Patents by Inventor Chun Wang

Chun Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reaction gas supply system and control method thereof
    Patent number: 11708636
    Abstract: Embodiments of the present disclosure provide a reaction gas supply system and a control method. The reaction gas supply system includes a plurality of precursor containers and a plurality of supply regulator devices. The precursor container is connected to at least one of the reaction chambers. The plurality of precursor containers include at least a pair of precursor containers of an arbitrary combination. A supply regulator device is arranged between each pair of precursor containers. The supply regulator device is configured to connect the corresponding pair of precursor containers. With the reaction gas supply system and the control method of the present disclosure, the reaction gas may be ensured to be supplied stably, the utilization rate of the precursor may be increased, and the production efficiency and the product quality may be increased.
    Type: Grant
    Filed: March 31, 2020
    Date of Patent: July 25, 2023
    Assignee: BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
    Inventors: Chun Wang, Bo Zheng, Zhenguo Ma, Jing Wang, Xin Wu, Xiaojuan Wang, Jing Shi
  • Metal reflector grounding for noise reduction in light detector
    Patent number: 11705474
    Abstract: The problem of reducing noise in image sensing devices, especially NIR detectors, is solved by providing ground connections for the reflectors. The reflectors may be grounded through vias that couple the reflectors to grounded areas of the substrate. The grounded areas of the substrate may be P+ doped areas formed proximate the surface of the substrate. In particular, the P+ doped areas may be parts of photodiodes. Alternatively, the reflectors may be grounded through a metal interconnect structure formed over the front side of the substrate.
    Type: Grant
    Filed: June 17, 2021
    Date of Patent: July 18, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yen-Ting Chiang, Ching-Chun Wang, Dun-Nian Yaung, Jen-Cheng Liu, Jhy-Jyi Sze, Shyh-Fann Ting, Yimin Huang
  • Backlight module and display apparatus
    Patent number: 11698553
    Abstract: A backlight module including a circuit substrate, a plurality of light-emitting devices, a first cholesteric liquid-crystal layer, and a second cholesteric liquid-crystal layer is provided. The light-emitting devices are disposed on the circuit substrate and electrically connected to the circuit substrate. The first cholesteric liquid-crystal layer is disposed on the light-emitting devices and overlapped with a light-emitting surface of each of the light-emitting devices. The second cholesteric liquid-crystal layer is disposed on the first cholesteric liquid-crystal layer and overlapped with the first cholesteric liquid-crystal layer. The first cholesteric liquid-crystal layer and the second cholesteric liquid-crystal layer respectively have a first chiral direction and a second chiral direction. A display apparatus adopting the backlight module is also provided.
    Type: Grant
    Filed: November 1, 2022
    Date of Patent: July 11, 2023
    Assignee: Coretronic Corporation
    Inventors: Chung-Yang Fang, Ping-Yen Chen, Chih-Jen Tsang, Chung-Wei Huang, Bo-Han Cheng, Wen-Chun Wang
  • PROTECTIVE FILM STRUCTURE AND E-PAPER DISPLAY DEVICE
    Publication number: 20230213834
    Abstract: An e-paper display device includes a driving substrate, an e-paper film, and a protective film structure. The e-paper film is arranged on a surface of the driving substrate. The protective film structure is arranged on the driving substrate and includes a laminated structure including a base material layer, a barrier layer and a waterproof adhesive layer. The barrier layer is located between the base material layer and the waterproof adhesive layer, and the protective film structure is arranged on the driving substrate through the waterproof adhesive layer and covering the e-paper film. The protective film structure has a main portion and an extension portion arranged around the main portion. The main portion is attached to the top surface of the e-paper film, and the extension portion is attached to the surface of the driving substrate.
