Abstract: A supporting assembly configured to fix a casing of an electronic device to a chassis and including a plate body, a cushioning component and a fastener. The plate body includes a mounting hole. The cushioning component is disposed through the mounting hole. The cushioning component includes a through hole. The fastener is disposed through the through hole of the cushioning component. A side of the fastener is configured to be fixed to the chassis, and the cushioning component is compressed by another side of the fastener and the chassis.

Abstract: A bearing assembly configured to be disposed on casing of electronic device and including plate body, first damping component, second damping component, first fastener and second fastener. The plate body includes first mounting hole and second mounting hole. The first damping component is disposed in the first mounting hole. The first damping component includes first hole. The second damping component is disposed in the second mounting hole. The second damping component includes second hole. The first fastener is disposed in the first hole of the first damping component and configured to be fixed to the casing of the electronic device. The second fastener is disposed in the second hole of the second damping component and configured to be fixed to the casing of the electronic device. A hardness of the first damping component is greater than a hardness of the second damping component.

Abstract: A proxy device coupled to a network receives communications between a client and a server on the network. The proxy device operates transparently to the client and the server, while coupled to receive and process the communications from a node on the network via a network port in a one-armed configuration, The proxy device communicates packets of the communications with an external tool coupled to the proxy device via a tool port and operates transparently to the nod and the tool. In certain embodiments, the tool may be a network security device, such as a firewall.

Abstract: An automatic alignment system of a robot manipulator is provided. The automatic alignment system includes a signal transmission module and a controller. The signal transmission module includes a first signal receiving and transmitting element and a second signal receiving and transmitting element. The first signal receiving and transmitting element is mounted on the robot manipulator. The second signal receiving and transmitting element is disposed neighboring to a target workpiece. A signal is transported between the signal receiving and transmitting elements. The controller is electrically connected with the signal transmission module for receiving the signal outputted from the signal transmission module. The controller acquires a relative position between the first signal receiving and transmitting element and the second signal receiving and transmitting element according to a variation in the signal.

Abstract: A multi-bit current sense amplifier with pipeline current sampling of a resistive memory is configured to sense a plurality of bit line currents of a plurality of bit lines in a pipeline operation. A core sense circuit is connected to one part of the bit lines and generates a reference parallel resistance current and a reference anti-parallel resistance current. A plurality of bit line precharge branch circuits are connected to the core sense circuit and another part of the bit lines. The bit line currents of the bit lines, the reference parallel resistance current and the reference anti-parallel resistance current are sensed by the core sense circuit and the bit line precharge branch circuits in the pipeline operation so as to sequentially generate a plurality of voltage levels on the core sense circuit in a clock cycle.

Abstract: A multi-axis mount including: a baseplate, the baseplate including an indent, the indent including multiple sloped sides; a pivot, the pivot including a magnetizable, partial ovoidal body, the pivot contacting the baseplate at no less than two sloped sides of the indent and at no more than three sloped sides of the indent; and a magnet located opposite the baseplate from the pivot, the magnet to attract the pivot against the baseplate.

Abstract: An action teaching method is provided for teaching a robotic arm of a robotic arm system through a gesture teaching device. In a step (a), a touch condition of a user's finger is sensed by the touch sensing unit. In a step (b), a sensing result of the touch sensing unit is transmitted to an identification unit, so that a touch information is identified by the identification unit. In a step (c), the touch information is transmitted to a teaching unit, so that the teaching unit actuates a corresponding operation of the robotic arm system according to the touch information. In a step (d), an operating result of the robotic arm system is shown on a display unit, so that the user judges whether the operating result of the robotic arm system is successful through the display unit.

Abstract: A flexible mold has a mold body having a nanoimprinting microstructure and is gradually thickened from its periphery to the middle. Also, a resist spreading nanoimprinting method that integrates a soft mold into a dovetailed meal ring and then deforms it to form a point contact with a substrate before an imprinting process is followed and then convert a loading force into a specific distributed contact pressure for driving the resist flow by using an elastomer cushion pad with a pre-designed convex surface.

Abstract: A plate for at least partially covering a first circuit board includes a body portion, at least one first fixing post, at least one second fixing post, and at least one crossing region. The body portion is configured to cover the first circuit board. The first fixing post is connected to a side of the body portion and protrudes from the body portion. The first fixing post is configured to be fixed to the first circuit board. The second fixing post is connected to another side of the body portion and protrudes from the body portion. The second fixing post is configured to be fixed to a second circuit board. The crossing region is disposed on the body portion. The crossing region is configured to allow at least one electronic component on the first circuit board to pass through.

Abstract: A use of an anthranilic acid derivative as a matrix for a MALDI Mass spectrometry, comprising: preparing a matrix compound represented by the following formula: wherein X is selected from hydrogen and a hydroxyl group, and Y is selected from hydrogen, a methyl group or an acetyl group, provided that when X is hydrogen, Y is hydrogen or an acetyl group, and when X is a hydroxyl group, Y is a methyl group; applying the matrix compound and an analyte onto a sample holder; and analyzing the analyte by the MALDI mass spectrometer.

