Abstract: An inverter transformer includes a coil unit including a bobbin and a plurality of windings, and a transformer core unit. The bobbin is formed with a core-receiving compartment, and includes first, second and third coil winding portions. The windings are wound around the first, second and third coil winding portions, respectively. The transformer core unit has an internal core part that extends into the core-receiving compartment.

Abstract: An electrical connector includes a frame including at least two supporting arms configuring at least one mounting area, at least one housing unit assembled to the supporting arms and located with the at least one mounting area. An inter-aligning arrangement is arranged between the supporting arms and the at least one housing so as to ensure the at least one housing unit is properly attached to the frame. The inter-aligning arrangement includes at least one groove located at one of the supporting arm and the housing unit, and at least one projection located at the other.

Abstract: A method for adjusting mutual inductance is adapted for use in a transformer including a main core and two windings that are wound on the main core and that have the mutual inductance established therebetween. The method includes the steps of: (A) disposing an adjusting core between the windings and adjacent to the main core, the adjusting core having a cross-sectional area smaller than that of the main core; and (B) without resulting in division of flux of the mutual inductance established between the windings, and division of an exciting magnetic flux into a plurality of independent magnetic paths, adjusting position of the adjusting core relative to the main core to vary the mutual inductance established between the two windings.

Abstract: A socket, adapt for electrically connecting a semiconductor package to a print circuit board, comprises an insulating housing, a plurality of contacts received in the insulating housing and a plurality of solder balls disposed on bottom ends of the contacts. The socket is mounted on the print circuit board by soldering the solder balls to the print circuit board, after that, an accessional member, which is made of epoxy resin, is displaced between the insulating housing and the print circuit board by insert-molding to surround the solder balls.

Abstract: Disclosed is a heat sink module for an electronic device, comprising a substrate having at least a fixed hole, at least a heat sink fin set disposed on the substrate and having a plurality of heat sink fins and at least a resilient plate disposed on the substrate and having at least a mount hole mounting the substrate on an electronic device component in the electronic device in coordination with the fixed hole so that the substrate can be closely bonded to a surface of the electronic component. Further, since the heat sink fin set is formed on the substrate by punching method, an advantage of low cost of the heat sink module is provided.

Abstract: A protective cover with a heat-conductive medium of a heat sink apparatus is provided, which is used to cover and protect the heat-conductive medium placed at the bottom surface of a base of the heat sink apparatus. It includes a sheet-like board, an elastic wall, and an accommodation chamber, wherein the sheet-like board is concave and located at one side of the protective cover with the heat-conductive medium; the elastic wall is extended along the edge of the sheet-like board so as to provide a clipping force for clipping with the heat sink apparatus; and the accommodation chamber is formed by the concave portion of the sheet-like board to mask and cover the heat-conductive medium; while the sheet-like board is clipped to the heat sink apparatus through the elastic wall, such that the accommodation chamber is used to mask and cover the heat-conductive medium.

Abstract: An apparatus (10) for performance testing of heat dissipating modules (19) includes an enclosure (11) configured for receiving the heat dissipating module therein, a vertically movable platform (13) for supporting the enclosure thereon, a boosting mechanism (18) configured for raising the vertically movable platform, and a force gage (12) having a force-sensing portion (121) configured for abutting against a top of the heat dissipating module. The enclosure includes a mounting base (110) having a plurality of mounting holes (1101) defined therein configured for mounting of heat dissipating modules with various sizes thereon. The present heat dissipating module testing apparatus can fit heat dissipating modules with various sizes. Thus saving both cost and time in testing.

Abstract: An injector with a coating head, for uniformly coating a heat sink paste onto a surface to be coated is provided, which includes a body, a piston, and a coating head, wherein the piston is pressed to force the heat sink paste out of the body through the coating head, and the heat sink paste is molded by the coating head into a shape suitable for uniformly coating the surface to be coated, and is also quantified. Moreover, a scraping surface is provided at the opening of the coating head, for scraping off the redundant heat sink paste from the steel plate and for smoothing the surface of the heat sink paste, in the case that a steel plate is used to assist the quantifying operation of the heat sink paste.

Abstract: A folding protective cover structure is used to cover and protect a heat-conductive medium disposed on the bottom surface of a heat sink device. An unfoldable plate body is employed and has a hollow portion, a folding portion, and an adhesive area; wherein the hollow portion is used for surrounding the heat-conductive medium with a frame-fixing plate extending from its edge, which is folded towards an opposite direction of the heat-conductive medium, so as to keep an upright state; the folding portion is folded towards the hollow portion, so that the frame-fixing plate passes through the folding portion to clip and fix the folding portion, thus forming an accommodating space for protecting the heat-conductive medium; and the adhesive area is located at the edge of the hollow portion, facing the surface of the heat sink device, for adhering and securing the plate body to the heat sink device.

