Abstract: In a pattern forming method, a resist layer disposed on a wafer is exposed by an energy beam. A post-exposure-bake (PEB) is performed on the wafer with the exposed resist layer by using a PEB apparatus. After the PEB, the exposed resist layer is developed, thereby forming a resist pattern. The PEB apparatus includes a baking plate, and the wafer is placed on the baking plate for the PEB when a temperature of the wafer is within a predetermined temperature range.

Abstract: A system for lithography patterning includes a first supply pipe for supplying a first solution; a second supply pipe for supplying a second solution; a third supply pipe coupled to the first and second supply pipes for receiving the first and second solutions respectively and mixing the first and second solutions into a mixture; a substrate stage for holding a substrate; a supply nozzle coupled to the third supply pipe for dispensing the mixture to the substrate; a first control unit coupled to the first supply pipe and configured to control a flow rate of the first solution going to the third supply pipe; and a second control unit coupled to the second supply pipe and configured to control a flow rate of the second solution going to the third supply pipe.

Abstract: A wearable physiological monitoring device is provided. The wearable physiological monitoring device includes a wearable object, a sensing module and a processing module. The sensing module is disposed on the wearable object and is configured to stretch based on a local displacement of target organ of the under-test person contacted by the wearable object to generate a change of a sensing value thereof. The processing module is configured to calculate a physiological changing mode that includes physiological information and occurrence time information based on the change of the sensing value. The physiological information includes a number, duration, a degree or a combination of the above of the stretching of the wearable object to determine the health condition of the under-test person.

Abstract: The present disclosure provides a developing unit that includes a wafer stage designed to secure a semiconductor wafer; an exhaust mechanism configured around the wafer stage and designed to exhaust a fluid from the semiconductor wafer; and a multi-switch integrated with the exhaust mechanism and designed to control the exhaust mechanism at various open states.

Abstract: A method for lithography patterning includes forming a first layer over a substrate, the first layer being radiation-sensitive. The method further includes exposing the first layer to a radiation. The method further includes applying a developer to the exposed first layer, resulting in a pattern over the substrate, wherein the developer includes a developing chemical whose concentration in the developer is a function of time during the applying of the developer.

Abstract: A system comprises: a filter for removing at least one of a contaminant or gas bubbles from a liquid photoresist to provide a filtered photoresist at an outlet of the filter. The filter has a filter vent. A trap has an inlet coupled to receive the filtered photoresist from the filter, for removing a remaining contaminant or gas bubbles from the filtered photoresist. One or more valves and one or more conduits are connected to the filter and the trap. The one or more valves are operable to reverse a direction of flow of the filtered photoresist, so that the photoresist flows from the inlet of the trap, through the outlet of the filter, to the filter vent.

Abstract: A system comprises: a filter for removing at least one of a contaminant or gas bubbles from a liquid photoresist to provide a filtered photoresist at an outlet of the filter. The filter has a filter vent. A trap has an inlet coupled to receive the filtered photoresist from the filter, for removing a remaining contaminant or gas bubbles from the filtered photoresist. One or more valves and one or more conduits are connected to the filter and the trap. The one or more valves are operable to reverse a direction of flow of the filtered photoresist, so that the photoresist flows from the inlet of the trap, through the outlet of the filter, to the filter vent.

Abstract: A system comprises: a filter for removing at least one of a contaminant or gas bubbles from a liquid photoresist to provide a filtered photoresist at an outlet of the filter. The filter has a filter vent. A trap has an inlet coupled to receive the filtered photoresist from the filter, for removing a remaining contaminant or gas bubbles from the filtered photoresist. One or more valves and one or more conduits are connected to the filter and the trap. The one or more valves are operable to reverse a direction of flow of the filtered photoresist, so that the photoresist flows from the inlet of the trap, through the outlet of the filter, to the filter vent.

Abstract: A method for pre-treating a wafer surface before applying a material thereon. The method includes positioning the wafer on a rotating apparatus. The wafer is rotated at a first rotational speed between about 50 revolutions per minute (rpm) and about 300 rpm and for a period of about 1 second to about 10 seconds while dispensing a cleaning solvent on the wafer surface. The wafer is rotated at a second rotational speed between about 500 rpm and about 1,500 rpm for a period of about 1 second to about 10 seconds. The wafer is then rotated at a third rotational speed between about 50 rpm and about 300 rpm for a period of about 1 second to about 5 seconds. With the wafer rotating at the third rotational speed, a solvent-containing material is thereafter deposited on the surface of the wafer.

Abstract: The present disclosure provides a developing unit that includes a wafer stage designed to secure a semiconductor wafer; an exhaust mechanism configured around the wafer stage and designed to exhaust a fluid from the semiconductor wafer; and a multi-switch integrated with the exhaust mechanism and designed to control the exhaust mechanism at various open states.

Abstract: A system comprises: a filter for removing at least one of a contaminant or gas bubbles from a liquid photoresist to provide a filtered photoresist at an outlet of the filter. The filter has a filter vent. A trap has an inlet coupled to receive the filtered photoresist from the filter, for removing a remaining contaminant or gas bubbles from the filtered photoresist. One or more valves and one or more conduits are connected to the filter and the trap. The one or more valves are operable to reverse a direction of flow of the filtered photoresist, so that the photoresist flows from the inlet of the trap, through the outlet of the filter, to the filter vent.

