Abstract: A photo resist layer is used to protect a dielectric layer and conductive elements embedded in the dielectric layer when patterning an etch stop layer underlying the dielectric layer. The photo resist layer may further be used to etch another dielectric layer underlying the etch stop layer, where etching the next dielectric layer exposes a contact, such as a gate contact. The bottom layer can be used to protect the conductive elements embedded in the dielectric layer from a wet etchant used to etch the etch stop layer.

Abstract: A semiconductor device includes a single diffusion break (SDB) structure dividing a fin-shaped structure into a first portion and a second portion, an isolation structure on the SDB structure, a first spacer adjacent to the isolation structure, a metal gate adjacent to the isolation structure, a shallow trench isolation (STI around the fin-shaped structure, and a second isolation structure on the STI. Preferably, a top surface of the first spacer is lower than a top surface of the isolation structure and a bottom surface of the first spacer is lower than a bottom surface of the metal gate.

Abstract: A semiconductor device includes a fin structure, a metal gate stack, a barrier structure and an epitaxial source/drain region. The fin structure is over a substrate. The metal gate stack is across the fin structure. The barrier structure is on opposite sides of the metal gate stack. The barrier structure comprises one or more passivation layers and one or more barrier layers, and the one or more passivation layers have a material different from a material of the one or more barrier layers. The epitaxial source/drain region is over the barrier structure.

Abstract: A chip package which includes a glass fiber substrate made of FR-4 fiberglass is provided. The chip package further includes a substrate pad which is a stacked metal structure with a certain thickness and composed of a nickel layer, a palladium layer, and a gold layer, or a nickel layer and a gold layer stacked over at least one first circuit layer in turn. A total thickness of the substrate pad is 3.15-5.4 ?m. The glass fiber substrate and the substrate pad can bear positive pressure generated during wire bonding. Thereby at least one solder joint is formed on the substrate pad precisely and integrally. This helps reduction in material cost for manufacturers.

Abstract: A fan is provided herein, including a housing, a hub, and a plurality of blades. The housing includes a top case and a bottom case. The hub is rotatably disposed between the top case and the bottom case in an axial direction. The blades extend from the hub in a radial direction, located between the top case and the bottom case. Each of the blades has a proximal end and a distal end. The proximal end is connected to the hub. The distal end is opposite from the proximal end, located at the other side of the blade, having at least one recessed portion. Each of the recessed portions form a passage for air.

Abstract: A quantum dot oil-based ink is provided. The quantum dot oil-based ink includes a quantum dot material, a dispersing solvent, a viscosity modifier, and a surface tension modifying solution. The dispersing solvent includes a linear alkane having 6 to 14 carbon atoms. The viscosity modifier includes an aromatic hydrocarbon having 10 to 18 carbon atoms or a linear olefin having 16 to 20 carbon atoms. The surface tension modifying solution includes a hydrophobic polymer material and a nonpolar solvent.

Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: A chip package having die pads with protective layers is provided. At least one protective layer is covering and arranged at a peripheral zone of at least one die pad for minimizing area of the die pad exposed outside as well as shielding and protecting the peripheral zone of the die pad. A weld zone of the die pad is not covered by the protective layer so that the weld zone of the die pad is exposed. In a crossed-over state, one of bonding wires crossing one of the die pads with a corresponding connection pad of a carrier plate will not get across a second upper space defined by the weld zone of the rest of the die pads. Thereby the one of the bonding wires can be more isolated by the protective layers on the peripheral zones of the rest of the die pads.

Abstract: An optical fiber transmission device includes a substrate, a photonic integrated circuit, and an optical fiber assembly. The photonic integrated circuit is disposed on an area of the substrate. The substrate has a protruding structure at an interface with an edge of the photonic integrated circuit. The optical fiber assembly includes an optical fiber and a ferrule that sleeves the optical fiber. The protruding structure of the substrate is configured to abut against the ferrule to limit the position of the optical fiber assembly in a vertical direction of the substrate, such that the protruding structure is a stopper for the optical fiber assembly in the vertical direction.

Abstract: An optical fiber network device includes a fiber and a photonic integrated circuit. Fiber receives a first optical signal and transmits a second optical signal. A first wavelength of first optical signal is different from a second wavelength of second optical signal. Photonic integrated circuit includes a laser chip, a photodetector, a wavelength division multiplexing coupler, a first optical modulation element and a second optical modulation element. Laser chip is disposed on photonic integrated circuit, and is configured to generate first optical signal. Photodetector detects second optical signal. Wavelength division multiplexing coupler is configured to couple first optical signal to fiber, and receives second optical signal. First optical modulation element is coupled to wavelength division multiplexing coupler and laser chip, and is configured to modulate first optical signal.