Abstract: The disclosure provides an adjustable fixing assembly. The adjustable fixing assembly includes a base plate and a cover plate. The cover plate includes a plate portion and a protrusion portion protruding from the plate portion. The cover plate includes a first installation position and a second installation position. When the cover plate is in the first installation position, the protrusion portion extends away from the base plate, and the cover plate is spaced apart from the base plate by a first minimum distance. When the cover plate is in the second installation position, the protrusion portion extends towards the base plate, and the cover plate is spaced apart from the base plate by a second minimum distance, where the second minimum distance is smaller than the first minimum distance.

Abstract: An architecture for combining full-duplex and frequency division duplex communication systems, includes a coupler coupled to a terminal and configured to allow duplex transmissions of digital signals via the terminal. The subject architecture includes a filtering device coupled to the coupler and configured to divide a downstream signal received through the coupler into a plurality of downstream signals associated with a plurality of frequency ranges. The subject architecture includes a transmitter coupled to the coupler and configured to drive, through the coupler, an upstream signal comprising digital signals associated with the plurality of frequency ranges. The subject architecture also includes a plurality of receivers coupled to the filtering device and configured to receive respective ones of the plurality of downstream signals.

Abstract: An upper for an article of footwear may include a knitted component having a first region located adjacent to an outer edge of the upper, where the first region of the knitted component includes an inner surface and an outer surface. The outer surface may include a fused area formed with a thermoformed thermoplastic material included with a first yarn. The inner surface may be at least partially formed with the second yarn and may substantially exclude the thermoplastic material.

Abstract: The present invention is a method of metal polishing and oxidation film process applied on a metal workpiece. The process comprises (a) providing the metallic workpiece in an electrolysis polishing liquid; (b) a temperature control device controlling a liquid temperature of the electrolysis polishing liquid; (c) a voltage supply device to exercising an operating voltage between the metallic workpiece and the electrolysis polishing liquid; (d) polishing the surface of the metallic workpiece and forming an oxidation layer by regulating the temperature control device and the voltage supply device; and (e) determining a film thickness of the oxidation layer formed on the metallic workpiece according to an operation time, wherein the film thickness is related to a roughness and a color displayed on the metallic workpiece. The metallic workpiece may be dyed together during the polishing process without adding any dyes. The present invention further provides a system of alloy oxidation film process.

Abstract: A method and apparatus for calibrating a pipelined analog-to-digital converter (ADC) is disclosed. A method includes reading a first output level from a first sub-ADC, reading one or more additional output levels from one or more additional sub-ADCs, combining the one or more additional output levels from the one or more additional sub-ADCs into a combined output level, and adjusting a comparator threshold of the first sub-ADC when the first output level and the combined output level meet a set of predetermined conditions.

Abstract: The present disclosure provides a trench power semiconductor component and a method of making the same. The trench power semiconductor component includes a substrate, an epitaxial layer, and a trench gate structure. The epitaxial layer is disposed on the substrate, the epitaxial layer having at least one trench formed therein. The trench gate structure is located in the at least one trench. The trench gate structure includes a bottom insulating layer covering a lower inner wall of the at least one trench, a shielding electrode located in the lower half part of the at least one trench, a gate electrode disposed on the shielding electrode, an inter-electrode dielectric layer disposed between the gate electrode and the shielding electrode, an upper insulating layer covering an upper inner wall of the at least one trench, and a protection structure including a first wall portion and a second wall portion.

Abstract: The present disclosure provides an upper for an article of footwear. The upper may include a knitted component having a first yarn and a second yarn, where the first yarn comprises a core with a sheath, the sheath being formed of a thermoplastic material having a melting temperature. The second yarn may be substantially free of the thermoplastic material. The knitted component may further comprise a first layer having a first surface and a second layer having a second surface, where the first layer and the second layer are secured via a knit structure of the knitted component, and where the knitted component further comprises a first region and a second region.

Abstract: The disclosure provides a transporting device, a transporting system, and a shelf transporting method. The method includes: estimating a device pose of the transporting device in a specific field; detecting a shelf pose of a shelf located in the specific field; in response to receiving a transporting request for the shelf, setting an entry point associated with the shelf based on the shelf pose of the shelf, and controlling the transporting device to move to the entry point; in response to determining that the transporting device has arrived at the entry point, rotating to align with the shelf, and entering an accommodating space beneath the shelf via an entrance of the shelf; raising a lift bar to dock with the shelf, and moving to transport the shelf.

Abstract: A method and apparatus for calibrating a CDAC-based analog-to-digital converter is disclosed. In one aspect, a calibration method includes: applying a predetermined pattern of voltages to first plates of a group of N capacitors, wherein N is an integer greater than 1; applying a zero voltage to the second plates of the group of N capacitors, wherein the second plates of the group of N capacitors are connected in common; removing the zero voltage to the second plates of the group of N capacitors; applying a zero voltage to all of the first plates of the group of N capacitors; quantizing a voltage on the second plates of the group of N capacitors; converting the quantized voltage on the second plates of the group of N capacitors to an adjustment value; and loading the adjustment value into a lookup table.

Abstract: This disclosure discloses a pollution-free electroplating solution for electroplating and its preparation method. The process of the preparation method includes: mixing choline chloride with nitrogenous compounds in molar ratio of 1:2, heating to 80° C. to form uniform ionic liquid, adding metal chloride into ionic liquid with molar concentration between 0.005M to 0.5 M, adding 7˜11 wt % of bio bacteria and 0.7M˜2M of inorganic acid agent into the mixed liquid. After been mixed thoroughly, this pollution-free electroplating solution is ready for the application in electroplating.