Abstract: The present disclosure provides a cooling system, including an air-cooling device and a water-cooling device. The air-cooling device includes a first fan, an evaporator, a first condenser, and a second fan. The first fan is arranged in a first cooling room and configured to blow a hot air inside a rack into a first cooling room. The evaporator is arranged in the first cooling room. The first condenser is arranged in a second cooling room. The second fan is arranged in the second cooling room and configured to blow an outside air into the second cooling room. The water-cooling device includes a radiator. The radiator is arranged in the second cooling room and configured to receive a hot liquid from an electronic device in the rack through a third pipeline and transmit a cold liquid to the electronic device through a fourth pipeline.

Abstract: In some embodiments of the present disclosure, a sustained release osmotic-controlled pharmaceutical composition is provided, including: a core and a semi-permeable membrane coated on the core. The core includes a drug compartment, in which the drug compartment includes a first active ingredient, a first polymer and a first osmogen, and the first active ingredient includes lurasidone, a pharmaceutical acceptable salt of the lurasidone or a combination thereof. The semi-permeable membrane includes a membrane body and at least one pore distributed in the membrane body.

Abstract: The disclosure provides a local stretch packaging structure, including a substrate, a flexible electronic element, a plurality of light-emitting display elements, and a packaging layer. The flexible electronic element is disposed on the substrate. These light-emitting display elements are disposed on the flexible electronic element. The packaging layer includes a packaging area and a non-packaging area. The packaging area covers the upper surface and sidewalls of these light-emitting display elements. The non-packaging area is directly covered the flexible electronic element that is not disposed with these light-emitting display elements.

Abstract: A semiconductor device and methods of fabrication thereof including a substrate, a doped well formed in the substrate, a transistor formed on the substrate, a dielectric material located over the doped well and the transistor and including interconnect structures extending through the dielectric material, the interconnect structures including a first set of interconnect structures electrically coupled to an active region of the transistor and a second set of interconnect structures electrically coupled to the doped well, an active memory cell electrically coupled to the active region of the transistor via the first set of interconnect structures; and a dummy memory cell electrically coupled to the doped well via the second set of conductive interconnect structures. The dummy memory cell and the second set of conductive interconnect structures may provide a low resistance pathway for plasma charge to flow to the doped well, thereby minimizing plasma induced damage to the transistor.

Abstract: A laser automatic compensation control device includes a controller, a digital array, a decoder, a compensation array and a synchronizer. The controller is configured for receiving a number of laser energy signals and comparing each laser energy signal with a corresponding preset energy value to obtain a corresponding output digital signal. The digital array is electrically connected to the controller and configured for storing the output digital signals. The decoder is electrically connected to the digital array and configured for converting the output digital signals into a number of analog compensation signals. The compensation array is electrically connected to the decoder and configured for storing the analog compensation signals. The synchronizer is electrically connected to the compensation array and configured for receiving the analog compensation signals, and synchronously outputting the analog compensation signals to a laser diode array.

Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: The present invention relates to a vehicle air conditioner and, more specifically, to a vehicle air conditioner which supplies, to a variable heat exchanger, condensate water and air, that have been blown by means of a supply part and passed through an evaporator, so as to enable sub-cooling and overall performance of the variable heat exchanger to be improved during cooling, thereby further increasing cooling performance, and which may use air and condensate water as a heat-absorbing heat source during heating so as to further increase the heat absorption amount of the variable heat exchanger, so that heating performance may be further increased, and thus overall power consumption for air conditioning may be reduced and an increase in heat pump system performance may be promoted.

Abstract: A vehicular heat management system includes a compressor arranged on a heat pump type refrigerant circulation line, a high-pressure side heat exchanger arranged on the heat pump type refrigerant circulation line, an outdoor heat exchanger arranged on the heat pump type refrigerant circulation line, a plurality of expansion valves arranged on the heat pump type refrigerant circulation line, a low-pressure side heat exchanger arranged on the heat pump type refrigerant circulation line, a first expansion valve arranged on the upstream side of the outdoor heat exchanger, a second expansion valve arranged on the downstream side of the outdoor heat exchanger, and a control part configured to control opening degrees of the first expansion valve and the second expansion valve depending on whether icing occurs in the outdoor heat exchanger under a heat pump mode condition.

Abstract: An MRAM memory cell includes a substrate and a transistor. The transistor includes: first and second source regions; a drain region between the first and second source regions; a first channel region between the drain region and the first source region; a second channel region between the drain region and the second source region; a first gate structure over the first channel region; and a second gate structure over the second channel region. A magnetic tunnel junction is overlying the transistor. The drain region is coupled to the magnetic tunnel junction. A first metal layer is overlying the transistor, and a second metal layer is overlying the first metal layer. The second and first metal layers couple a common source line signal to the first and second source regions of the MRAM memory cell and to those of a neighboring MRAM memory cell.

