Abstract: An integrated circuit device includes a substrate and a memory device. The memory device is over the substrate. The memory device includes a bottom electrode, a dielectric layer, an antiferroelectric layer, and a top electrode. The dielectric layer is over the bottom electrode. The antiferroelectric layer is over the dielectric layer. The top electrode is over the antiferroelectric layer.

Abstract: A method includes forming a semiconductor layer over a substrate; depositing a first ferroelectric layer over a channel region of the semiconductor layer; depositing a first dielectric layer over the first ferroelectric layer; depositing a second ferroelectric layer over the first dielectric layer; depositing a gate metal layer over the second ferroelectric layer; patterning the gate metal layer, the second ferroelectric layer, the first dielectric layer, and the first ferroelectric layer to form a gate structure; and forming source/drain regions in the semiconductor layer and on opposite sides of the gate structure.

Abstract: An intelligent display assembly includes a display and a microcontroller. The display is mounted to a CNC machine and provided with a light emitting module and a display module opposite to the light emitting module. The microcontroller is electrically connected with the CNC machine and the display, such that the microcontroller receives an operating status signal outputted by the CNC machine, and according to the operating status signal, the microcontroller controls the light emitting module to emit light and controls the display module to display processing information, such as processing time, processing quantity, waiting time, and failure time. This allows operators to grasp the processing information in real time and improve management efficiency.

Abstract: A chip on film package is disclosed, including a flexible film and a chip. The flexible film includes a film base, a patterned metal layer includes a plurality of pads and disposed on an upper surface of the film base, and a dummy metal layer covering a lower surface of the film base and capable of dissipating heat of the chip. The dummy metal layer comprises at least one opening exposing the second surface, and at least one of the plurality of pads is located within the at least one opening in a bottom view of the chip on film package. The chip is mounted on the plurality of pads of the patterned metal layer.

Abstract: A chip on film package including a flexible film, a first patterned circuit layer, one or more first chips, a second patterned circuit layer, and one or more second chips. The flexible film includes a first surface and a second surface opposite to the first surface. The first patterned circuit layer is disposed on the first surface. The one or more first chips are mounted on the first surface and electrically connected to the first patterned circuit layer. The second patterned circuit layer is disposed on the second surface. The one or more second chips are mounted on the second surface and electrically connected to the second patterned circuit layer.

Abstract: A display device and a driving device thereof is disclosed. The driving device is coupled to a display panel. The driving device includes at least one first driver integrated circuit (IC) and at least one second driver integrated circuit (IC). The first driver integrated circuit is coupled to the display panel. The first driver integrated circuit drives the display panel and detects a first working temperature. The second driver integrated circuit is coupled to the display panel and the first driver IC. The second driver integrated circuit drives the display panel. The first driver IC stops driving the display panel and communicates with the second driver IC to stop driving the display panel when the first working temperature is substantially higher than a first given temperature.

Abstract: A display device and a driving device thereof is disclosed. The driving device is coupled to a display panel. The driving device includes at least one first driver integrated circuit (IC) and at least one second driver integrated circuit (IC). The first driver integrated circuit is coupled to the display panel. The first driver integrated circuit drives the display panel and detects a first working temperature. The second driver integrated circuit is coupled to the display panel and the first driver IC. The second driver integrated circuit drives the display panel. The first driver IC stops driving the display panel and communicates with the second driver IC to stop driving the display panel when the first working temperature is substantially higher than a first given temperature.

Abstract: A chip on film package is disclosed, including a flexible film and a chip. The flexible film includes a film base, a patterned metal layer includes a plurality of pads and disposed on an upper surface of the film base, and a dummy metal layer covering a lower surface of the film base and capable of dissipating heat of the chip. The dummy metal layer comprises at least one opening exposing the second surface, and at least one of the plurality of pads is located within the at least one opening in a bottom view of the chip on film package. The chip is mounted on the plurality of pads of the patterned metal layer.

Abstract: A chip on film package is disclosed, including a flexible film, a patterned circuit layer, a chip, and a dummy metal layer. The flexible film includes a first surface and a second surface opposite to the first surface. The patterned circuit layer is disposed on the first surface. The chip is mounted on the first surface and electrically connected to the patterned circuit layer. The dummy metal layer covers the second surface capable of dissipating heat of the chip. The dummy metal layer is electrically insulated from the patterned circuit layer.