    Type: Application
    Filed: April 29, 2022
    Publication date: July 6, 2023
    Inventors: CHIN-AN YANG, YEW-CHUN WANG
  • OPTICAL STRUCTURE FILM AND LIGHT SOURCE MODULE
    Publication number: 20230204846
    Abstract: An optical structure film and a light source module are provided. The optical structure film includes multiple optical unit microstructures. Each of the optical unit microstructures has four side surfaces and an inwardly concave beam splitting surface. The beam splitting surface is respectively connected to the side surfaces, and the beam splitting surface has four endpoints when viewed from a front viewing angle. Connection lines of the four endpoints form a rectangle. The beam splitting surface includes at least one beam splitting curved surface. A junction of the at least one beam splitting curved surface and one of the four side surfaces is a first line segment. A projection of a midpoint of an edge of the rectangle on the beam splitting surface overlaps with a relative extreme point of the first line segment.
    Type: Application
    Filed: December 1, 2022
    Publication date: June 29, 2023
    Applicant: Coretronic Corporation
    Inventors: Wen-Chun Wang, Chih-Jen Tsang, Chung-Wei Huang
  • Bandwidth Extension Indication And Negotiation In Wireless Communications
    Publication number: 20230199848
    Abstract: A first station (STA) and a second STA perform bandwidth negotiation with a bandwidth extension indication. Then the first STA and the second STA communicate wirelessly according to the bandwidth negotiation.
    Type: Application
    Filed: February 23, 2023
    Publication date: June 22, 2023
    Inventors: Kai Ying Lu, Yongho Seok, James Chih-Shi Yee, Chao-Chun Wang, Jianhan Liu
  • Light source module including penetrating light selection layer
    Patent number: 11681087
    Abstract: A light source module includes at least one light-emitting element, a first optical layer, a penetrating light selection layer, a second optical layer, a light splitting layer, and a wavelength conversion layer. The light-emitting element is configured to provide a beam with a wavelength falling within a first wavelength band. An exit angle at which the beam exits the first optical layer is greater than an incident angle at which the beam is incident to the first optical layer. The penetrating light selection layer may allow light with a wavelength falls within a second wavelength band to pass through and has corresponding transmittance for light with a wavelength falling within the first wavelength band and is incident at different incident angles. An exit angle at which the beam exits the second optical layer is less than an incident angle at which the beam is incident to the second optical layer.
    Type: Grant
    Filed: April 25, 2022
    Date of Patent: June 20, 2023
    Assignee: Coretronic Corporation
    Inventors: Wen-Chun Wang, Chih-Jen Tsang, Chung-Wei Huang
  • TECHNIQUES TO USE A NEURAL NETWORK TO EXPAND AN IMAGE
    Publication number: 20230186428
    Abstract: Apparatuses, systems, and techniques for texture synthesis from small input textures in images using convolutional neural networks. In at least one embodiment, one or more convolutional layers are used in conjunction with one or more transposed convolution operations to generate a large textured output image from a small input textured image while preserving global features and texture, according to various novel techniques described herein.
    Type: Application
    Filed: February 6, 2023
    Publication date: June 15, 2023
    Inventors: Guilin Liu, Andrew Tao, Bryan Christopher Catanzaro, Ting-Chun Wang, Zhiding Yu, Shiqiu Liu, Fitsum Reda, Karan Sapra, Brandon Rowlett
  • Method of manufacturing semiconductor devices
    Patent number: 11677012
    Abstract: In a method for manufacturing a semiconductor device, fin structures each having an upper portion and a lower portion, are formed. The lower portion is embedded in an isolation insulating layer disposed over a substrate and the upper portion protrudes the isolation insulating layer. A gate dielectric layer is formed over the upper portion of each of the fin structures. A conductive layer is formed over the gate dielectric layer. A cap layer is formed over the conductive layer. An ion implantation operation is performed on the fin structures with the cap layer. The ion implantation operation is performed multiple times using different implantation angles to introduce ions into one side surface of each of the fin structures.
