Abstract: A layout structure of double-sided flexible circuit board includes a flexible substrate having a first surface and a second surface, a first circuit layer and a second circuit layer. An inner bonding region is defined on the first surface and an inner supporting region is defined on the second surface according to the inner bonding region. The first circuit layer is located on the first surface and includes first conductive lines which each includes an inner lead located on the inner bonding region. The second circuit layer is located on the second surface and includes second conductive lines which each includes an inner supporting segment located on the inner supporting region. A width difference between any two of the inner supporting segment of the second conductive lines is less than 8 ?m.

Abstract: A combination structure of a clamping member and a circuit board for a signal connector is disclosed. The clamping member includes two clamping members fixedly connected to two sides of the circuit board. Each clamping member has a pair of first positioning pins and a pair of second positioning pins. Thereby, the center of the guide pin can be guided and the guide pin won't be loosened, so as to improve the stability of the signal and reduce the loss.

Abstract: A circuit board includes a substrate, a first measurement mark and a second measurement mark, the first and second measurement marks are located on a predetermined punch area of the substrate. After punching, the predetermined punch area is removed such that the circuit board has a through hole and a sheet is separated from the circuit board. By the first and second measurement marks on the sheet, a first distance between a first edge of the sheet and the first measurement mark and a second distance between a second edge of the sheet and the second measurement mark can be measured to determine whether the through hole is shifted or has an incorrect size.

Abstract: A chip on film package includes a chip and a flexible substrate having a film and a circuit layer. The circuit layer is formed on a first surface of the film and electrically connected to the chip. At least one groove is recessed on a second surface of the film. The flexible substrate is bent to form flat portions and at least one curved portion located between the flat portions when it is bonded to external electronic components. The groove is located on the curved portion and provided to protect the curved portion of the flexible substrate from breaking.

Abstract: A chip on film package includes a chip and a flexible substrate having a film and a circuit layer. The circuit layer is formed on a first surface of the film and electrically connected to the chip. At least one groove is recessed on a second surface of the film. The flexible substrate is bent to form flat portions and at least one curved portion located between the flat portions when it is bonded to external electronic components. The groove is located on the curved portion and provided to protect the curved portion of the flexible substrate from breaking.

Abstract: A method for manufacturing a semiconductor device includes an extra etching process. A bump or a UBM layer is etched additionally in the extra etching process after forming the semiconductor device such that the semiconductor device can conform to the standard of performance and appearance.

Abstract: A keyswitch device includes a circuit board, a fixing bracket, a micro switch, a keycap, and a connecting assembly. The circuit board has a first surface and a second surface opposite to the first surface. The fixing bracket includes a main body and a first hook. The main body abuts against the first surface. The first hook is connected to the main body and fixed to the circuit board. The micro switch passes through the main body, and is disposed on the circuit board and configured to generate a pressing signal to the circuit board while being pressed. The keycap is supported on the micro switch and configured to press the micro switch toward the circuit board. The connecting assembly is connected between the fixing bracket and the keycap and configured to guide the keycap to move upward and downward relative to the circuit board.

Abstract: A keyswitch device includes a circuit board, a fixing bracket, a micro switch, a keycap, and a connecting assembly. The circuit board has a first surface and a second surface opposite to the first surface. The fixing bracket includes a main body and a first hook. The main body abuts against the first surface. The first hook is connected to the main body and fixed to the circuit board. The micro switch passes through the main body, and is disposed on the circuit board and configured to generate a pressing signal to the circuit board while being pressed. The keycap is supported on the micro switch and configured to press the micro switch toward the circuit board. The connecting assembly is connected between the fixing bracket and the keycap and configured to guide the keycap to move upward and downward relative to the circuit board.

Abstract: A key structure includes a carrying body, a frame body, a keycap and at least two independent connecting members. The frame body is disposed on the carrying body and forms plurality of sliding grooves. The keycap has a plurality of cap edges and is disposed with a plurality of pivoting portions. The at least two connecting members are each connected between the keycap and the frame body, corresponding to two of the cap edges opposite to each other. Each connecting member includes a pivoting rod and a sliding rod. Each pivoting rod pivots on one of the pivoting portions, and each sliding rod is slidably limited in one of the sliding grooves. This design has preferred structural strength, smooth pressing movement and reliable pressing contact.

Abstract: A signal lead adapter according to the present invention comprises at least a clamper which is formed at one end of a base plate and two clamping plates integrally formed with and upwardly extending from the base plate. Each clamping plate comprises a first clamping section with a predetermined length and a first clamping surface forming into a first holding ditch with a first radius. Each clamping plate also comprises a second clamping section with a predetermined length and a second clamping surface forming a second holding ditch with a second radius. The signal lead of different radius can be inserted and hold in either the first holding ditch or the second holding ditch. The signal lead can be inserted into the adapter and pulled out from the same easily without causing damage of the flexibility as well as the metal coating layer of the clamping plates.

