Abstract: Systems and methods are disclosed which provide for a “factory-calibrated” sensor. In doing so, the systems and methods include predictive prospective modeling of sensor behavior, and also include predictive modeling of physiology. With these two correction factors, a consistent determination of sensitivity can be achieved, thus achieving factory calibration.

Abstract: In some embodiments, a light emitting structure comprises a layered semiconductor stack comprising a first set of doped layers, a second layer, a light emitting layer positioned between the first set of doped layers and the second layer, and an electrical contact to the first set of doped layers. The first set of doped layers can comprise a first sub-layer, a second sub-layer, and a third sub-layer, wherein the third sub-layer is adjacent to the light emitting layer. The electrical contact can be coupled to the second sub-layer. The first, second and third sub-layers can be doped n-type, and an electrical conductivity of the second sub-layer can be higher than an electrical conductivity of the first and third sub-layers. The first, second and third sub-layers, the light emitting layer, and the second layer can each comprise a superlattice.

Abstract: A first and second patterned circuit layer are formed on a first surface and a second surface of a base material. A first adhesive layer is formed on the first patterned circuit layer. A portion of the first surface is exposed by the first patterned circuit layer. The metal reflection layer covers the first insulation layer and a reflectance thereof is greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer, and the first adhesive layer is disposed between the first patterned circuit layer and the first insulation layer. A transparent adhesive layer and a protection layer are formed on the metal reflection layer. The transparent adhesive layer is disposed between the metal reflection layer and the protection layer. The protection layer comprises a transparent polymer. The light transmittance is greater than or equal to 80%.

Abstract: A semiconductor device is provided. The semiconductor device includes a substrate and a stack structure. The substrate includes a first upper region, a second upper region, a third upper region and a fourth upper region. The stack structure locates on the fourth upper region of the substrate without overlapping the first upper region, the second upper region and the third upper region. The stack structure includes a first end face, a top surface, a first semiconductor layer, an active region, and a second semiconductor layer. The second semiconductor layer includes a ridge structure. The first upper region is closer to the light emitting end face than the second upper region is. The semiconductor device has a first depth between the top surface and the first upper region, and a second depth between the top surface and the second upper region smaller than the first depth.

Abstract: Apparatus, methods, and computer-readable media for facilitating network slice based reselection using machine learning are disclosed herein. An example method for wireless communication at a UE includes predicting a next active PDU session of two or more PDU sessions based on next connection setup times for each PDU session. The next connection setup times may be estimated based on connection setup events occurring over a period. The example method also includes selecting a frequency channel to camp on based on the next active PDU session.

Abstract: An electrode structure of rechargeable battery includes a battery tab stack, an electrode lead, a welding protective layer and a welding seam. The battery tab stack is formed by extension of a plurality of electrode sheets. The electrode lead is joined to one side of the battery tab stack. The welding protective layer is joined to another side of the battery tab stack opposite to the electrode lead. The welding seam extends from the welding protective layer to the electrode lead through the battery tab stack.

Abstract: The present disclosure provides a sealing device and an in-wheel motor including the sealing device. The in-wheel motor includes a stator, a rotor rotatably disposed with respect to the stator, an annular inner seal connected to the stator and spaced apart from the rotor by a predetermined gap so as to be disposed between the stator and the rotor, and an annular slinger coupled to an end portion of the rotor, wherein the annular inner seal seals between the slinger and the in-wheel motor.

Abstract: Methods, systems, and apparatus for motion-based human video detection are disclosed. A method includes generating a representation of a difference between two frames of a video; providing, to an object detector, a particular frame of the two frames and the representation of the difference between two frames of the video; receiving an indication that the object detector detected an object in the particular frame; determining that detection of the object in the particular frame was a false positive detection; determining an amount of motion energy where the object was detected in the particular frame; and training the object detector based on penalization of the false positive detection in accordance with the amount of motion energy where the object was detected in the particular frame.

Abstract: Disclosed herein are related to a system and a method of extending a lifetime of a memory cell. In one aspect, a memory controller applies a first pulse having a first amplitude to the memory cell to write input data to the memory cell. In one aspect, the memory controller applies a second pulse having a second amplitude larger than the first amplitude to the memory cell to extend a lifetime of the memory cell. The memory cell may include a resistive memory device or a phase change random access memory device. In one aspect, the memory controller applies the second pulse to the memory cell to repair the memory cell in response to determining that the memory cell has failed. In one aspect, the memory controller periodically applies the second pulse to the memory cell to extend the lifetime of the memory cell before the memory cell fails.

Abstract: A chip package structure and a method for producing the same are provided. The method at least includes: providing a substrate; placing a chip upside-down on the substrate; forming bonding wires coupled with the chip and the substrate; forming a support body on the substrate; providing at least one reflecting member at a periphery of the support body; providing a package cover adhered to a top surface of the support body; performing a solidifying process in which a solidifying light beam is emitted to the reflecting member and the reflecting member reflects the solidifying light beam to the support body to solidify the support body; performing a packaging process in which a package layer is formed to cover the chip, an outer periphery of the support body, and the package cover; and performing a cutting process to form the chip package structure.

