Abstract: A semiconductor structure and method of manufacturing a semiconductor structure are provided. The semiconductor structure includes a package structure. The package structure includes a passivation layer formed over an interconnect structure; an electrically-conductive structure formed on the passivation layer and extending through the passivation layer to electrically contact the interconnect structure; a dielectric structure formed over the passivation layer and surrounding the electrically-conductive structure to expose at least a portion of a top surface of the electrically-conductive structure; and a metallic protection structure formed on the top surface of the electrically-conductive structure exposed from the dielectric structure. The top surface of the metallic protection structure is aligned with or lower than a top surface of the dielectric structure.

Abstract: A package component and forming method thereof are provided. The package component includes a substrate and a conductive layer. The substrate includes a first surface. The conductive layer is disposed over the first surface. The conductive layer includes a first conductive feature and a second conductive feature. The second conductive feature covers a portion of the first conductive feature. A resistance of the second conductive feature is lower than a resistance of the first conductive feature.

Abstract: An electromigration (EM) sign-off methodology that utilizes a system for analyzing an integrated circuit design layout to identify heat sensitive structures, self-heating effects, heat generating structures, and heat dissipating structures. The EM sign-off methodology includes a memory and a processor configured for calculating adjustments of an evaluation temperature for a heat sensitive structure by calculating the effects of self-heating within the temperature sensitive structure as well as additional heating and/or cooling as a function of thermal coupling to surrounding heat generating structures and/or heat dissipating elements located within a defined thermal coupling volume or range of the heat sensitive structures.

Abstract: The technology described herein is directed to a DC input power supply unit with an auxiliary boost control circuit (or controller) that facilitates continuous supply of power to a standby output load of the power supply unit in a bootloader mode. More specifically, the auxiliary boost circuit (or controller) is configured to assume control of a primary power boost stage from a primary controller in a bootloader mode so that the power supply unit can continue to supply power to the standby output with a protection function regardless of the state of the power supply unit or primary controller.

Abstract: A vice jaw deflecting structure, comprising a vice main body, a lead screw positioning seat, a lead screw, a first flexible jaw set and a second flexible jaw set; the guide slot of the vice main body has a bottom surface, a first side wall surface, and a second side wall surface; the first flexible jaw set and the second flexible jaw set have a slide, a jaw and a limiting component; the slide is configured with a limiting block protruding toward the jaw, the limiting block protrudes toward the lead screw positioning seat and is formed with a -shaped stop block having a curved top view; the jaw bottom surface has a first convex wall surface and a second convex wall surface matching and contacting the first side wall surface and the second side wall surface.

Abstract: A head-mounted display device assembly and an external adjustment module are provided. The head-mounted display device assembly includes a head-mounted display device and the external adjustment module. The head-mounted display device has a first lens and a second lens corresponding to both eyes, and also has a driven mechanism. The first lens and the second lens are respectively coupled to the driven mechanism. The external adjustment module is used for assembling and electrically connecting to the head-mounted display device, and includes a driving element and a transmission element. In a coupling state, the transmission element is coupled to the driving element and the driven mechanism, and the driving element drives the driven mechanism via the transmission element to adjust a distance between the first lens and the second lens. In a separation state, at least one of the driving element and the driven mechanism is separated from the transmission element.

Abstract: Implantation mask formation techniques described herein include increasing an initial aspect ratio of a pattern in an implantation mask by non-lithography techniques, which may include forming a resist hardening layer on the implantation mask. The pattern may be formed by photolithography techniques to the initial aspect ratio that reduces or minimizes the likelihood of pattern collapse during formation of the pattern. Then, the resist hardening layer is formed on the implantation mask to increase the height of the pattern and reduce the width of the pattern, which increases the aspect ratio between the height of the openings or trenches and the width of the openings or trenches of the pattern. In this way, the pattern in the implantation mask may be formed to an ultra-high aspect ratio in a manner that reduces or minimizes the likelihood of pattern collapse during formation of the pattern.

