HEAT DISSIPATION APPARATUS AND METHOD FOR MANUFACTURING THE SAME
An exemplary heat dissipation apparatus includes a base member and a number of cooling fins. Each of the cooling fins includes a main part and a foot part embedded in the base member, the foot part includes a first portion extending from the main part in the extension direction of the main part and at least one second portion extending at an angle from the first portion. The heat dissipation apparatus has a high heat dissipation efficiency.
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1. Technical Field
The present invention relates generally to heat dissipation apparatuses and, more particularly, to a heat dissipation apparatus having improved heat dissipation efficiency used in an electronic device and a method for manufacturing the heat dissipation apparatus.
2. Discussion of Related Art
With the development of electronic science, operational frequencies of electronic components such as CPUs have become higher and higher, and as a result more energy is consumed and more heat is generated. As a result, it has become necessary to use a powerful heat dissipation device to dissipate the heat generated by the electronic components.
A typical heat dissipation apparatus generally includes a base and a number of cooling fins attached to the base. The base and the cooling fins can be made of a metal having high heat conductivity. Such metal can be, for example, copper, aluminium, etc. Advantageously, the base is made of a highly heat-conductive material such as copper, and the cooling fins are made of aluminium which can be easily processed to form a variety of shapes.
Such devices are usually disposed on a heat source for dissipating heat generated by the heat source through a combination of heat conduction and convection. Firstly, heat generated by the heat source is conducted to the atmosphere at a surface of the device by conduction; secondly, the heat dissipates into atmosphere by convection.
However the highly heat-resistant interfaces between the base and the cooling fins make the heat resistance of the heat dissipation apparatus relatively high, and heat dissipation efficiency of the heat dissipation device is therefore unsatisfactory.
Thus, there is a desire to develop a heat dissipation apparatus that has a low heat resistance between the base and the cooling fins, so as to improve the heat dissipation efficiency.
SUMMARYIn one embodiment, a heat dissipation apparatus includes a base member and a number of cooling fins. Each of the cooling fins includes a main part and a foot part embedded in the base member, the foot part includes a first portion extending from the main part in the extension direction of the main part (i.e., forming a continuation of the main body) and at least one second portion extending at an angle from the first portion.
In one embodiment, a method for manufacturing a heat dissipation apparatus, the method comprising the steps of: providing a base member and a plurality of cooling fins each having a main part and a foot part, the foot part including a first portion extending from the main part in the extension direction of the main part and a second portion extending at an angle from the first portion; defining a number of grooves on the base member in a manner so as conform to a shape of the foot parts of the cooling fins; and pressing the foot parts of the cooling fins into the corresponding grooves at a high temperature and a high pressure.
This and other features and advantages of the present invention as well as the preferred embodiments thereof and a heat dissipation apparatus and techniques for fabricating heat dissipation apparatus in accordance with the invention will become apparent from the following detailed description and the descriptions of the drawings.
BRIEF DESCRIPTION OF THE DRAWINGSMany aspects of the present apparatus and method can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present apparatus and method. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views
Referring now to
Referring to
Referring to
Referring to
Referring to
In use, the base member 42 works as a heat pipe, i.e., the fluid 424 in the vapor chamber 422 is vaporized after absorbing heat generated from a heat source (not shown), the vapor flows from one end of the vapor chamber 422 to another end and discharges heat quickly. Thus, the heat is evenly transferred to the upper portion of the base member 42 and is conducted to the cooling fins 44 uniformly.
The heat dissipation apparatus in accordance with the aforementioned embodiments can be made by the following method. Take the heat dissipation apparatus 20 for example, referring to
-
- Step 1, providing a base member and a number of cooling fins each having a foot part 242 at an extremity thereof, wherein the foot part 242 includes a first portion 243 and a second portion 244 perpendicular to the first portion 242;
- Step 2, defining a number of grooves on the base member in a manner so as conform to a shape of the foot part 242 of the cooling fins; and
- Step 3, pressing the foot parts 242 of the cooling fins into the grooves 222 at a high temperature and a high pressure.
In step 1, each of the cooling fins includes a main part extending from the first portion of the foot part. The base member and the cooling fins are made of a material having high heat conductivity such as copper, aluminium, or copper-aluminium alloy.
