Abstract: A protection device for rotatably supporting a portable electronic device includes a cover, a holder and a transmission cable. The holder has a first surface and a second surface opposite to each other. A sunken slot is formed on the first surface which supports the portable electronic device. A hole structure of the holder is connected to the sunken slot and formed between the first surface and the second surface, and an arc structure is disposed on the second surface to rotatably assemble with a rotary portion of the cover. A section of the transmission cable is connected to a first connector to be disposed inside the sunken slot, another section of cable is connected to a second connector to be embedded into the cover, and a middle section of the cable pierces through the hole structure to electrically connect the first connector with the second connector.

Abstract: A heat pipe fixing structure includes a heat pipe, a carrier body and a first fixing member. The heat pipe has a main body having a first side and a second side. The carrier body has a channel having an open side and a closed side. The heat pipe is disposed in the channel with the first and second sides respectively corresponding to the open side and the closed side. The first fixing member is disposed on upper side of the heat pipe and upper side of the carrier body. A free end of the first fixing member is in corresponding contact with the first side of the heat pipe to press and abut against or engage with the heat pipe. The heat pipe fixing structure serves to firmly fix the heat pipe to eliminate the shortcomings existing in the conventional welding process for fixing the heat pipe.

Abstract: A fixing structure for heat dissipation element includes a base plate, a heat transfer element, and at least one fixing member. The base plate has a top surface, on which a receiving recess is defined for receiving the heat transfer element therein. At least one clearance is defined between the receiving recess and the heat transfer element. The fixing member has a fixing portion and an extended portion. The fixing portion is connected to the top surface of the base plate, whereas the extended portion is bent and inserted into the clearance to locate between the receiving recess and the heat transfer element, such that the heat transfer element is firmly held in the receiving recess of the base plate.

Abstract: A fan structure includes an upper cover, a fan frame body, a bearing cup, a bearing, a stator assembly, a hub and a shaft rod. The upper cover is mated with the fan frame body to together define a receiving space in which the bearing cup is disposed. The bearing cup has an open end and a closed end. The bearing is disposed in the bearing cup. The stator assembly is fitted around the bearing cup. The hub has multiple outward extending blades spaced from the upper cover by a first distance. The shaft rod has a connection end connected with the hub and a protruding end passing through the shaft hole and protruding from the bearing to abut against the closed end of the bearing cup and define a second distance. The first distance is smaller than the second distance to avoid deflection of the shaft rod.

Abstract: A thermal module structure includes a base and at least one locating member. The base has at least one channel formed thereon and the channel has a closed bottom portion and an open top portion. At least one first coupling section is formed on the base at a position corresponding to the open top portion of the channel. The locating member is provided on one side with at least one second coupling section corresponding to the first coupling section, and is fitted above the channel with the second coupling section engaged with the first coupling section. Therefore, with the locating member, a heat pipe set in the channel can be quickly and firmly held to the base at upgraded efficiency and reduced time and labor cost.

Abstract: A protective device capable of dissipating heat for protecting an electronic device includes a carrier and a flexible heat transfer unit. The carrier is used for correspondingly connecting to or receiving the electronic device therein and has a plurality of edges. The flexible heat transfer unit is arranged at one of the edges of the carrier and has a first and a second extended portion. The first extended portion is extended onto and connected to an inner side of the carrier, whereas the second extended portion is extended away from the carrier to connect to a flip cover. The first extended portion of the flexible heat transfer unit is in direct or indirect contact with a heat source of the electronic device, such that heat produced by the heat source can be transferred from the carrier to the flip cover via the flexible heat transfer unit.

Abstract: A thermal module and a manufacturing method thereof. The thermal module includes a retainer member and at least one heat conduction member. The retainer has a first clamping arm and a second clamping arm opposite to the first clamping arm. The heat conduction member is disposed and fixedly clamped between the first and second clamping arms. The retainer member is formed by means of punching and integrally connected with the heat conduction member also by means of punching so that the manufacturing cost of the thermal module is lowered and the heat dissipation efficiency of the thermal module is enhanced.

Abstract: A display module with heat dissipation structure and a handheld device thereof. The display module includes a touch panel, a display panel and a vapor chamber. One face of the display panel is correspondingly attached to the touch panel, while the other face of the display panel is correspondingly attached to the vapor chamber. The vapor chamber serves to support the touch panel and the display panel. Moreover, the vapor chamber serves to absorb the heat generated by the electronic component and quickly and uniformly spread the heat to dissipate the heat to achieve a heat spreading effect.

Abstract: A heat dissipation structure of wearable watchstrap includes a wearable strap body. The wearable strap body includes a heat conduction section and a protection section. The protection section encloses the heat conduction section. The heat conduction section has a heat absorption section and a heat dissipation section. The heat dissipation section outward extends from the heat absorption section. The wearable strap body is connectable with an intelligent mobile device to greatly enhance the heat dissipation performance of the intelligent mobile device.

Abstract: An EMI shielding structure for electronic components includes a cover body for enclosing and shielding at least one electronic component. The cover body includes a top section defining a chamber. A working fluid is contained in the chamber. At least one capillary structure is disposed in the chamber. One side of the top section faces the electronic component and is in contact with a top face of the electronic component. The EMI shielding structure can prevent the electronic component from electromagnetic wave interference. Also, the EMI shielding structure can enhance the heat dissipation efficiency for the electronic component.

