Abstract: A circuit board including a substrate, a patterned circuit layer and a photo-imaginable dielectric layer is provided. The substrate has a first surface and a second surface opposite to each other. The patterned circuit layer is disposed on the first surface, and a line width of the patterned circuit layer gradually reduces from the first surface towards the second surface. The photo-imaginable dielectric layer is disposed in the substrate corresponding to the patterned circuit layer. In addition, a manufacturing method of the circuit board is also proposed.

Abstract: A visible light response photocatalyst structure and a process for manufacturing the same are disclosed, where the structure is manufactured by the GRR for two times, so that the structure has a large surface area, high surface activity, being apt to get integrated with a silicon substrate and endurable to the environment, and further has the rapid and simple manufacturing characteristics without any additional energy required and has a high reproductively.

Abstract: A key structure includes a carrying body, a frame body, a keycap and at least two independent connecting members. The frame body is disposed on the carrying body and forms plurality of sliding grooves. The keycap has a plurality of cap edges and is disposed with a plurality of pivoting portions. The at least two connecting members are each connected between the keycap and the frame body, corresponding to two of the cap edges opposite to each other. Each connecting member includes a pivoting rod and a sliding rod. Each pivoting rod pivots on one of the pivoting portions, and each sliding rod is slidably limited in one of the sliding grooves. This design has preferred structural strength, smooth pressing movement and reliable pressing contact.

Abstract: A keyswitch structure includes a base plate, a key cap, a key base, a recovering member and a linkage mechanism having linkage members. The key base is disposed between the key cap and the base plate. The recovering member is disposed between the key cap and the base plate. The linkage members are physically separated from each other, and are respectively inclinedly disposed between the key base and the key cap, and collectively surround the recovering member. One end of each of the linkage members is pivotally connected to the key base, and the other end of each of the linkage members is slidably connected to the key cap.

Abstract: A keyswitch structure includes a base plate, a key cap, a key base, a recovering member and a linkage mechanism having linkage members. The key base is disposed between the key cap and the base plate. The recovering member is disposed between the key cap and the base plate. The linkage members are physically separated from each other, and are respectively inclinedly disposed between the key base and the key cap, and collectively surround the recovering member. One end of each of the linkage members is pivotally connected to the key base, and the other end of each of the linkage members is slidably connected to the key cap.

Abstract: A key structure includes a carrying body, a frame body, a keycap and at least two connecting members. The frame body is disposed on the carrying body, and the frame body is disposed with a plurality of sliding grooves. The keycap has a plurality of cap edges and correspondingly covers the top of the frame body, and the keycap is disposed with a plurality of pivoting portions. The at least two connecting members are independent from each other. The at least two connecting members are connected between the keycap and the frame body, corresponding to the two cap edges opposite to each other. Each connecting member includes a pivoting rod and a sliding rod. Each pivoting rod pivots on each pivoting portion. Each sliding rod is slidably limited in each sliding groove, and the pivoting portions are correspondingly located on the outside of the sliding grooves.

Abstract: A carrier substrate includes a circuit structure layer, a first solder resist layer, a second solder resist layer and conductive towers. The circuit structure layer includes a core structure layer, a first circuit layer and a second circuit layer. The first solder resist layer has first openings exposing a portion of the first circuit layer. The second solder resist layer has second openings exposing a portion of the second circuit layer. The conductive towers are disposed at the first openings, higher than a surface of the first solder resist layer and connected with the first openings exposed by the first circuit layer, wherein a diameter of each of the conductive towers gradually increases by a direction from away-from the first openings towards close-to the first openings. A diameter of the second conductive towers is greater than that of the first conductive towers.

Abstract: A carrier substrate includes an insulation layer, conductive towers and a circuit structure layer. A diameter of each of the conductive towers is increased gradually from a top surface to a bottom surface, and the conductive towers include first conductive towers and second conductive towers surrounding the first conductive towers. The circuit structure layer is disposed on the insulation layer and includes at least one dielectric layer, at least two circuit layers and first conductive vias. Each of the second conductive towers correspondingly connects to at least two of the first conductive vias, and each of the first conductive towers correspondingly connects to one of the first conductive vias. An interface exists between the first conductive vias and the first and the second conductive towers.

Abstract: An image ranging system has a light source module having a light source diode and a light source lens, and an image sensing module, placed near the light source, having an image sensing device and an image sensing lens. An optical signal emitted from the light source diode passes through the light source lens with a luminous intensity profile which is characterized by intensity I1 and then reaches an object. A reflection signal is generated by the object. The relationship between the intensity I1 and the emission angle ? of the optical signal is I1=1/cos7 ?. The reflection signal into the image source lens has an incident angle ? the same as the emission angle of the optical signal, and images the object onto the image sensing device. The ratio of the height of object image to the effective focal length of image sensing lens is proportional to sin 0.

Abstract: A method of fabricating a composite PDMS microstructure includes a defining step, a depositing step and an etching step. The defining step is performed for defining a patterned area having a mono-molecule with a thiol group on a PDMS substrate, and the mono-molecule with the thiol group is in liquid phase. The depositing step is performed for placing the PDMS substrate having the mono-molecule with the thiol group into a vacuum chamber within an activation time so as to deposit one Au atom on the patterned area of the PDMS substrate by a vacuum coating process. The etching step is performed for cleaning the PDMS substrate using water, and thus the Au atom can be selectively retained on the patterned area of the PDMS substrate.

