides respectively corresponding to the open side and the closed side. The first fixing member is disposed on upper side of the heat pipe and upper side of the carrier body. A free end of the first fixing member is in corresponding contact with the first side of the heat pipe to press and abut against or engage with the heat pipe. The heat pipe fixing structure serves to firmly fix the heat pipe to eliminate the shortcomings existing in the conventional welding process for fixing the heat pipe.

Abstract: A fixing structure for heat dissipation element includes a base plate, a heat transfer element, and at least one fixing member. The base plate has a top surface, on which a receiving recess is defined for receiving the heat transfer element therein. At least one clearance is defined between the receiving recess and the heat transfer element. The fixing member has a fixing portion and an extended portion. The fixing portion is connected to the top surface of the base plate, whereas the extended portion is bent and inserted into the clearance to locate between the receiving recess and the heat transfer element, such that the heat transfer element is firmly held in the receiving recess of the base plate.

Abstract: A division device includes a platform, a withstanding element and a pressure element. The platform has a platform surface. The withstanding element, located on the platform surface, has at least one shrink-top-type withstanding structure protruding from the platform surface and extending along a withstanding line. The shrink-top-type withstanding structure is to withstand the solar cell sheet. The pressure element, located above the platform, has two forcing portions protruding toward the platform. While the solar cell sheet is under dividing, a back surface of the solar cell sheet opposing to the front surface is arranged to face the shrink-top-type withstanding structure by aligning the trench with the withstanding line, and then the two forcing portions are introduced to apply predetermined depression individually onto the two solar cell units, such that the solar cell sheet are divided into the two separate solar cell units.

Abstract: A centrifugal fan includes a fan frame and a fan impeller received in the fan frame. The fan frame has at least one air inlet and at least one air outlet respectively formed on two sides of the fan frame. The fan impeller has a hub, an extension section outward extending from the hub and multiple blades disposed on the extension section. Each blade has a front end and a rear end. The rear ends of the blades are annularly arranged to together define a virtual geometrical configuration. A flow guide space is defined between the virtual geometrical configuration and the hub. A chord length is defined between the front and rear ends of the blade. The flow guide space has a width larger than or equal to the chord length so as to thin the centrifugal fan and enhance the performance thereof.

Abstract: A cleaning apparatus includes a case and a cleaning head. The cleaning head is disposed on the case, and provided with a plurality of tines. The tines are separately arranged abreast. The tines are used to extend into gaps between plural conductive terminals of a semiconductor product for cleaning the semiconductor product.

Abstract: A slim fan structure includes a fan frame, a top cover closed to a top of the fan frame to define a receiving space in the fan frame, a stator assembly mounted in the receiving space, and a hub fitted around the stator assembly. The fan frame has opposite first and third sides forming an air inlet and an air outlet, respectively, and opposite second and fourth sides having a first and a second side wall formed thereon, respectively. The first side wall includes a protruded portion laterally extended toward the air inlet, and the second side wall includes a stop portion located adjacent to the air outlet. With the air inlet and the air outlet formed on two lateral sides of the fan frame, the slim fan structure has an effectively reduced overall thickness and does not produce noise during operation to largely upgrade the operational performance thereof.

Abstract: A heat dissipation structure of wearable electronic device includes a wearable main body and a wearable strap body connected with the wearable main body. The wearable main body includes a receiving space, a circuit board and multiple electronic components arranged on the circuit board. At least one of the electronic components is a heat source. The wearable strap body has a heat conduction section and a protection section enclosing the heat conduction section. A section of the heat conduction section is exposed to an interior of the receiving space without being enclosed by the protection section. The exposed section of the heat conduction section is in contact with the corresponding heat source on the circuit board so as to greatly enhance the heat dissipation performance of the wearable electronic device.

Abstract: A display module with heat dissipation structure and a handheld device thereof. The display module includes a touch panel, a display panel and a vapor chamber. One face of the display panel is correspondingly attached to the touch panel, while the other face of the display panel is correspondingly attached to the vapor chamber. The vapor chamber serves to support the touch panel and the display panel. Moreover, the vapor chamber serves to absorb the heat generated by the electronic component and quickly and uniformly spread the heat to dissipate the heat to achieve a heat spreading effect.

Abstract: A heat dissipation structure of wearable watchstrap includes a wearable strap body. The wearable strap body includes a heat conduction section and a protection section. The protection section encloses the heat conduction section. The heat conduction section has a heat absorption section and a heat dissipation section. The heat dissipation section outward extends from the heat absorption section. The wearable strap body is connectable with an intelligent mobile device to greatly enhance the heat dissipation performance of the intelligent mobile device.

Abstract: An electronic substrate with heat dissipation structure includes a substrate plate and at least one heat pipe. The substrate plate includes a wiring layer, a grounding layer and an insulation layer from top to bottom. The wiring layer has at least one heat-producing element mounted thereon, and is formed with a receiving hole for the heat pipe to tightly fit therein. Heat produced by the heat-producing element and distributed over a high-temperature zone of the substrate plate surrounding the heat-producing element is absorbed by the heat pipe and then transferred to a low-temperature zone of the substrate plate distant from the heat-producing element, from where the heat is dissipated into ambient air to achieve cooling effect at upgraded heat dissipation efficiency.

Abstract: A heat pipe structure includes a main body having a chamber. The chamber has a first side and a second side. A first capillary structure and a second capillary structure are respectively disposed on the first and second sides. A working fluid is filled in the chamber. The first capillary structure has a radial extension range larger than or equal to one half of a circumference of inner wall face of the chamber and larger than a radial extension range of the second capillary structure. The first and second capillary structures are connected with each other. The first and second capillary structures and the inner wall face of the chamber together define at least one vapor passage. By means of the heat pipe structure, the amount of transferred heat is increased and the heat transfer efficiency is greatly enhanced.

Abstract: A protective device capable of dissipating heat for protecting an electronic device includes a carrier and a flexible heat transfer unit. The carrier is used for correspondingly connecting to or receiving the electronic device therein and has a plurality of edges. The flexible heat transfer unit is arranged at one of the edges of the carrier and has a first and a second extended portion. The first extended portion is extended onto and connected to an inner side of the carrier, whereas the second extended portion is extended away from the carrier to connect to a flip cover. The first extended portion of the flexible heat transfer unit is in direct or indirect contact with a heat source of the electronic device, such that heat produced by the heat source can be transferred from the carrier to the flip cover via the flexible heat transfer unit.

Abstract: A method for assembling a touch control display apparatus includes: mounting a frame member to an assembly surface of a touch control panel; fixing a display panel to one of the frame member and the assembly surface of the touch control panel such that a display surface of the display panel faces the touch control panel; mounting at least one electronic component on a section of the frame member that is not covered by the display panel; and coupling a bottom case to the frame member for enclosing the display panel and the at least one electronic component.

Abstract: A thin heat pipe structure includes a pipe body and at least one wick structure. The pipe body has a vaporizing end internally defining a first chamber, and a condensing end internally defining a second chamber communicating with the first chamber. A space in the first chamber is smaller than that in the second chamber. The wick structure is provided in the first and the second chamber, such that at least one channel is defined in the pipe body by the wick structure and the first and second chambers. With the above arrangements, the pressure resistance in the pipe body at the condensing end is reduced to thereby enable upgraded vapor-liquid circulation efficiency of the working fluid in the pipe body and accordingly upgraded heat dissipation effect of the thin heat pipe structure. A method of forming the thin heat pipe structure is also disclosed.