Abstract: A retiming circuit module, a signal transmission system, and a signal transmission method are provided. The retiming circuit module includes a path control circuit and a multipath signal transmission circuit. The multipath signal transmission circuit includes built-in first signal transmission path and second signal transmission path. The multipath signal transmission circuit may perform first signal transmission between an upstream device and a downstream device based on a first signal transmission frequency and the second signal transmission path. During a period of performing the first signal transmission, the path control circuit may detect a first data sequence transmitted between the upstream device and the downstream device.

Abstract: An easy-lock connector with unlock structure includes a rubber core, a housing and plural terminals. The rubber core includes a first body, acting parts and terminal grooves in which the terminals are arranged. Each of the action parts includes a first stop body and a third stop body. An opening is formed between the first stop body and the third stop body. The housing includes a second body and pressing parts. When the action parts are pressed by an external force, the action parts will be deformed. Then, a flexible printed circuit board will be unlocked on the first body, and the action parts are stopped by the first stop body and the third stop body to stop continuing to deform. When the action parts are not pressed by the external force, the circuit board is locked on the first body.

Abstract: A head-mounted display device, including a front assembly and a wearable assembly, is provided. The wearable assembly is connected to the front assembly and is adapted for wearing the front assembly to a user's face. The wearable assembly includes a cradle, a coupling mechanism, multiple side headbands, a button, and a position returning member. When the button is pressed relative to the cradle, the button drives the coupling mechanism not to be coupled to the side headbands, so that the side headbands can move freely relative to the cradle to adjust the distance between the cradle and the front assembly. When the button is released relative to the cradle, the position returning member drives the coupling mechanism to be coupled to the side headbands, and tighten the side headbands relative to the cradle through the coupling mechanism.

Abstract: A module connector comprising a first connecting component and a second connecting component. The first connecting component includes a first base, a plurality of first conductors and a plurality of first clamping parts. The first base includes a first body, a plurality of first cable grooves, a plurality of first through holes and a plurality of third cable grooves. The first body forms the first cable grooves and the third cable grooves to be able to accommodate the cables. The central axes of the first through holes are at a first angle with the first cable grooves and pass through the first body, and one ends of the first through holes communicate with the first cable grooves. The first conductors are disposed in the first cable grooves. The second connecting component can connect with the first connecting component through the cables, so that at least one of signals and power can be transmitted between the second connecting component and the circuit board.

Abstract: A head-mounted display device, including a front assembly and a wearable assembly, is provided. The wearable assembly is connected to the front assembly and is adapted for wearing the front assembly to a user's face. The wearable assembly includes a cradle, a coupling mechanism, multiple side headbands, a button, and a position returning member. When the button is pressed relative to the cradle, the button drives the coupling mechanism not to be coupled to the side headbands, so that the side headbands can move freely relative to the cradle to adjust the distance between the cradle and the front assembly. When the button is released relative to the cradle, the position returning member drives the coupling mechanism to be coupled to the side headbands, and tighten the side headbands relative to the cradle through the coupling mechanism.

Abstract: An electromigration (EM) sign-off methodology that analyzes an integrated circuit design layout to identify heat sensitive structures, self-heating effects, heat generating structures, and heat dissipating structures. The EM sign-off methodology includes adjustments of an evaluation temperature for a heat sensitive structure by calculating the effects of self-heating within the temperature sensitive structure as well as additional heating and/or cooling as a function of thermal coupling to surrounding heat generating structures and/or heat sink elements located within a defined thermal coupling volume or range.

Abstract: Implantation mask formation techniques described herein include increasing an initial aspect ratio of a pattern in an implantation mask by non-lithography techniques, which may include forming a resist hardening layer on the implantation mask. The pattern may be formed by photolithography techniques to the initial aspect ratio that reduces or minimizes the likelihood of pattern collapse during formation of the pattern. Then, the resist hardening layer is formed on the implantation mask to increase the height of the pattern and reduce the width of the pattern, which increases the aspect ratio between the height of the openings or trenches and the width of the openings or trenches of the pattern. In this way, the pattern in the implantation mask may be formed to an ultra-high aspect ratio in a manner that reduces or minimizes the likelihood of pattern collapse during formation of the pattern.