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: June 13, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Tsan-Chun Wang, Chun-Feng Nieh, Chiao-Ting Tai
  • MULTI-LINK TIME SYNCHRONIZATION IN A WIRELSS NETWORK
    Publication number: 20230180161
    Abstract: Embodiments of the present invention are drawn to systems, apparatus and methods that provide TSF information for a non-primary link to a non-AP STA operating on a primary link to avoid IDC interference and improve wireless throughput and efficiency. The TSF information includes a TSF offset value used to determining the timing of subsequent transmissions over different wireless links. The TSF offset value can be carried in a beacon frame, probe response frame, association frame, through a Reduced Neighbor Report element or a multi-link element, for example. Beacon frames can include timestamp and TSF offset information transmitted periodically. Some wireless links may share a TSF clock or have fixed TSF offsets.
    Type: Application
    Filed: December 1, 2022
    Publication date: June 8, 2023
    Inventors: Kai Ying Lu, Chao-Chun Wang, James Chih-Shi Yee
  • Redistribution layer features
    Patent number: 11670594
    Abstract: Semiconductor structures and method of forming the same are provided. A semiconductor structure according to the present disclosure includes a contact feature in a dielectric layer, a passivation structure over the dielectric layer, a conductive feature over the passivation structure, a seed layer disposed between the conductive feature and the passivation structure, a protecting layer disposed along sidewalls of the conductive feature, and a passivation layer over the conductive feature and the protecting layer.
    Type: Grant
    Filed: May 5, 2021
    Date of Patent: June 6, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wen-Chun Wang, Tzy-Kuang Lee, Chih-Hsien Lin, Ching-Hung Kao, Yen-Yu Chen
  • Semiconductor device structure with barrier layer
    Patent number: 11670704
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a dielectric structure over the substrate. The semiconductor device structure includes a contact structure passing through the dielectric structure. The contact structure includes a contact layer, a first barrier layer, and a second barrier layer. The first barrier layer surrounds the contact layer, the second barrier layer surrounds a first upper portion of the first barrier layer, the contact layer passes through the first barrier layer and extends into the dielectric structure, and the first barrier layer passes through the second barrier layer and extends into the dielectric structure.
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: June 6, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Yang Wu, Shiu-Ko Jangjian, Ting-Chun Wang, Yung-Si Yu
  • Optical lens assembly, image capturing unit and electronic device
    Patent number: 11662551
    Abstract: An optical lens assembly includes four lens elements which are, in order from an object side to an image side along an imaging optical path: a first lens element, a second lens element, a third lens element and a fourth lens element. The first lens element has positive refractive power. The second lens element has an image-side surface being concave in a paraxial region thereof. The third lens element has an object-side surface being concave in a paraxial region thereof. The fourth lens element with negative refractive power has an object-side surface being convex in a paraxial region thereof and an image-side surface being concave in a paraxial region thereof, and at least one of the object-side surface and the image-side surface of the fourth lens element has at least one inflection point in an off-axis region thereof.
    Type: Grant
    Filed: March 10, 2020
    Date of Patent: May 30, 2023
    Assignee: LARGAN PRECISION CO., LTD.
    Inventors: Kuo-Jui Wang, Kuan Chun Wang, Hung-Shuo Chen, Jin Sen Wang, Syuan Ruei Lai, Wei-Yu Chen
  • Interconnect structure with dielectric cap layer and etch stop layer stack
    Patent number: 11658064
    Abstract: A method of forming a semiconductor device includes: forming a first conductive feature in a first dielectric layer disposed over a substrate; forming a metal cap layer over an upper surface of the first conductive feature distal from the substrate; selectively forming a dielectric cap layer over an upper surface of the first dielectric layer and laterally adjacent to the metal cap layer, wherein the metal cap layer is exposed by the dielectric cap layer; and forming an etch stop layer stack over the metal cap layer and the dielectric cap layer, wherein the etch stop layer stack comprises a plurality of etch stop layers.