Abstract: A key structure includes a carrying body, a frame body, a keycap and at least two independent connecting members. The frame body is disposed on the carrying body and forms plurality of sliding grooves. The keycap has a plurality of cap edges and is disposed with a plurality of pivoting portions. The at least two connecting members are each connected between the keycap and the frame body, corresponding to two of the cap edges opposite to each other. Each connecting member includes a pivoting rod and a sliding rod. Each pivoting rod pivots on one of the pivoting portions, and each sliding rod is slidably limited in one of the sliding grooves. This design has preferred structural strength, smooth pressing movement and reliable pressing contact.

Abstract: A key structure includes a carrying body, a frame body, a keycap and at least two connecting members. The frame body is disposed on the carrying body, and the frame body is disposed with a plurality of sliding grooves. The keycap has a plurality of cap edges and correspondingly covers the top of the frame body, and the keycap is disposed with a plurality of pivoting portions. The at least two connecting members are independent from each other. The at least two connecting members are connected between the keycap and the frame body, corresponding to the two cap edges opposite to each other. Each connecting member includes a pivoting rod and a sliding rod. Each pivoting rod pivots on each pivoting portion. Each sliding rod is slidably limited in each sliding groove, and the pivoting portions are correspondingly located on the outside of the sliding grooves.

Abstract: A focusing solar light guide module includes a lens array plate and a light guide plate. The lens array plate includes at least one lens. Each lens receiving and focusing a sunlight has an upper curved surface and a lower plane surface. The light guide plate has an upper plane surface parallel to the lower plane surface of the lens array plate and a lower microstructure surface. The lower microstructure surface includes at least one depressed area and at least one connection area parallel to the upper plane surface of the light guide plate. The connection area is connected between the adjacent depressed areas having a depressed point, a first inclined plane and a second inclined plane. The first inclined plane and the second inclined plane are respectively connected between the depressed point and the adjacent connection area.

Abstract: A method of fabricating a composite PDMS microstructure includes a defining step, a depositing step and an etching step. The defining step is performed for defining a patterned area having a mono-molecule with a thiol group on a PDMS substrate, and the mono-molecule with the thiol group is in liquid phase. The depositing step is performed for placing the PDMS substrate having the mono-molecule with the thiol group into a vacuum chamber within an activation time so as to deposit one Au atom on the patterned area of the PDMS substrate by a vacuum coating process. The etching step is performed for cleaning the PDMS substrate using water, and thus the Au atom can be selectively retained on the patterned area of the PDMS substrate.

Abstract: A carrier substrate includes a dielectric layer, a first circuit layer, an insulation layer, conductive blocks, and a first conductive structure. The dielectric layer has a first surface, a second surface, and blind vias. The first circuit layer is embedded in the first surface and the blind vias extend from the second surface to the first circuit layer. The insulation layer is disposed on the first surface and has a third surface, a fourth surface, and first openings exposing the first circuit layer. The conductive blocks fill the first openings and connect with the first circuit layer. A top surface of each of the conductive blocks is higher than the third surface of the insulation layer. The first conductive structure includes conductive vias filling the blind vias and a second circuit layer disposed on a portion of the second surface.

Abstract: An active photocatalytic reactor configured to process biological culturing water with an accelerated process. Water to be used in a biological culturing system is stabilized with pollutants in the water reduced. The active photocatalytic reactor is less affected by outside environment while having faster activating speed. The active photocatalytic reactor can further be combined with a traditional filter to form a serial or parallel connection for more effectively purifying the culturing water with damage to the whole system avoided.

Abstract: A packaging substrate is provided, including a substrate body and conductive pillars. The substrate body has a first surface and a second surface opposite to the first surface. The first surface has a plurality of first conductive pads, and the second surface has a die attach area and a peripheral area surrounding the die attach area. The die attach area has a plurality of second conductive pads embedded therein, wherein top surfaces of the second conductive pads are exposed from the second surface, and the die attach area of the second surface is fully exposed. The conductive pillars are correspondingly disposed on the second conductive pads and have first ends and opposite second ends. The first ends are closer than the second ends from the second conductive pads, and the first ends have a width bigger than a width of the second ends. A fabricating method thereof is also provided.

Abstract: A visible light response photocatalyst structure and a process for manufacturing the same are disclosed, where the structure is manufactured by the GRR for two times, so that the structure has a large surface area, high surface activity, being apt to get integrated with a silicon substrate and endurable to the environment, and further has the rapid and simple manufacturing characteristics without any additional energy required and has a high reproductively.

Abstract: A focusing solar light guide module includes a lens array plate and a light guide plate. The lens array plate includes at least one lens. Each lens receiving and focusing a sunlight has an upper curved surface and a lower plane surface. The light guide plate has an upper plane surface parallel to the lower plane surface of the lens array plate and a lower microstructure surface. The lower microstructure surface includes at least one depressed area and at least one connection area parallel to the upper plane surface of the light guide plate. The connection area is connected between the adjacent depressed areas having a depressed point, a first inclined plane and a second inclined plane. The first inclined plane and the second inclined plane are respectively connected between the depressed point and the adjacent connection area.

Abstract: A carrier substrate includes a dielectric layer, a first circuit layer, an insulation layer, conductive blocks, and a first conductive structure. The dielectric layer has a first surface, a second surface, and blind vias. The first circuit layer is embedded in the first surface and the blind vias extend from the second surface to the first circuit layer. The insulation layer is disposed on the first surface and has a third surface, a fourth surface, and first openings exposing the first circuit layer. The conductive blocks fill the first openings and connect with the first circuit layer. A top surface of each of the conductive blocks is higher than the third surface of the insulation layer. The first conductive structure includes conductive vias filling the blind vias and a second circuit layer disposed on a portion of the second surface.