Abstract: In some embodiments, the present disclosure relates to method for forming an image sensor integrated chip. The method includes forming a first photodetector region in a substrate and forming a second photodetector region in the substrate. A floating diffusion node is formed in the substrate between the first photodetector region and the second photodetector region. A pick-up well contact region is formed in the substrate. A first line intersects the floating diffusion node and the pick-up well contact region. One or more transistor gates are formed on the substrate. A second line that is perpendicular to the first line intersects the pick-up well contact region and the one or more transistor gates.

Abstract: A method of making a semiconductor device includes defining a first fin structure over a major surface of a substrate, wherein the first fin includes a first material. The method includes defining a second fin structure over the major surface of the substrate. Defining the second fin structure includes forming a lower portion of the second fin structure, closest to the substrate, having the first material, and forming an upper portion of the second fin structure, farthest from the substrate, having a second material different from the first material. The method includes forming a dielectric material over the substrate and between the first and second fin structures. The method includes removing the upper portion of the second fin structure, wherein removing the upper portion of the second fin structure includes reducing a height of the second fin structure to be less than a height of the first fin structure.

Abstract: An easy-lock connector with unlock structure includes a rubber core, a housing and plural terminals. The rubber core includes a first body, acting parts and terminal grooves in which the terminals are arranged. Each of the action parts includes a first stop body and a third stop body. An opening is formed between the first stop body and the third stop body. The housing includes a second body and pressing parts. When the action parts are pressed by an external force, the action parts will be deformed. Then, a flexible printed circuit board will be unlocked on the first body, and the action parts are stopped by the first stop body and the third stop body to stop continuing to deform. When the action parts are not pressed by the external force, the circuit board is locked on the first body.

Abstract: A retiming circuit module, a signal transmission system and a signal transmission method are disclosed. The retiming circuit module includes a path control circuit and a multipath signal transmission circuit. The multipath signal transmission circuit includes a plurality of parallel signal transmission paths. The path control circuit is configured to control the multipath signal transmission circuit to perform signal transmission between an upstream device and a downstream device based on a first parallel signal transmission path in the parallel signal transmission paths during a period of a handshake operation performed between the upstream device and the downstream device. The path control circuit is further configured to control the multipath signal transmission circuit to perform the signal transmission based on a second parallel signal transmission path in the parallel signal transmission paths after the handshake operation is finished.

Abstract: A phase-change memory (PCM) cell is provided to include a first electrode, a second electrode, and a phase-change feature disposed between the first electrode and the second electrode. The phase-change feature is configured to change its data state based on a write operation performed on the PCM cell. The write operation includes a reset stage and a set stage. In the reset stage, a plurality of reset current pulses are applied to the PCM cell, and the reset current pulses have increasing current amplitudes. In the set stage, a plurality of set current pulses are applied to the PCM cell, and the set current pulses exhibit an increasing trend in current amplitude. The current amplitudes of the set current pulses are smaller than those of the reset current pulses.

Abstract: A semiconductor device includes a semiconductor stack, a third semiconductor structure, a dielectric layer, and a reflective layer under the third semiconductor structure. The semiconductor stack includes a first semiconductor structure, an active structure, a second semiconductor structure. The first semiconductor structure has a first surface which includes a first portion and a second portion, and the first surface has a first area. The third semiconductor structure connects to the first portion, and has a second surface with a second area. The dielectric layer connects to the second portion and includes a plurality of openings, and the plurality of openings have a third area. A ratio of the second area to the first area is between 0.1˜0.7, and a ratio of the third area to the first area is less than 0.2.