Abstract: An electromigration (EM) sign-off methodology that analyzes an integrated circuit design layout to identify heat sensitive structures, self-heating effects, heat generating structures, and heat dissipating structures. The EM sign-off methodology includes adjustments of an evaluation temperature for a heat sensitive structure by calculating the effects of self-heating within the temperature sensitive structure as well as additional heating and/or cooling as a function of thermal coupling to surrounding heat generating structures and/or heat sink elements located within a defined thermal coupling volume or range.

Abstract: A light-emitting device includes a first semiconductor layer having an uppermost surface and a bottommost surface; a first light-emitting structure and a second light-emitting structure formed on the same first semiconductor layer, wherein the first semiconductor layer is continuous; a first trench formed between the first and the second light-emitting structures; and a second electrode formed on the second semiconductor layer and including a second pad and a plurality of second extending parts extending from the second pad; wherein the second pad is between the first and the second light-emitting structures, and the plurality of second extending parts extends to the first and the second light-emitting structures, respectively; wherein the first trench passes through the uppermost surface but does not extend to the bottommost surface; wherein the first trench includes an equal width in a top view.

Abstract: A modular side-by-side vise structure including a base, a fixture block group located on the base, and a side clamping piece group; the side clamping piece has an upper part and a lower part, and a bolt is screwed in the upper part to prop the lower part, so that the stopper and movable fixture block cling to the base tightly; or the side grooves on both sides of the stopper and movable fixture block are provided with bolt holes, and the inner wall of side clamping piece is provided with a punch hole, the bolt is screwed in the bolt hole through the punch hole, so that the stopper and movable fixture block cling to the base tightly. Therefore, it is unnecessary to hold up the side clamping piece with a hand while tightening or loosening the bolt, favorable for the technician to implement quick assembly or disassembly.

Abstract: The present disclosure provides a source driver module for driving a display panel. The source drive module includes a source driver circuit, a first conductive wire and a first switch unit. The first conductive wire is electrically connected to the source driver circuit. The first switch unit is connected between the first conductive wire and a first data line of the display panel to conduct current therebetween during a first data outputting period and a second data outputting period, and to interrupt current therebetween during a first switch-off period connecting the first data outputting period and the second data outputting period. The source driver circuit outputs a first voltage signal during the first data outputting period and the first switch-off period; it outputs a second voltage signal during the second data outputting period; and it outputs the first voltage signal during the first switch-off period.

Abstract: In some embodiments, a pixel sensor is provided. The pixel sensor includes a first photodetector arranged in a semiconductor substrate. A second photodetector is arranged in the semiconductor substrate, where a first substantially straight line axis intersects a center point of the first photodetector and a center point of the second photodetector. A floating diffusion node is arranged in the semiconductor substrate at a point that is a substantially equal distance from the first photodetector and the second photodetector. A pick-up well contact region is arranged in the semiconductor substrate, where a second substantially straight line axis that is substantially perpendicular to the first substantially straight line axis intersects a center point of the floating diffusion node and a center point of the pick-up well contact region.

Abstract: An electromigration (EM) sign-off methodology that analyzes an integrated circuit design layout to identify heat sensitive structures, self-heating effects, heat generating structures, and heat dissipating structures. The EM sign-off methodology includes adjustments of an evaluation temperature for a heat sensitive structure by calculating the effects of self-heating within the temperature sensitive structure as well as additional heating and/or cooling as a function of thermal coupling to surrounding heat generating structures and/or heat sink elements located within a defined thermal coupling range.

Abstract: A first photoresist pattern and a second photoresist pattern are formed over a substrate. The first photoresist pattern is separated from the second photoresist pattern by a gap. A chemical mixture is coated on the first and second photoresist patterns. The chemical mixture contains a chemical material and surfactant particles mixed into the chemical material. The chemical mixture fills the gap. A baking process is performed on the first and second photoresist patterns, the baking process causing the gap to shrink. At least some surfactant particles are disposed at sidewall boundaries of the gap. A developing process is performed on the first and second photoresist patterns. The developing process removes the chemical mixture in the gap and over the photoresist patterns. The surfactant particles disposed at sidewall boundaries of the gap reduce a capillary effect during the developing process.

Abstract: The present invention discloses a buckle connector connecting a main board and a sub-board. The buckle connector includes a first connecting portion and a second connecting portion. The first connecting portion mainly provides a first coupling member and the second connecting portion mainly provides a second coupling member. The first connecting portion and the second connecting portion are disposed on the same plane by coupling the first coupling member and the second coupling member when the first connecting portion moves to the second connecting portion in one direction.

Abstract: A display panel includes multiple data lines, a scan lines, pixel circuit and a driving circuit. The data lines are configured to receive multiple data signals in a display period. There is a buffer period before the display period. The scan line is configured to receive a scan signal during the display period. The pixel circuit is electrically connected to the data lines and the scan line for receiving the data signals and the scan signal. The driving circuit is electrically connected to the data line, and configured to receive multiple charging signals during the buffer period. The charging signals are corresponding to the data lines and gradually increase so that the driving circuit charges the data lines according to the charging signals.

Abstract: A method includes depositing a contact etch stop layer (CESL) over a gate, a source/drain (S/D) region and an isolation feature. The method includes performing a first chemical mechanical planarization (CMP) to expose the gate. The method further includes performing a second CMP using a slurry different from the first CMP to expose the CESL over the S/D region, wherein, following the second CMP, an entire top surface of the CESL over the S/D region and over the isolation feature is substantially level with a top surface of the gate.