Abstract: A signal lead adapter according to the present invention comprises at least a clamper which is formed at one end of a base plate and two clamping plates integrally formed with and upwardly extending from the base plate. Each clamping plate comprises a first clamping section with a predetermined length and a first clamping surface forming into a first holding ditch with a first radius. Each clamping plate also comprises a second clamping section with a predetermined length and a second clamping surface forming a second holding ditch with a second radius. The signal lead of different radius can be inserted and hold in either the first holding ditch or the second holding ditch. The signal lead can be inserted into the adapter and pulled out from the same easily without causing damage of the flexibility as well as the metal coating layer of the clamping plates.

Abstract: A key structure includes a carrying body, a frame body, a keycap and at least two connecting members. The frame body is disposed on the carrying body, and the frame body is disposed with a plurality of sliding grooves. The keycap has a plurality of cap edges and correspondingly covers the top of the frame body, and the keycap is disposed with a plurality of pivoting portions. The at least two connecting members are independent from each other. The at least two connecting members are connected between the keycap and the frame body, corresponding to the two cap edges opposite to each other. Each connecting member includes a pivoting rod and a sliding rod. Each pivoting rod pivots on each pivoting portion. Each sliding rod is slidably limited in each sliding groove, and the pivoting portions are correspondingly located on the outside of the sliding grooves.

Abstract: A key structure includes a carrying body, a frame body, a keycap and at least two connecting members. The frame body is disposed on the carrying body, and the frame body is disposed with a plurality of sliding grooves. The keycap has a plurality of cap edges and correspondingly covers the top of the frame body, and the keycap is disposed with a plurality of pivoting portions. The at least two connecting members are independent from each other. The at least two connecting members are connected between the keycap and the frame body, corresponding to the two cap edges opposite to each other. Each connecting member includes a pivoting rod and a sliding rod. Each pivoting rod pivots on each pivoting portion. Each sliding rod is slidably limited in each sliding groove, and the pivoting portions are correspondingly located on the outside of the sliding grooves.

Abstract: A key structure includes a carrying body, a frame body, a keycap and at least two independent connecting members. The frame body is disposed on the carrying body and forms plurality of sliding grooves. The keycap has a plurality of cap edges and is disposed with a plurality of pivoting portions. The at least two connecting members are each connected between the keycap and the frame body, corresponding to two of the cap edges opposite to each other. Each connecting member includes a pivoting rod and a sliding rod. Each pivoting rod pivots on one of the pivoting portions, and each sliding rod is slidably limited in one of the sliding grooves. This design has preferred structural strength, smooth pressing movement and reliable pressing contact.

Abstract: A direct attach media converter is provided. The direct attach media converter comprises a media converter module, a connecting wire and a pluggable transceiver module. The media converter module is configured to transform a RJ-45 interface signal into a pluggable transceiver module interface signal or transform a pluggable transceiver module interface signal into a RJ-45 interface signal. The connecting wire is directly connected to the media converter module and is configured to transmit the pluggable transceiver module interface signal. The pluggable transceiver module is electrically connected to the connecting wire and is configured to receive and transmit the pluggable transceiver module interface signal.

Abstract: A manufacturing method of a substrate with a bump structure, a copper layer is formed on a semiconductor substrate, and a nickel layer is formed on the copper layer. A bump structure is composed of the copper layer and the nickel layer, wherein the hardness of the bump structure after annealing process depends on the thickness of the nickel layer to meet the user's demand. The hardness of the bump structure meets the user's demand prevents a glass substrate from cracking when the substrate with the bump structure is bonded with the glass substrate.

Abstract: A direct attach media converter is provided. The direct attach media converter comprises a media converter module, a connecting wire and a pluggable transceiver module. The media converter module is configured to transform a RJ-45 interface signal into a pluggable transceiver module interface signal or transform a pluggable transceiver module interface signal into a RJ-45 interface signal. The connecting wire is directly connected to the media converter module and is configured to transmit the pluggable transceiver module interface signal. The pluggable transceiver module is electrically connected to the connecting wire and is configured to receive and transmit the pluggable transceiver module interface signal.

Abstract: A cable connector with an oblique ground adapter includes a main body, a cable adapter and a ground adapter. The main body is formed with a vertical main plate and a side plate. The main plate has one side extended integrally with the side plate. The cable adapter secured on the main plate has an interior bored with a cable insert hole having a shaft line formed along a shaft center, longitudinally defined to have a perpendicular line to be intersected with the first shaft line. The ground adapter obliquely mounted on the side plate has an interior disposed with a threaded hole, having second shaft line formed along the shaft center of the threaded hole and slanting toward the perpendicular line to be intersected and formed with an acute angle, diminishing the breadth and volume of the side plate for lowering manufacturing cost of cable connectors.

Abstract: An integral keyboard assembly is provided. The integral keyboard assembly includes a top casing, a keyboard module, and a support plate. The first surface of the top casing is defined a keyboard bonding area where a plurality of openings is arranged as a keyboard structure distribution. The keyboard module includes multiple keys with interspaces formed therebetween. Each of the keys is inserted into a corresponding one of the openings. The support plate is coupled to the top casing so that the keyboard module is sandwiched between the top casing and the support plate. By implementing the present invention, the keyboard assembly has better integrity and space impression. Furthermore, the keyboard module is provided with improved support by utilizing the support plate.