Abstract: A heat dissipation structure of wearable electronic device includes a wearable main body and a wearable strap body connected with the wearable main body. The wearable main body includes a receiving space, a circuit board and multiple electronic components arranged on the circuit board. At least one of the electronic components is a heat source. The wearable strap body has a heat conduction section and a protection section enclosing the heat conduction section. A section of the heat conduction section is exposed to an interior of the receiving space without being enclosed by the protection section. The exposed section of the heat conduction section is in contact with the corresponding heat source on the circuit board so as to greatly enhance the heat dissipation performance of the wearable electronic device.

Abstract: A thin heat pipe structure includes a main body having a chamber. The chamber has a wick structure and a working fluid provided therein, and internally defines an evaporating section and at least one condensing section. The condensing section is extended towards at least one or two ends of the evaporating section. The wick structure is provided with at least one groove. The groove is extended through the wick structure along a thickness direction of the main body to connect to two opposite wall surfaces of the chamber, and also extended along a length direction of the main body to communicate with the condensing section and the evaporating section. With these arrangements, the thin heat pipe structure has an extremely small overall thickness and is flexible.

Abstract: An electronic device has a heat source and a thermal module. The thermal module includes a plurality of radiating fins respectively provided with a through hole, and a heat pipe structure having a pipe body. The pipe body has a vaporizing section in contact with the heat source and a condensing section extended through the radiating fins via the through holes thereon. The vaporizing section has a first pipe thickness and is internally provided with a first wick structure to define a first flow channel. The condensing section has a second pipe thickness smaller than the first pipe thickness, and is internally provided along part of its length with at least one second wick structure to define at least one second flow channel communicating with the first flow channel.

Abstract: A blade structure for centrifugal fan includes a hub, a first blade unit, and a second blade unit. The hub includes at least one connection section, to a radially outer end of which an annular body is connected. The annular body has a first side and an opposite second side; and the first and the second blade unit are arranged on and spaced along the first and the second side of the annular body, respectively. By providing the first and the second blade unit around the hub of a centrifugal fan, the air flows and pressure produced by the centrifugal fan can be largely increased at effectively reduced noise.

Abstract: A protection device for rotatably supporting a portable electronic device includes a cover, a holder and a transmission cable. The holder has a first surface and a second surface opposite to each other. A sunken slot is formed on the first surface which supports the portable electronic device. A hole structure of the holder is connected to the sunken slot and formed between the first surface and the second surface, and an arc structure is disposed on the second surface to rotatably assemble with a rotary portion of the cover. A section of the transmission cable is connected to a first connector to be disposed inside the sunken slot, another section of cable is connected to a second connector to be embedded into the cover, and a middle section of the cable pierces through the hole structure to electrically connect the first connector with the second connector.

Abstract: A fan impeller structure and a cooling fan thereof. The fan impeller structure includes a hub and a flow guide body. The hub has an extension section extending from outer circumference of the hub. The extension section has a first face and a second face. An axial center of the flow guide body is defined with an axial line. A fitting section outward extends from the axial line. A spoiler section is connected to the fitting section in a direction away from the axial line. The spoiler section is formed with multiple axial perforations and multiple radial perforations. The flow guide body is disposed on the first face or the second face of the extension section of the hub. The flow guide body is employed to replace the blades of conventional cooling fan. The perforations of the flow guide body can forcedly guide air in a narrow space.

Abstract: An electronic substrate with heat dissipation structure includes a substrate plate and at least one heat pipe. The substrate plate includes a wiring layer, a grounding layer and an insulation layer from top to bottom. The wiring layer has at least one heat-producing element mounted thereon, and is formed with a receiving hole for the heat pipe to tightly fit therein. Heat produced by the heat-producing element and distributed over a high-temperature zone of the substrate plate surrounding the heat-producing element is absorbed by the heat pipe and then transferred to a low-temperature zone of the substrate plate distant from the heat-producing element, from where the heat is dissipated into ambient air to achieve cooling effect at upgraded heat dissipation efficiency.

Abstract: A centrifugal fan includes a fan frame and a fan impeller received in the fan frame. The fan frame has at least one air inlet and at least one air outlet respectively formed on two sides of the fan frame. The fan impeller has a hub, an extension section outward extending from the hub and multiple blades disposed on the extension section. Each blade has a front end and a rear end. The rear ends of the blades are annularly arranged to together define a virtual geometrical configuration. A flow guide space is defined between the virtual geometrical configuration and the hub. A chord length is defined between the front and rear ends of the blade. The flow guide space has a width larger than or equal to the chord length so as to thin the centrifugal fan and enhance the performance thereof.

Abstract: A slim fan structure includes a fan frame, a top cover closed to a top of the fan frame to define a receiving space in the fan frame, a stator assembly mounted in the receiving space, and a hub fitted around the stator assembly. The fan frame has opposite first and third sides forming an air inlet and an air outlet, respectively, and opposite second and fourth sides having a first and a second side wall formed thereon, respectively. The first side wall includes a protruded portion laterally extended toward the air inlet, and the second side wall includes a stop portion located adjacent to the air outlet. With the air inlet and the air outlet formed on two lateral sides of the fan frame, the slim fan structure has an effectively reduced overall thickness and does not produce noise during operation to largely upgrade the operational performance thereof.

Abstract: A heat pipe heat dissipation structure includes a main body. The main body has an evaporation section, a condensation section, a chamber filled with a working fluid and at least one first capillary structure. The first capillary structure is disposed on an inner wall face of the chamber. The first capillary structure has at least one swelling capillary section. The swelling capillary section swells from a part of the first capillary structure in the evaporation section.