Abstract: A method for forming a semiconductor device includes: forming a gate structure over a fin, where the fin protrudes above a substrate; forming an opening in the gate structure; forming a first dielectric layer along sidewalls and a bottom of the opening, where the first dielectric layer is non-conformal, where the first dielectric layer has a first thickness proximate to an upper surface of the gate structure distal from the substrate, and has a second thickness proximate to the bottom of the opening, where the first thickness is larger than the second thickness; and forming a second dielectric layer over the first dielectric layer to fill the opening, where the first dielectric layer is formed of a first dielectric material, and the second dielectric layer is formed of a second dielectric material different from the first dielectric material.

Abstract: A system and a method for pathological voice recognition and a computer-readable storage medium are provided. The method for pathological voice recognition comprises: capturing a voice signal; processing the voice signal using Mel Frequency Cepstral Coefficients (MFCC) algorithm to obtain an MFCC spectrogram; extracting features from the MFCC spectrogram; and predicting a pathological condition of the voice signal based on the features of the MFCC spectrogram of the voice signal by a deep learning model, the pathological condition of the voice signal including normal, unilateral vocal paralysis, adductor spasmodic dysphonia, vocal atrophy, and organic vocal fold lesions.

Abstract: An approach is provided that retrieves fingerprint configuration sets corresponding to a received data source and uses the configuration sets to generate fingerprints that correspond to the data source. These fingerprints are compared to a number of fingerprints that are stored in a repository. If a match is found, then the data quality configuration set is retrieved from the repository and used to perform a data quality analysis. On the other hand, if a match is not found, then one of the configuration sets is selected to perform the data quality analysis on the received data source and the repository is updated so that the selected fingerprint configuration set corresponds to the received data source.

Abstract: An integrated circuit (IC) with through-circuit vias (TCVs) and methods of forming the same are disclosed. The IC includes a semiconductor device, first and second interconnect structures disposed on first and second surfaces of the semiconductor device, respectively, first and second inter-layer dielectric (ILD) layers disposed on front and back surfaces of the substrate, respectively, and a TCV disposed within the first and second interconnect structures, the first and second ILD layers, and the substrate. The TCV is spaced apart from the semiconductor device by a portion of the substrate and portions of the first and second ILD layers. A first end of the TCV, disposed over the front surface of the substrate, is connected to a conductive line of the first interconnect structure and a second end of the TCV, disposed over the back surface of the substrate, is connected to a conductive line of the second interconnect structure.

Abstract: The present disclosure is directed to a wafer drying system and method that detects airborne molecular contaminants in a drying gas as a feedback parameter for a single wafer or multi-wafer drying process. For example, the system comprises a wafer drying station configured to dispense a drying gas over one or more wafers to dry the one or more wafers, a valve configured to divert the drying gas to a first portion and a second portion, and an exhaust line configured to exhaust the first portion of the drying gas. The system further comprises a detector configured to receive the second portion of the drying gas and to determine a real time property of the second portion of the drying gas, and a control unit configured to control a feedback operation of the wafer drying station based on the real time property of the second portion of the drying gas.

Abstract: A transistor includes: a substrate including an active area; a gate structure penetrating through the active area and including a gate and a gate dielectric layer, in which the gate dielectric layer covers sidewalls and a bottom of the gate; a channel layer located on a side of the gate dielectric layer away from the gate, in which the channel layer includes a metal oxide semiconductor layer, in which the active area includes a first active layer and a second active layer located at two sides of the gate structure, and the first active layer and the second active layer are in contact with the channel layer.

Abstract: An information handling system includes a palm rest portion of a keyboard cover, a touchpad holder, and a spring plate. The spring plate includes a main frame in physical communication with the palm rest portion, and first and second spring arms in physical communication with the touchpad holder. In response to a force being exerted on any area of the touchpad holder, the first and second spring arms transition from a resting position to a clicked position.

Abstract: An image lens assembly includes five lens elements, which are, in order from an object side to an image side along an optical path, a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element has positive refractive power. The third lens element has negative refractive power. The fourth lens element with positive refractive power has an object-side surface being convex in a paraxial region thereof and an image-side surface being convex in a paraxial region thereof. The fifth lens element has an object-side surface being convex in a paraxial region thereof and an image-side surface being concave in a paraxial region thereof. The image-side surface of the fifth lens element includes at least one convex critical point in an off-axis region thereof.

Abstract: An intellectual quality management method is disclosed. A heatmap risk interface is created according to the required data and the parameter configuration which are calculated using a time dependent risk priority number (RPN) equation. An intellectual audit scheduling algorithm is defined via the heatmap risk interface to automatically generate at least one audit plan. An audit program corresponding to the audit plan is performed and a plurality of problem points are selected. Intellectual root cause category recommendation is performed to the questions points. intellectual corrective actions and preventive action recommendations are performed to the problem points according to the intellectual root cause category recommendation to obtain at least one optimum corrective action and at least one preventive action.