Abstract: In some embodiments, a pixel sensor is provided. The pixel sensor includes a first photodetector arranged in a semiconductor substrate. A second photodetector is arranged in the semiconductor substrate, where a first substantially straight line axis intersects a center point of the first photodetector and a center point of the second photodetector. A floating diffusion node is arranged in the semiconductor substrate at a point that is a substantially equal distance from the first photodetector and the second photodetector. A pick-up well contact region is arranged in the semiconductor substrate, where a second substantially straight line axis that is substantially perpendicular to the first substantially straight line axis intersects a center point of the floating diffusion node and a center point of the pick-up well contact region.

Abstract: A touch display panel includes a pixel array, a touch module, and a multiplexer circuit. The pixel array includes a plurality of pixels, a plurality of gate lines, and a plurality of source lines. The pixels are electrically coupled to the source lines and the gate lines. The touch module and the pixel array are overlapped. The multiplexer circuit is coupled between all of the source lines and a source driver and has a plurality of multiplexers. The multiplexers are respectively coupled to n source lines and respectively include a plurality of switches and a bypass trace. The switches are respectively coupled between the first source line to the (n?1)th source line of the n source lines and the source drivers. The bypass trace is coupled between the nth source line of the n source lines and the source driver.

Abstract: A first photoresist pattern and a second photoresist pattern are formed over a substrate. The first photoresist pattern is separated from the second photoresist pattern by a gap. A chemical mixture is coated on the first and second photoresist patterns. The chemical mixture contains a chemical material and surfactant particles mixed into the chemical material. The chemical mixture fills the gap. A baking process is performed on the first and second photoresist patterns, the baking process causing the gap to shrink. At least some surfactant particles are disposed at sidewall boundaries of the gap. A developing process is performed on the first and second photoresist patterns. The developing process removes the chemical mixture in the gap and over the photoresist patterns. The surfactant particles disposed at sidewall boundaries of the gap reduce a capillary effect during the developing process.

Abstract: A modular side-by-side vise structure comprises a base, a fixture block group located on the base, and a side clamping piece group; the side clamping piece has an upper part and a lower part, and a bolt is screwed in the upper part to prop the lower part, so that the stopper and movable fixture block cling to the base tightly; or the side grooves on both sides of the stopper and movable fixture block are provided with bolt holes, and the inner wall of side clamping piece is provided with a punch hole, the bolt is screwed in the bolt hole through the punch hole, so that the stopper and movable fixture block cling to the base tightly. Therefore, it is unnecessary to hold up the side clamping piece with a hand while tightening or loosening the bolt, favorable for the technician to implement quick assembly or disassembly.

Abstract: A voltage regulator provides a load device with a regulated voltage, and includes a first regulator circuit, a second regulator circuit, a first control loop circuit, and a second control loop circuit. The load device and the first regulator circuit are connected in series. The load device and the second regulator circuit are connected in parallel. The first control loop circuit adaptively adjusts a first bias voltage of the first regulator circuit in response to a load condition at the output node of the voltage regulator, wherein the first control loop circuit includes a capacitor coupled between the first power rail and an output node of a feedback amplifier. The second control loop circuit adaptively adjusts a second bias voltage of the second regulator circuit in response to the load condition at the output node of the voltage regulator.

Abstract: A method includes depositing a contact etch stop layer (CESL) over a gate, a source/drain (S/D) region and an isolation feature. The method includes performing a first chemical mechanical planarization (CMP) to expose the gate. The method further includes performing a second CMP using a slurry different from the first CMP to expose the CESL over the S/D region, wherein, following the second CMP, an entire top surface of the CESL over the S/D region and over the isolation feature is substantially level with a top surface of the gate.

Abstract: A semiconductor integrated circuit device includes a chip main circuit, a damper and a passive component. The chip main circuit is coupled to a power source and performs a predetermined function. The damper is coupled to an output terminal of the chip main circuit. The passive component is coupled to the chip main circuit via the damper.

Abstract: An electromigration (EM) sign-off methodology that analyzes an integrated circuit design layout to identify heat sensitive structures, self-heating effects, heat generating structures, and heat dissipating structures. The EM sign-off methodology includes adjustments of an evaluation temperature for a heat sensitive structure by calculating the effects of self-heating within the temperature sensitive structure as well as additional heating and/or cooling as a function of thermal coupling to surrounding heat generating structures and/or heat sink elements located within a defined thermal coupling range.

Abstract: An adjusting mechanism and a head mounted display are provided. The adjusting mechanism includes a band, a rotating shaft, a knob, a driving member, and a holder. The rotating shaft has a first ring tooth around a central axis. The band is driven by the rotating shaft to move relative to the rotating shaft when the rotating shaft rotates around the central axis. The knob has a plurality of chutes. Each chute has a first section and a second section. The depth of each first section is deeper than the depth of each second section. The driving member has a second ring tooth, a plurality of guiding pins, and a plurality of pawls. The driving member is assembled to the knob, and the guiding pins are located in the chutes. The holder has a circular unidirectional tooth. The band limits the rotation of the holder relative to the band. The circular unidirectional tooth is configured to be coupled with these pawls to limit the rotation of the driving member relative to the holder in a single direction.

Abstract: Implementations of the disclosure provide a method of fabricating an image sensor device. The method includes forming first trenches in a first photoresist layer using a first photomask having a first pattern to expose a first surface of a substrate, directing ions into the exposed first substrate through the first trenches to form first isolation regions in the substrate, removing the first photoresist layer, forming second trenches in a second photoresist layer using a second photomask having a second pattern to expose a second surface of the substrate, the second pattern being shifted diagonally from the first pattern by half mask pitch, directing ions into the exposed second surface through the second trenches to form second isolation regions in the substrate, the first and second isolation regions being alternatingly disposed in the substrate, and the first and second isolation regions defining pixel regions therebetween, and removing the second photoresist layer.