Abstract: A method for pre-treating a wafer surface before applying a material thereon. The method includes positioning the wafer on a rotating apparatus. The wafer is rotated at a first rotational speed between about 50 revolutions per minute (rpm) and about 300 rpm and for a period of about 1 second to about 10 seconds while dispensing a cleaning solvent on the wafer surface. The wafer is rotated at a second rotational speed between about 500 rpm and about 1,500 rpm for a period of about 1 second to about 10 seconds. The wafer is then rotated at a third rotational speed between about 50 rpm and about 300 rpm for a period of about 1 second to about 5 seconds. With the wafer rotating at the third rotational speed, a solvent-containing material is thereafter deposited on the surface of the wafer.

Abstract: Substrate for electrical devices is disclosed. An embodiment for the substrate comprised of an insulator, a conductive element(s) and a conductive material(s), wherein the conductive element embedded in the insulator, and two surfaces of the conductive element exposed to two surfaces of the insulator for electrical connection respectively, wherein the upper surface of conductive element is below the upper surface of insulator and is plated by the conductive material, meanwhile the conductive element include a protruding portion which is protruded the insulator, in this manner, solder balls are not needed, moreover the conductive element can further include an extending portion; the present invention may be capable of affording a thinner electrical device thickness and enhanced reliability.

Abstract: Substrate for electrical devices is disclosed. An embodiment for the substrate comprised of an insulator and a conductive element(s), wherein the conductive element embedded in the insulator, said conductive element also enables to be comprised of an upper portion(s) and a lower portion(s) which are unitary and stack; wherein the surfaces of said conductive element contacted with said insulator enables to be increased, then said conductive layer can be held by said insulator more securely, in this manner, it enables to be prevented said conductive element from peeling off said insulator, and then the reliability of said substrate in accordance with the present invention enables to be enhanced; meanwhile, said substrate can further include a chip which is embedded therein, in order that said substrate being capable of affording a thinner electrical device thickness and enhanced reliability.

Abstract: Substrate for electrical devices is disclosed. An embodiment for the substrate comprised of an insulator, a conductive element(s) and a conductive material(s), wherein the conductive element embedded in the insulator, and two surfaces of the conductive element exposed to two surfaces of the insulator for electrical connection respectively, wherein the upper surface of conductive element is below the upper surface of insulator and is plated by the conductive material, meanwhile the conductive element include a protruding portion which is protruded the insulator, in this manner, solder balls are not needed, moreover the conductive element can further include an extending portion; the present invention may be capable of affording a thinner electrical device thickness and enhanced reliability.

Abstract: Substrate for electrical devices is disclosed. An embodiment for the substrate comprised of an insulator, a conductive element(s) and a conductive material(s), wherein the conductive element embedded in the insulator, and two surfaces of the conductive element exposed to two surfaces of the insulator for electrical connection respectively, wherein the upper surface of conductive element is below the upper surface of insulator and is plated by the conductive material, meanwhile the conductive element include a protruding portion which is protruded the insulator, in this manner, solder balls are not needed, moreover the conductive element can further include an extending portion; the present invention may be capable of affording a thinner electrical device thickness and enhanced reliability.

Abstract: Substrate for electrical devices and methods of manufacturing such substrate are disclosed. An embodiment for the substrate comprised of an insulator and a plurality of conductive elements, wherein the conductive elements embedded in the insulator, and two surfaces of the conductive element exposed to two surfaces of the insulator for electrical connection respectively, meanwhile a portion of conductive element may protrude the insulator, in this manner, solder balls are not needed, moreover the conductive element of substrate may further include either an extending portion or a protruding portion, and the present invention may be capable of affording a thinner electrical device thickness, enhanced reliability, and a decreased cost in production.

Abstract: A PLL is provided, comprising a first divider, a PFD, a loop filter, a VCO, a second divider and a controller. The first divider receives a reference signal and divides the reference signal by R to obtain a divided signal. The PFD compares the divided signal and a feedback signal to generate a compared The VCO selects one of a plurality of operating curves for oscillation based on a selection signal, and generates an oscillation signal based on an operating voltage generated by signal the loop filter. The second divider divides the oscillation signal by N to obtain the feedback signal. The controller operates in an initial mode to recursively determine the selection signal by calculating differences of the feedback signal and the divided signal. When the selection signal converges to stable, the PLL switches to a normal mode to operate on the corresponding operating curve.

Abstract: A heat spreader for electrical device is disclosed, a portion of said heat spreader is above and corresponding to a chip which is coupled with a base of electrical device. An embodiment for the heat spreader comprised of: a first portion, second portion, connecting portion, supporting portion and a side edge, said connecting portion is between said first portion and said second portion, said supporting portion coupled with the base of electrical device, said supporting portion is connected to the periphery of said first portion in order that said chip can be accommodated in said heat spreader; according to the heat spreader of the present invention, (i). Due to the side edge of said heat spreader can be protruded and exposed to the side wall of encapsulant, in this manner. Not only a larger chip can be placed in the heat spreader but the heat dissipation for said chip becomes more effective. (ii).

Abstract: Substrate for electrical devices and methods of manufacturing such substrate are disclosed. An embodiment for the substrate comprised of an insulator and a plurality of conductive elements, wherein the insulator having a recess. The conductive elements embedded in the insulator. The conductive elements extend from the insulator surface to the recess. There are two portions of the conductive elements for electrical connection respectively, wherein a portion of conductive element may protrude the insulator surface for electrical connection. In this manner, solder balls are not needed. Moreover, the substrate of the present invention may also comprise an adhesive mean, which is between the conductive elements and the insulator. In addition, the substrate may further comprise a submember such as a chip, heat spreader etc., and the present invention may be capable of affording a thinner electrical device thickness, enhanced reliability, and a decreased cost in production.