Abstract: The embodiment of the present invention discloses a memory device and a method for operating the same. The memory device includes a memory array and a logic circuit. The logic circuit is coupled to the memory array, and is configured to perform a corresponding operation in response to an operation command from a controller. When an interruption event occurs during the corresponding operation, the logic circuit records a memory status, and the logic circuit further is configured to output the memory status to the controller in response to a status read command from the controller.

Abstract: Provided is a memory device including: a memory array, including a flag memory array having a plurality of flag memory cells and a data memory array having a plurality of data memory cells, the corresponding flag memory cells being used to record whether the corresponding data memory cells have been written or not. In initialization, the flag memory array is initialized by the control circuit but the data memory array is not initialized.

Abstract: A chip on film package including a flexible film, a first patterned circuit layer, one or more first chips, a second patterned circuit layer, and one or more second chips. The flexible film includes a first surface and a second surface opposite to the first surface. The first patterned circuit layer is disposed on the first surface. The one or more first chips are mounted on the first surface and electrically connected to the first patterned circuit layer. The second patterned circuit layer is disposed on the second surface. The one or more second chips are mounted on the second surface and electrically connected to the second patterned circuit layer.

Abstract: A chip on film package is disclosed, including a flexible film, a patterned circuit layer, a chip, and a dummy metal layer. The flexible film includes a first surface and a second surface opposite to the first surface. The patterned circuit layer is disposed on the first surface. The chip is mounted on the first surface and electrically connected to the patterned circuit layer. The dummy metal layer covers the second surface capable of dissipating heat of the chip. The dummy metal layer is electrically insulated from the patterned circuit layer.

Abstract: A memory device comprises an array of memory cells, and a plurality of sense amplifiers coupled with the memory cells. A controller is configured to execute a read operation in response to a command and address, including a read cycle in which the memory cells at the address are electrically coupled to the sense amplifiers, and in which the memory cells at the address are electrically decoupled from the sense amplifiers in response to a timing signal.

Abstract: A memory device including an array of memory cells including bit lines, and biasing circuitry cells. A sense amplifier has a data line input connected to a data line, and a reference input. The controllable reference current source can be connected to the reference input of the sense amplifier. Control circuits on the device are configured to cause execution of a read operation, where the read operation includes a first phase in which the array is biased to induce leakage current on the selected bit line, and a second phase in which the array is biased to read a selected memory cell on the selected bit line. A circuit on the device is configured to sample the leakage current in the first phase, and to control the controllable reference current source during the second phase, as a function of the sampled leakage current.

Abstract: A memory device including an array of memory cells including bit lines, and biasing circuitry cells. A sense amplifier has a data line input connected to a data line, and a reference input. The controllable reference current source can be connected to the reference input of the sense amplifier. Control circuits on the device are configured to cause execution of a read operation, where the read operation includes a first phase in which the array is biased to induce leakage current on the selected bit line, and a second phase in which the array is biased to read a selected memory cell on the selected bit line. A circuit on the device is configured to sample the leakage current in the first phase, and to control the controllable reference current source during the second phase, as a function of the sampled leakage current.

Abstract: Provided is a memory device including: a memory array, including a flag memory array having a plurality of flag memory cells and a data memory array having a plurality of data memory cells, the corresponding flag memory cells being used to record whether the corresponding data memory cells have been written or not. In initialization, the flag memory array is initialized by the control circuit but the data memory array is not initialized.

Abstract: A memory device includes command logic allowing for a command protocol allowing interruption of a first command sequence, such as a page write sequence, and then to proceed directly to receive and decode a second command sequence, such as a read sequence, without latency associated, completing the first command sequence. Also, the command logic is configured to be responsive to a third command sequence after the second command sequence and its associated embedded operation have been completed, which completes the interrupted first command sequence and enables execution of an embedded operation identified by the first command sequence. A memory controller supporting such protocols is described.

Abstract: The embodiment of the present invention discloses a memory device and a method for operating the same. The memory device includes a memory array and a logic circuit. The logic circuit is coupled to the memory array, and is configured to perform a corresponding operation in response to an operation command from a controller. When an interruption event occurs during the corresponding operation, the logic circuit records a memory status, and the logic circuit further is configured to output the memory status to the controller in response to a status read command from the controller.

Abstract: A row decoder includes a plurality of address lines, a first selection circuit and a second selection circuit. The first selection circuit is coupled to the address lines and with a latch function, and configured to enable and latch a first selection signal to select a first word line in a first cell array. The second selection circuit is coupled to the address lines and without the latch function, and configured to enable a second selection signal to select a second word line in a second cell array.