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: May 23, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chao-Chun Wang, Jen Hung Wang
  • TWO-PHASE IMMERSION COOLING DEVICE WITH MOVABLE SECOND CONDENSER
    Publication number: 20230156961
    Abstract: A two-phase immersion cooling device includes a tank, heating elements, a first condenser, and a lid. An accommodating cavity of the tank bottom accommodates a coolant. The heating elements are disposed in the accommodating cavity and immersed in the coolant. The first condenser is received in the accommodating cavity, located above the coolant and the heating elements, and disposed along sidewalls of the tank. At least one movable second condenser is fixed on the lid or a rear door and disposed in a cavity surrounded by the first condenser. The two-phase immersion cooling device increases the capacity of condensation heat transfer, and the condensation rate and the evaporation rate of the coolant in the tank are balanced, a pressure difference between an inside and an outside of the tank is reduced, a loss of coolant vapor is decreased, and a volume of the two-phase immersion cooling device is reduced.
    Type: Application
    Filed: February 17, 2022
    Publication date: May 18, 2023
    Inventors: WARM-HORNG YUAN, Chun Wang, SHAO-YI WEN
  • Toy gun and toy gun assembly
    Publication number: 20230152060
    Abstract: A toy gun and a toy gun assembly are provided. The toy gun includes a gun body; a first power supply, a first printed circuit board (PCB), an infrared emitter, a first infrared receiver, a first vibration motor, a trigger, a first display module and a first speaker are arranged in the gun body; the gun body has a gun body portion and a handle portion; the first vibration motor corresponds to the handle portion; and the first display module is exposed from an outer side of the gun body and is disposed towards the upper rear side in a displaying manner.
    Type: Application
    Filed: January 23, 2023
    Publication date: May 18, 2023
    Inventor: Chun Wang
  • High Voltage Controller
    Publication number: 20230156887
    Abstract: A high voltage controller contains: a casing and a wire receiving orifice defined on a predetermined position of the casing and configured to receive a preferred wire and to connect with a predetermined light-emitting diode (LED) light source. The casing further includes an electric circuit board accommodated therein, and the electric current board includes a wave filter, a rectifier, an inverter which are arranged from a voltage input end to a voltage output end of the electric circuit board, such that the wave filter and the rectifier rectify electric currents, and an alternating current (AC) voltage is rectified into a direct current (DC) voltage. The inverter includes at least one transistor arranged in a matrix so as to invert into the AC voltage, and the AC voltage is outputted, hence the AC voltage and the DC voltage are transformed repeatedly to obtain no-shaking lights.
    Type: Application
    Filed: November 18, 2021
    Publication date: May 18, 2023
    Inventor: Chia-Chun WANG
  • Power Adapter of LED Light String Having Valley-fill Circuit
    Publication number: 20230151954
    Abstract: A power adapter of an LED light string having a valley-fill circuit contains: a casing and a plug fixed on the casing. The casing includes an energy-saving circuit board accommodated therein, wherein the casing further includes a connection portion which is electrically connected with a holiday light string, the energy-saving circuit board includes a wave filter, a rectifier, a valley fill circuit, and a transformer which are arranged from a voltage input end to a voltage output end of the energy-saving circuit board. The valley fill circuit is defined between the rectifier and the wave filter so as to enhance a conduction angle of a rectifying tube and to change input currents from a spike to a waveform close to a sine wave, hence a power factor is close to above 0.7 to reduce a total harmonic distortion and an input loss, thus achieving energy saving.
    Type: Application
    Filed: November 18, 2021
    Publication date: May 18, 2023
    Inventor: Chia-Chun WANG
  • Toy laser gun with target
    Patent number: D988430
    Type: Grant
    Filed: January 10, 2023
    Date of Patent: June 6, 2023
    Inventor: Chun Wang
  • Bag
    Patent number: D989476
    Type: Grant
    Filed: June 17, 2021
    Date of Patent: June 20, 2023
    Assignee: Hualien Armed Forces General Hospital
    Inventors: Ying-Hsin Chen, Mei-Chun Wang, Hsiu-Chu Hsu