Abstract: A p-GaN high-electron-mobility transistor, includes a substrate, a channel layer stacked on the substrate, a supply layer stacked on the channel layer, a first doped layer stacked on the supply layer, a second doped layer stacked on the first doped layer, and a third doped layer stacked on the second doped layer. A doping concentration of the first doped layer and the doping concentration of the third doped layer are lower than a doping concentration of the second doped layer. A gate is located on the third doped layer, and a source and a drain are electrically connected to the channel layer and the supply layer, respectively.

Abstract: The present disclosure relates to an image sensor integrated chip (IC). The image sensor IC includes one or more interconnects arranged within an inter-level dielectric (ILD) structure on a first side of a substrate. An image sensing element is arranged within the substrate. Sidewalls of the substrate form one or more trenches extending from a second side of the substrate to within the substrate on opposing sides of the image sensing element. A dielectric structure is arranged on the sidewalls of the substrate that form the one or more trenches. A conductive core is arranged within the one or more trenches and is laterally separated from the substrate by the dielectric structure. The conductive core is electrically coupled to the one or more interconnects.

Abstract: An MRAM memory cell includes a substrate and a transistor. The transistor includes: first and second source regions; a drain region between the first and second source regions; a first channel region between the drain region and the first source region; a second channel region between the drain region and the second source region; a first gate structure over the first channel region; and a second gate structure over the second channel region. A magnetic tunnel junction is overlying the transistor. The drain region is coupled to the magnetic tunnel junction. A first metal layer is overlying the transistor, and a second metal layer is overlying the first metal layer. The second and first metal layers couple a common source line signal to the first and second source regions of the MRAM memory cell and to those of a neighboring MRAM memory cell.

Abstract: A wide area atmospheric pressure plasma device includes a metal casing, a metal electrode, and a dielectric layer. The metal casing includes a chamber, at least one gas channel, and a plasma jet channel, in which the plasma jet channel is located under the chamber. The metal electrode is disposed within the chamber, is adjacent to the plasma jet channel, and extends along a length direction of the plasma jet channel. An outlet of the gas channel is adjacent to a bottom of the metal electrode, such that a working gas in the gas channel is sprayed towards the bottom of the metal electrode. The dielectric layer wraps the metal electrode.

Abstract: An antimicrobial polymer composite is described. The antimicrobial polymer composite comprises a polymer, at least one antimicrobial additive, at least one flame retardant and at least one hydrophobic additive. An apparatus formed from an antimicrobial polymer composite is also described.

Abstract: A spot type atmospheric pressure plasma device includes a metal casing, a metal electrode, a dielectric layer, and a gas channel. The metal electrode is disposed in an inner space of the metal casing. The dielectric layer is disposed in the inner space and surrounds an outer side surface of the metal electrode. A central area of a bottom of the dielectric layer has a plasma jet, and a bottom of the metal electrode is adjacent to the plasma jet. The gas channel includes a first section, a second section, and a third section. The first section passes through the metal casing and the dielectric layer. The second section is connected to the first section and extends between the dielectric layer and the outer side surface. The third section is connected to the second section, and is configured to direct a working gas to the plasma jet.

Abstract: A method for manufacturing a package includes generating an electric field between an anode and a cathode in an electroplating solution to electroplate a substrate electrically connected to the cathode; depositing metal on a central region of the substrate with a first deposition rate; depositing metal on an outer region of the substrate with a second deposition rate lower than the first deposition rate; and reducing the first deposition rate.

Abstract: An antimicrobial product comprising an inner layer and an outer layer surrounding said inner layer wherein said inner layer is crosslinked. The outer layer includes at least one antimicrobial additive. A process of forming such antimicrobial product using extrusion is described.

Abstract: Some implementations described herein include operating components in a lithography system at variable speeds to reduce, minimize, and/or prevent particle generation due to rubbing of or collision between contact parts of the components. In some implementations, a component in a path of transfer of a semiconductor substrate in the lithography system is operated at a relatively high movement speed through a first portion of an actuation operation, and is operated at a reduced movement speed (e.g., a movement speed that is less than the high movement speed) through a second portion of the actuation operation in which contact parts of the component are to interact. The reduced movement speed reduces the likelihood of particle generation and/or release from the contact parts when the contact parts interact, while the high movement speed provides a high semiconductor substrate throughput in the lithography system.

Abstract: An imaging optical lens assembly includes four lens elements which are, in order from an object side to an image side: a first lens element, a second lens element, a third lens element and a fourth lens element. Each of the four lens elements has an object-side surface facing toward the object side and an image-side surface facing toward the image side. At least one of all lens surfaces of the four lens elements is aspheric and has at least one inflection point.

Abstract: A transferring preview stream method provides services to share a preview stream from one client selecting a function of taking photos or videos to another client selecting a function of preview. Clients engaging in a communication session and executing a camera function are configured to periodically receive current location information provided by their location-aware components and transfer it to system for establishing a predetermined area based on their current location information, camera function group and relationship table. The method may be intended to set up transmission sessions between clients in the camera function group for transferring preview streams from clients selecting the function of taking photos or videos to another clients selecting the function of preview.