Abstract: A chip package with at least one electromagnetic interference (EMI) shielding layer and at least one ground wire and a method of manufacturing the same are provided. The chip package includes a chip package unit, at least one EMI shielding layer, and at least one ground wire. The ground wire which consists of a first end and a second end opposite to the first end is inserted through the EMI shielding layer and a first insulating layer of the chip package unit. The first end is electrically connected with the EMI shielding layer while the second end of the ground wire is electrically connected with at least one grounding end of at least one first circuit layer of the chip package unit for protection against static electricity. Thereby malfunction of an electronic system with semiconductor chips due to static electricity can be avoided.

Abstract: A centrifugal heat dissipation fan including a housing and an impeller disposed in the housing on an axis is provided. The housing has at least one inlet on the axis and has a plurality of outlets in different radial directions. A heat dissipation system of an electronic device is also provided.

Abstract: A projection apparatus includes a casing, a projection lens, a first and a second light source modules, a first and a second thermal modules respectively thermally coupled to the first and the second light source modules, and a first and a second fans. The casing includes a bottom cover having a first air inlet corresponding to the projection lens, a front cover, a rear cover having a second air inlet, a first and a second side covers, which define an internal space divided into a first and a second areas. The first air inlet is connected to the internal space. A first air outlet of the first side cover and the second air inlet are connected to the first area. The first and the second light source modules, the first and the second thermal modules, and the first and the second fans are disposed in the first area.

Abstract: The present invention provides a wireless communication method of a multi-link device. The wireless communication method includes the steps of: establishing multiple links with an access point, wherein the multiple links have a current link mode; determining performance of a current link mode and at least one candidate link mode, wherein frequency band(s) corresponding to the current link mode and the at least one candidate link mode are not the same; and if the performance of one of the at least one candidate link mode is greater than the performance of the current link mode, switching the link mode of the multiple links, without reconnecting to the access point, so that the one of the at least one candidate link mode serves as the current link mode to communicate with the access point.

Abstract: A projection apparatus includes a casing, a projection lens, a first fan, a first light source module, a second light source module, a first heat dissipation module, and a second heat dissipation module. A disposing direction of the projection lens divides an accommodating space of the casing into a first region and a second region. The first fan, the first light source module, the second light source module, the first heat dissipation module, and the second heat dissipation module are located in the first region. The first heat dissipation module includes a first heat dissipation fin set and a first heat pipe. The first heat pipe is connected to the first base of the first light source module and the first heat dissipation fin set. The first heat dissipation fin set is disposed adjacent to a first air inlet, and in an axial direction of the first fan.

Abstract: A light source module including a light guide plate and a light emitting element is provided. The light guide plate includes an upper surface concentric circle structure and a lower surface concentric circle structure opposite to the upper surface concentric circle structure. The center of the upper surface concentric circle structure corresponds to the center of the lower surface concentric circle structure. The light emitting element is disposed corresponding to the center of the upper surface concentric circle structure and the center of the lower surface concentric circle structure.

Abstract: A method for performing beamforming sounding feedback in a system-parameter-aware manner and associated apparatus are provided. The method applicable to a wireless transceiver device within a wireless communications system may include: checking a plurality of system parameters of the wireless communications system to generate a plurality of checking results of the plurality of system parameters, respectively, wherein any checking result among the plurality of checking results indicates a current value of a corresponding system parameter among the plurality of system parameters; modifying a first beamforming feedback matrix according to the plurality of checking results to generate a second beamforming feedback matrix; and sending beamforming sounding feedback information carrying the second beamforming feedback matrix to another device within the wireless communications system, for further processing of the other device.

Abstract: A light source module including a light guide plate and a light emitting element is provided. The light guide plate includes an upper surface concentric circle structure and a lower surface concentric circle structure opposite to the upper surface concentric circle structure. The center of the upper surface concentric circle structure corresponds to the center of the lower surface concentric circle structure. The light emitting element is disposed corresponding to the center of the upper surface concentric circle structure and the center of the lower surface concentric circle structure.

Abstract: A floating image display device, configured to generate a floating image, is provided. The floating image display device includes an image module and at least one transflective optical element. The image module is configured to provide a first image. The transflective optical element includes a first reflective surface and a second reflective surface. The first image is located between the first reflective surface and the second reflective surface. Each of the first reflective surface and the second reflective surface includes a curved surface and has no opening on an optical axis thereof. The second reflective surface is a transflective surface. The first reflective surface and the second reflective surface are configured to re-converge rays from the first image to form a second image. The second image is a floating image.

Abstract: A projection lens module including a lens assembly, a reflector, a housing, a light shading structure, a fan, and an air guiding element is provided. The reflector is disposed on an optical axis of the lens assembly. The reflector includes a reflective surface and a shady surface. The housing covers the reflector, and includes a first part and a second part. The first part and the reflective surface of the reflector jointly define an enclosed space, and the second part and at least a part of the shady surface of the reflector jointly define an air guiding space. The light shading structure overlaps the air outlet in a direction of the optical axis. The fan is disposed outside the housing. The air guiding element connects the fan and the housing, and guides the wind blown by the fan to the shady surface, and the wind leaves from the air outlet.