Abstract: The present invention relates to a heat management system having performance improved by reducing a distance between components constituting a refrigerant module and minimizing a pressure loss of a refrigerant, the heat management system including: a first heat exchanger heat-exchanging a heat exchange medium flowing thereinto from a compressor; a first expansion valve expanding the heat exchange medium flowing thereinto from the first heat exchanger and transferring the expanded heat exchange medium to a condenser; a second expansion valve expanding the heat exchange medium flowing thereinto from the condenser; a second heat exchanger heat-exchanging the heat exchange medium flowing thereinto from the second expansion valve with a heat-generating component; an accumulator storing the heat exchange medium flowing thereinto from the second heat exchanger; and an internal heat exchanger heat-exchanging the heat exchange medium discharged from the condenser with a heat exchange medium discharged from an evaporat

Abstract: An MRAM memory cell includes a substrate and a transistor. The transistor includes: first and second source regions; a drain region between the first and second source regions; a first channel region between the drain region and the first source region; a second channel region between the drain region and the second source region; a first gate structure over the first channel region; and a second gate structure over the second channel region. A magnetic tunnel junction is overlying the transistor. The drain region is coupled to the magnetic tunnel junction. A first metal layer is overlying the transistor, and a second metal layer is overlying the first metal layer. The second and first metal layers couple a common source line signal to the first and second source regions of the MRAM memory cell and to those of a neighboring MRAM memory cell.

Abstract: The present disclosure, in some embodiments, relates to a memory device. The memory device includes a dielectric protection layer having sidewalls defining an opening over a conductive interconnect within an inter-level dielectric (ILD) layer. A bottom electrode structure extends from within the opening to directly over the dielectric protection layer. A variable resistance layer is over the bottom electrode structure and a top electrode is over the variable resistance layer. A top electrode via is disposed on the top electrode and directly over the dielectric protection layer.

Abstract: Some embodiments relate to a magnetoresistive random-access memory (MRAM) cell. The cell includes a bottom electrode having a central bottom electrode portion surrounded by a peripheral bottom electrode portion. Step regions of the conductive bottom electrode couple the central and peripheral bottom electrode portions to one another such that an upper surface of the central portion is recessed relative to an upper surface of the peripheral portion. A magnetic tunneling junction (MTJ) has MTJ outer sidewalls which are disposed over the bottom central electrode portion and which are arranged between the step regions. A top electrode is disposed over an upper surface of the MTJ. Other devices and methods are also disclosed.

Abstract: The present invention relates to an air conditioner for a vehicle and, more particularly, to an air conditioner for a vehicle which is capable of miniaturization by integrally forming an air conditioning module and a cooling module so as to increase space utilization in an engine room and further enhance manufacturability.

Abstract: A vehicle air conditioner, and more specifically, to a vehicle air conditioner in which an air conditioning module and a cooling module are integrally formed, thereby enabling miniaturization so as to enable increased space utilization inside an engine room, and enabling increased manufacturability.

Abstract: The present invention relates to a vehicle air conditioner and, more specifically, to a vehicle air conditioner which supplies, to a variable heat exchanger, condensate water and air, that have been blown by means of a supply part and passed through an evaporator, so as to enable sub-cooling and overall performance of the variable heat exchanger to be improved during cooling, thereby further increasing cooling performance, and which may use air and condensate water as a heat-absorbing heat source during heating so as to further increase the heat absorption amount of the variable heat exchanger, so that heating performance may be further increased, and thus overall power consumption for air conditioning may be reduced and an increase in heat pump system performance may be promoted.

Abstract: A memory device includes an one-time-programmable (OTP) memory unit. The OTP memory unit includes a first gate, a first conductive segment and a second conductive segment of a first structure, and a first magnetic tunnel junction (MTJ) component. The first gate is formed across an active region, and corresponds to gate terminals of a first transistor and a second transistor. The first conductive segment and the second conductive segment of the first structure are formed above the active region, and correspond to a first source/drain terminal of the first transistor and a first source/drain terminal of the second transistor, respectively. The first MTJ component is formed in a first conductive layer above the active region, and is coupled to the first conductive segment and the second conductive segment for receiving a programming signal from a data line. A method for fabricating a memory device is also disclosed herein.

Abstract: The present invention provides a vehicle air-conditioning system comprising: a pair of evaporation units which cause heat exchange between a refrigerant and air, and which are arranged to be spaced apart from each other so as to discharge cold air in different directions; one expansion valve, which expands a low-temperature and high-pressure refrigerant so as to supply same to the evaporation unit; an inlet pipe in which the refrigerant of the expansion valve moves to a first evaporation unit; a first moving pipe in which the refrigerant having circulated through one region of the first evaporation unit moves to a second evaporation unit; a second moving pipe in which the refrigerant having circulated through the second evaporation unit moves to the first evaporation unit; and an outlet pipe through which the refrigerant having circulated through the first evaporation unit flows out.

Abstract: The present invention relates to an air conditioner for a vehicle, and more particularly, to an air conditioner for a vehicle in which heating performance may be improved using an auxiliary heating heat exchanger and stability of a passenger may be improved by providing the auxiliary heating heat exchanger in an engine room.