In step 2, the grooves are configured for receiving the foot part 242. In order to increase the contact area between the foot parts 242 and the base member, the grooves are shaped so as to tightly accommodate the foot parts 242. Referring now to
In step 3, the temperature can be in a range from 500 to 600 degrees Celsius. Preferably, the pressure should be in the range from 600 to 1200 kilo-Newtons/metre2. This step can be performed by stamping/pressing. That is, the cooling fins 54 can be stamped into the grooves from the side surface of the base member 52 using a stamper. At such a high temperature and under such a high pressure, the atoms on the surface of the cooling fins and the grooves mix across the gap between the cooling fins and the grooves thus form an copper-aluminium alloy layer between the base member and the cooling fins.
The heat dissipation apparatus 20 can also be manufactured by using a metallurgical means, such as, for example, melting a metal material of the base member to a liquid in a mold and then inserting the cooling fins into the liquid, cooling the liquid and the cooling fins thereby obtaining the heat dissipation apparatus 20. Alternatively, a number of grooves are formed on the base member in a manner so as conform to a shape of the foot part 242 of the cooling fins, a mold is disposed on the base member, the mold and the grooves cooperatively define a number of chambers having the shape of the cooling fins, then a liquid of the metal material of the cooling fins is placed in the chambers, when the liquid is cooled the heat dissipation apparatus 20 is obtained.
Finally, it is to be understood that the above-described embodiments are intended to illustrate rather than limit the invention. Variations may be made to the embodiments without departing from the spirit of the invention as claimed. The above-described embodiments illustrate the scope of the invention but do not restrict the scope of the invention.
Claims
1. A heat dissipation apparatus comprising:
- a base member and a plurality of cooling fins, each of the cooling fins comprising a main part and a foot part embedded in the base member, the foot part comprising a first portion extending from the main part in the extension direction of the main part and at least one second portion extending at an angle from the first portion.
2. The heat dissipation apparatus as claimed in claim 1, wherein the second section extends so as to be perpendicular to the first portion.
3. The heat dissipation apparatus as claimed in claim 1, wherein the at least one second portion comprises two opposite second portions extending from the first portion.
4. The heat dissipation apparatus as claimed in claim 1, wherein the base member comprises a phase change chamber.
5. The heat dissipation apparatus as claimed in claim 4, wherein the phase change chamber contains a cooling fluid therein.
6. The heat dissipation apparatus as claimed in claim 5, wherein the cooling fluid is selected from the group consisting of: ammonia, alcohol, acetone, water and any combination thereof.
7. The heat dissipation apparatus as claimed in claim 4, wherein a pressure in the phase change chamber is in the range from 10-3 Pa to 10-2 Pa.
8. The heat dissipation apparatus as claimed in claim 1, wherein a material of the base member and the cooling fins is selected from the group consisting of: copper, aluminium and copper-aluminium alloy.
9. The heat dissipation apparatus as claimed in claim 1, wherein a copper-aluminium alloy layer is formed between the cooling fins and the base member.
10. A method for manufacturing a heat dissipation apparatus, the method comprising the steps of:
- providing a base member and a plurality of cooling fins each having a main part and a foot part, the foot part comprising a first portion extending from the main part in the extension direction of the main part and a second portion extending at an angle from the first portion;
- defining a plurality of grooves on the base member in a manner so as conform to a shape of the foot parts of the cooling fins; and
- pressing the foot parts of the cooling fins into the corresponding grooves at a high temperature and a high pressure.
11. The method as claimed in claim 10, wherein the temperature is in the range from 500° C. to 600° C.
12. The method as claimed in claim 10, wherein the pressure is in the range from 600 to 1200 kilo-Newtons/metre2.
13. The method as claimed in claim 10, wherein the pressing step is performed using a stamper.
14. A heat dissipation apparatus comprising:
- a base member comprising a phase change member defined therein, the phase change member containing a cooling fluid therein; and
- a plurality of cooling fins extending from the base member.
15. The heat dissipation apparatus as claimed in claim 14, wherein the cooling fluid is selected from the group consisting of: ammonia, alcohol, acetone, water and any combination thereof.
16. The heat dissipation apparatus as claimed in claim 14, wherein a pressure in the phase change chamber is in the range from 10-3 Pa to 10-2 Pa.
Type: Application
Filed: Sep 8, 2006
Publication Date: May 10, 2007
Applicant: HON HAI PRECISION INDUSTRY CO., LTD. (Tu-Cheng)
Inventor: CHUN-YI CHANG (Tu-Cheng,Taipei Hsien)
Application Number: 11/309,674
International Classification: F28F 7/00 (20060101);