Abstract: An electronic device has a heat source and a thermal module. The thermal module includes a plurality of radiating fins respectively provided with a through hole, and a heat pipe structure having a pipe body. The pipe body has a vaporizing section in contact with the heat source and a condensing section extended through the radiating fins via the through holes thereon. The vaporizing section has a first pipe thickness and is internally provided with a first wick structure to define a first flow channel. The condensing section has a second pipe thickness smaller than the first pipe thickness, and is internally provided along part of its length with at least one second wick structure to define at least one second flow channel communicating with the first flow channel.

Abstract: A thermal module and a manufacturing method thereof. The thermal module includes a retainer member and at least one heat conduction member. The retainer has a first clamping arm and a second clamping arm opposite to the first clamping arm. The heat conduction member is disposed and fixedly clamped between the first and second clamping arms. The retainer member is formed by means of punching and integrally connected with the heat conduction member also by means of punching so that the manufacturing cost of the thermal module is lowered and the heat dissipation efficiency of the thermal module is enhanced.

Abstract: A fan structure includes an upper cover, a fan frame body, a bearing cup, a bearing, a stator assembly, a hub and a shaft rod. The upper cover is mated with the fan frame body to together define a receiving space in which the bearing cup is disposed. The bearing cup has an open end and a closed end. The bearing is disposed in the bearing cup. The stator assembly is fitted around the bearing cup. The hub has multiple outward extending blades spaced from the upper cover by a first distance. The shaft rod has a connection end connected with the hub and a protruding end passing through the shaft hole and protruding from the bearing to abut against the closed end of the bearing cup and define a second distance. The first distance is smaller than the second distance to avoid deflection of the shaft rod.

Abstract: A liquid crystal display (LCD) panel, a color filter (CF) substrate, and a method of manufacturing the CF substrate are proposed. The method includes forming a black matrix pattern on an invalid pixel domain on a transparent substrate for forming an alignment mark, coating a transparent conducting layer on the invalid pixel domain for covering the alignment mark, and patterning the transparent conducting layer so that the alignment mark and the peripheral domain of the alignment mark could have a different feature of coverage. The alignment mark and the peripheral domain of the alignment mark show optics differences obviously through a CCD (charge-coupled device) optical reading lens, which increases the success ratio of reading the alignment mark and improves manufacturing efficiency.

Abstract: A chiral compound of formula (I) or (II) is provided, wherein each of R1 and R2 independently, is hydrogen, hydroxyl, halogen, amino, nitrile, C1-10 alkyl, or C1-10 alkoxyl. A liquid crystal composition comprising 80-99.5 parts by weight of a liquid crystal host; and 0.5-20 parts by weight of the chiral compound as described above is also provided.

Abstract: An embodiment of the disclosure provides a liquid crystal compound having the following formula: wherein A1, A2, and A3 are independently hydrogen, halogen, cyano, thiocyanato, or —OCF3; R1 is hydrogen, halogen, C1-C12 alkyl, C1-C12 alkoxy, C1-C12 haloalkly, C2-C12 alkenyl, or C2-C12 alkynyl; R2 and R3 are independently hydrogen, halogen, C1-C6 alkyl, C1-C6 haloalkly, cyano, thiocyanato, or —OCF3; and Z is a single bond, —O—, —CH2O—, —C(O)O—, —OCO—, —C(O)NH—, or —CH?CH—. In another embodiment, a liquid crystal display including the liquid crystal compound is also provided.

Abstract: The present invention provides a heat-dissipating assembly and a method for manufacturing the same. The heat-dissipating assembly includes a base, at least one heat pipe, and a combining unit. The base is provided with an accommodating trough and at least one through-hole. The accommodating trough has at least one receiving hole penetrating the base. One end of the heat pipe is disposed through the through-hole on one side of the base into the receiving hole. The combining unit covers the accommodating trough and one end of the heat pipe. By this arrangement, the efficiency in assembly is increased and the working hours are decreased. Further, the production cost is reduced.

Abstract: The present invention relates to a heat-dissipating base structure and a method for manufacturing the same. The heat-dissipating base structure includes a base and at least one heat pipe. The base is made of polymeric materials. One side of the base is provided with at least one trough. The trough has an open side and a closed side. The heat pipe is fixed in the trough. One side of the heat pipe is in flush with the open side. By the inventive structure, since the base is made of polymeric materials, the weight and cost of the heat-dissipating base structure can be reduced.

Abstract: A heat dissipation base includes a heat conducting element having a first surface and an opposite second surface; and a main body having a recess, a first side, and an opposite second side. The recess is communicable with the first and the second side, and the heat conducting element is set in the first side of the main body with the second surface being flush with the recess. The heat conducting element and the main body are integrally associated with each other by way of insert molding to achieve the purpose of lowered manufacturing cost and reduced overall weight of the heat dissipation base. A method of manufacturing the heat dissipation base is also disclosed.