Abstract: This disclosure discloses an optical sensing device. The device includes a carrier body; a first light-emitting device disposed on the carrier body; and a light-receiving device including a group III-V semiconductor material disposed on the carrier body, including a light-receiving surface having an area, wherein the light-receiving device is capable of receiving a first received wavelength having a largest external quantum efficiency so the ratio of the largest external quantum efficiency to the area is ?13.

Abstract: A light-emitting element transfer system includes raw film cutting device for forming a transfer member by cutting a raw film, a stretching device for stretching a transfer film with a plurality of light-emitting elements disposed thereon, a circuit board support member for supporting a circuit board and transport head for adsorbing the transfer member and transferring the light-emitting elements on the transfer film onto the circuit board by using the adsorbed transfer member.

Abstract: A chip package structure and a method for fabricating the same are provided. The chip package structure includes a conductive substrate, a chip, a molding layer and a package cover. The conductive substrate has first and second board surfaces opposite to each other, and a die-bonding region is defined on the first board surface. The chip is disposed on the first board and located in the die-bonding region, and is electrically connected to the conductive substrate. The molding layer is disposed on the first board surface and surrounds the die-bonding region and the chip. The package cover is disposed on the molding layer, and the package cover, the molding layer and the conductive substrate jointly define an enclosed space surrounding the chip. Two of the conductive substrate, the molding layer and the package cover are connected to each other through a mortise-tenon joint structure.

Abstract: A composite encapsulation material is provided, which includes (A) a polymer glue material and (B) a viscosity modifier. The viscosity modifier (B) has a functional group capable of forming non-covalent interaction with the polymer glue material (A). At room temperature, the ratio (log(?0)/log(?28 )) of the logarithm of the viscosity ((log(?0)) of the composite encapsulation material at the shear rate of 1×10?3 s?1 to the logarithm of the viscosity (log(??)) of the composite encapsulation material at the shear rate of 1×102 s?1 is 1.1-2.5.

Abstract: A chip package structure and a method for producing the same are provided. The method at least includes: providing a substrate; forming a mirror ink on the substrate; placing a chip upside-down on the substrate; forming soldering wires coupled with the chip and the substrate; forming a support body on the substrate; providing a package cover adhered to a top surface of the support body; performing a solidifying process in which a solidifying light beam is emitted to the mirror ink and the mirror ink reflects the solidifying light beam to the support body to solidify the support body; performing a packaging process in which a package layer is formed to cover the chip, an outer periphery of the support body, and the package cover; and performing a cutting process in which the package layer and the substrate are cut to form the chip package structure.

Abstract: A substrate treatment apparatus according to an aspect of the present invention includes: a support plate that supports a substrate and is provided with a heater member for heating the substrate; and a cooling unit for forcedly cooling the support plate, wherein the cooling unit includes: a cooling housing to provide a cooling space; a plurality of gas feed nozzles that is arranged in the cooling housing and supplies cooling gas toward the heater member; and a plurality of gas feed lines that is directly connected to the gas feed nozzles and supplies the cooling gas transferred from the outside to the gas feed nozzles.

Abstract: A touch sensor includes first touch electrodes, second touch electrodes that form mutual capacitances with the first touch electrodes, and a controller that generates touch data by applying a scan signal to each of scan lines connected to the first touch electrodes during substantially a same time and that receives sensing signals from the second touch electrodes through sensing lines. The controller applies a plurality of multiple pulses and a target pulse as the scan signal to each of the scan lines in a plurality of time periods. Each of the plurality of multiple pulses includes a first pulse and a second pulse of phases opposite to each other. Multiple pulses applied to scan lines adjacent to each other among the scan lines have phases opposite to each other.

Abstract: Methods, systems, and devices for wireless communications are described. A user equipment (UE) may receive, from a base station, a control message indicating a resource configuration for uplink and downlink transmissions. The UE may determine an uplink buffer threshold for a modem buffer of the UE based on the resource configuration. The UE may transmit, to the base station, a feedback request message requesting that the base station provide feedback for at least one previously transmitted uplink packet based on a comparison of an amount of previously transmitted uplink data and scheduled uplink data stored in the modem buffer relative to the uplink buffer threshold. The UE may receive, based on transmitting the feedback request message, a feedback response message corresponding to a first previously transmitted uplink packet of the at least one previously transmitted uplink packet.

Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.

Abstract: The present invention relates to a method for generating an alarm pertaining to continuous biometric data and, more specifically, to an alarm generation method in which, if an alarm condition is satisfied, an alarm is output to a user while maintaining the alarm in an activated state during a set alarm period, and changing the alarm type selected by the user during the alarm period, thereby enabling the user to be prompted to input information or take an action in response to the alarm without ignoring the alarm, while not causing inconvenience to the user due to frequent alarms; and when the alarm condition is satisfied, an operating mode of a receiver is determined and the alarm type, which has been set in accordance with the alarm condition, is changed to an alarm type corresponding to the operating mode of the receiver, thereby making it possible to prevent an alarm from being generated against the user's wishes.