Abstract: A protective cover with a heat-conductive medium of a heat sink apparatus is provided, which is used to cover and protect the heat-conductive medium placed at the bottom surface of a base of the heat sink apparatus. It includes a sheet-like board, an elastic wall, and an accommodation chamber, wherein the sheet-like board is concave and located at one side of the protective cover with the heat-conductive medium; the elastic wall is extended along the edge of the sheet-like board so as to provide a clipping force for clipping with the heat sink apparatus; and the accommodation chamber is formed by the concave portion of the sheet-like board to mask and cover the heat-conductive medium; while the sheet-like board is clipped to the heat sink apparatus through the elastic wall, such that the accommodation chamber is used to mask and cover the heat-conductive medium.

Abstract: A heat conducting medium protection device is provided. At least one cutout is formed in a sheet, and the sheet is bent to closely engage the cutouts so as to transform the sheet into a three-dimensional shape and form an accommodating space. When the heat conducting medium protection device is covered on a heat sink coated with a heat conducting medium, the accommodating space accommodates the heat conducting medium for holding the heat conducting medium, thereby making it easy to transmit the heat sink coated with a heat conducting medium.

Abstract: An connector (1) includes an insulative housing (2), and a multiplicity of conductive contacts (3) received in the housing. The housing comprises a mating surface (20) and a mounting surface (21) opposite to the mating surface. The housing defines a plurality of passageways (23) extending vertically therethrough to receive corresponding contacts therein. A seriate stand-offs (24) extends from the two opposite lateral sides of the adjacent passageways on the mounting surface.

Abstract: A dual band antenna includes a metal strip and a feeding leg. The metal strip formed on a substrate further comprises a first band portion and a second band portion, in which a tail of the first band portion is connected to the second band portion. The feeding leg extended from a head of the first band portion is led to connect with a signal processing circuit. The metal strip can be tuned to second frequency band signals, in which the first band portion is purposely tuned to first frequency band signals. Also, the second band portion has a function of adjusting frequencies of the second frequency band.

Abstract: A fixture for grinding machines includes a first base (10) and a second base (20). The first base defines a first workpiece holding groove (11 ) therein, a first side surface (12) is formed corresponding to the first workpiece holding groove, and the first base defines a plurality of first attracting holes (13) on the first side surface. The second base defines a second workpiece holding groove (21) corresponding to the first workpiece holding groove therein, a second side surface (22) is formed corresponding to the second workpiece holding groove, and the second base defines a plurality of second attracting holes (23) on the second side surface.

Abstract: An exemplary heat dissipation apparatus includes a base member and a number of cooling fins. Each of the cooling fins includes a main part and a foot part embedded in the base member, the foot part includes a first portion extending from the main part in the extension direction of the main part and at least one second portion extending at an angle from the first portion. The heat dissipation apparatus has a high heat dissipation efficiency.

Abstract: A range hood comprising a hood body, a ventilation fan inside a continuous pipe; a water container is on the bottom of the hood body, a removable board is on the front side of the hood body, a filter net is in between from inside of the removable board to the continuous pipe. Based on the described above; water level in the water container is above the bottom of the removable board and the filter net, when the ventilation fan is on, air is sucked in from the inlet pipe, the soot is also sucked in; the air flow rushes from water surface and flows from the bottom of the removable board and turns to the filter net, and forms a small water curtain between removable board and the filter net; the present invention achieves washing, sucking particles and dust, prevent fire hazard, water recycling and easy to maintain effect.

Abstract: The present invention discloses a device and a method for measuring heat transfer characteristics of a fluid material. The device includes a measuring assembly, a fluid pressure assembly, and a manometer. The measuring assembly includes a heating member defining a first contact surface, a cooling member defining a second contact surface disposed facing the first contact surface, and a sleeve. The sleeve is configured for hermetically adjoining the heating member and the cooling member and allowing movement of the heating member and the cooling member relative to each other. The sleeve, the first and second contact surfaces cooperatively form a cavity for receiving fluid material to be measured. The fluid pressure assembly is configured for compressing the fluid material into the cavity. The manometer is disposed on either the sleeve or the fluid pressure assembly and is configured for detecting a fluid pressure of the fluid material in the cavity.

Abstract: An apparatus for making thermal interface material includes a container and a stirrer. The container has a cylindrical inner wall and a bottom. The stirrer includes a rotor and a motor for driving the rotation of the rotor. The rotor includes a distal end having a cylindrical side surface separated by predetermined distance from the cylindrical inner wall.

Abstract: A thermal interface material and a making method thereof are disclosed. The thermal interface material includes a thermal conductive substrate having a first surface and an opposing second surface; and at least one organic metal multilayer film formed on at least one of the first and second surfaces. The organic metal multilayer film comprises a plurality of metal layers and a plurality of organic layers. Each of the metal layers and each of the organic layers are alternately linked to one by another. Each of the metal layers comprises a plurality of metal particles each in contact with one or more organic molecules of adjacent organic layers.

Abstract: A liquid-cooled heat dissipation system includes a heat absorber; a heat dissipating member; two connecting pipes connecting the heat absorber and the heat dissipating member; and a working fluid filled in the heat absorber, the heat dissipating member, and the connecting pipes. The working fluid is capable of circulating in the circuit. The working fluid includes a base fluid, a plurality of nanoparticles and a protective agent dispersed in the base fluid. A percentage by weight of the nanoparticles in the working fluid is in the range from 0.1% to 3%.