Abstract: A heat pipe heat dissipation structure includes a main body and at least one first capillary structure. The main body has a first inner side, a second inner side, a third inner side, a fourth inner side and at least one chamber filled with a working fluid. The first capillary structure is disposed in the chamber. The first capillary structure includes a first section disposed on the first inner side and a second section extending from two sides of the first section along the adjacent third and fourth inner sides. The first section has a thickness larger than that of the second section. The heat pipe heat dissipation structure has better heat transfer efficiency.

Abstract: A heat pipe structure includes a main body having a chamber. The chamber has a first side and a second side. A first capillary structure and a second capillary structure are respectively disposed on the first and second sides. A working fluid is filled in the chamber. The first capillary structure has a radial extension range larger than or equal to one half of a circumference of inner wall face of the chamber and larger than a radial extension range of the second capillary structure. The first and second capillary structures are connected with each other. The first and second capillary structures and the inner wall face of the chamber together define at least one vapor passage. By means of the heat pipe structure, the amount of transferred heat is increased and the heat transfer efficiency is greatly enhanced.

Abstract: A heat pipe heat dissipation structure includes a main body. The main body has an evaporation section, a condensation section, a chamber filled with a working fluid and at least one first capillary structure. The first capillary structure is disposed on an inner wall face of the chamber. The first capillary structure has at least one swelling capillary section. The swelling capillary section swells from a part of the first capillary structure in the evaporation section. The heat pipe heat dissipation structure is able to greatly increase heat transfer efficiency.

Abstract: A heat pipe structure includes a main body having a chamber. The chamber has a first side and a second side. A first capillary structure and a second capillary structure are respectively disposed on the first and second sides. A working fluid is filled in the chamber. The first capillary structure has a volume larger than a volume of the second capillary structure but smaller than one half of a circumference of inner wall face of the chamber. The first and second capillary structures are connected with each other. The first and second capillary structures and the inner wall face of the chamber together define at least one vapor passage. By means of the heat pipe structure, the amount of transferred heat is increased and the heat transfer efficiency is greatly enhanced.

Abstract: A connector mechanism for connecting a board card is disclosed. The connector mechanism includes a circuit board whereon at least one metal contact is formed, and a connector installed on the circuit board. An end of the board card is for inserting into the connector. The connector mechanism further includes at least one signal transmitting component fixed on the other end of the board card and electrically connected to the board card. The at least one signal transmitting component includes at least one conductive clip for resiliently contacting the at least one metal contact on the circuit board as the end of the board card is inserted into the connector so as to electrically connect to the circuit board.

Abstract: A heat-dissipating device includes a base and a heat pipe. One side of the base is provided with an accommodating trough for accommodating the heat pipe. The heat pipe has a first heat-absorbing section, a second heat-absorbing section, a third heat-absorbing section provided between the first heat-absorbing section and the second heat-absorbing section, a first heat transfer section, and a second heat transfer section. The first, second and third heat-absorbing sections conduct the heat to the first and second heat transfer sections, and thus the heat-dissipating effect of the present invention is improved greatly.

Abstract: A thermal module includes a heat sink and a heat pipe. The heat sink has a heat absorption section and a heat dissipation section. The heat dissipation section has multiple radiating fins. The heat absorption section is formed with at least one receiving groove. The heat pipe is received in the receiving groove. The heat pipe has a first end, a second end, a middle section and at least one conduction section. The first and second ends and the middle section are arranged in adjacency to each other to together define a first section. The conduction section winds around the first section.

Abstract: A thin heat pipe structure includes a pipe body and at least one wick structure. The pipe body has a vaporizing end internally defining a first chamber, and a condensing end internally defining a second chamber communicating with the first chamber. A space in the first chamber is smaller than that in the second chamber. The wick structure is provided in the first and the second chamber, such that at least one channel is defined in the pipe body by the wick structure and the first and second chambers. With the above arrangements, the pressure resistance in the pipe body at the condensing end is reduced to thereby enable upgraded vapor-liquid circulation efficiency of the working fluid in the pipe body and accordingly upgraded heat dissipation effect of the thin heat pipe structure. A method of forming the thin heat pipe structure is also disclosed.

Abstract: An embodiment of the invention provides a chiral dopant having the following formula: wherein X1 and X2 are independently wherein F is fluorine, m is a positive integer from 1 to 8, and n is a positive integer from 1 to 4; Y1 and Y2 are independently —O—, —CH2CH2—, —CH?CH—, —C(O)O—, or —CH2O—; and R1, R2 are independently substituted or non-substituted C1-C10 linear alkyl, wherein substituents of the substituted C1-C10 linear alkyl are independently —F, —Cl, —OCF3, —NCS, or —CN, wherein a number of backbone carbon atoms in each of —Y1R1 and —Y2R2 is larger than 3.

Abstract: A heat pipe structure includes a tubular body. The tubular body has a chamber, a working fluid and a first capillary structure. The chamber is defined with at least one first section, a second section and a third section. The first, second and third sections are connected with each other. The first capillary structure is disposed in the second section. By means of the above arrangement, the pressure impedance of the chamber of the heat pipe is lowered to greatly increase vapor-liquid circulation efficiency of the working fluid in the chamber.