Patents by Inventor Chung Chou
Chung Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240157511Abstract: A method of manufacturing a composite article includes providing a polishing pad; rubbing over the polishing pad to produce a polishing pad debris; collecting the polishing pad debris; providing a wood material; and applying a force over the wood material and the polishing pad debris to form the composite article, wherein the composite article includes the wood material and the polishing pad debris, and the rubbing of the polishing pad includes removing a portion of the polishing pad to produce the polishing pad debris.Type: ApplicationFiled: January 25, 2024Publication date: May 16, 2024Inventors: HUA-CHOU CHIANG, CHANDLER YING LAI SEE, CHUNG-CHIEH KO
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Publication number: 20240136174Abstract: In some embodiments, the present disclosure relates to an integrated chip fabrication device. The device includes a stealth laser apparatus arranged over a chuck configured to hold a substrate. An infrared camera is arranged over the chuck and configured to detect an alignment mark below the substrate. The alignment mark is used to align the stealth laser apparatus over the chuck. Control circuitry is configured to operate the stealth laser apparatus to form a stealth damage region at a location within the substrate that is determined based upon the alignment mark. The stealth damage region separates an inner region of the substrate from an outer region of the substrate.Type: ApplicationFiled: January 3, 2024Publication date: April 25, 2024Inventors: Ming-Tung Wu, Hsun-Chung Kuang, Tung-He Chou
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Patent number: 11953344Abstract: A dust-proof sensing device includes a mechanical body, a feeding path, a first photoelectric sensor disposed above the feeding path, a second photoelectric sensor disposed under the feeding path, and an upper bracket. The mechanical body has a feeding path. The upper bracket is mounted above the feeding path. The upper bracket has an upper fastening portion fastened to the mechanical body, an upper wedging portion fastened at the upper fastening portion, an L-shaped upper light guiding holder fastened at the upper fastening portion, and a first light guider fastened at the upper light guiding holder. The upper fastening portion has a first inclined section. An inner edge of an upper surface of the first inclined section is intersected with a top edge of an inner surface of the upper wedging portion to form a clamping angle.Type: GrantFiled: April 11, 2022Date of Patent: April 9, 2024Assignee: Foxlink Image Technology Co., Ltd.Inventors: You Chung Chou, Kuan Cheng Huang
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Patent number: 11955038Abstract: An electronic device may include a lenticular display. The lenticular display may have a lenticular lens film formed over an array of pixels. The display may have a number of independently controllable viewing zones. Each viewing zone displays a respective two-dimensional image. Each eye of the viewer may receive a different one of the two-dimensional images, resulting in a perceived three-dimensional image. The electronic device may include display pipeline circuitry that generates and processes content to be displayed on the lenticular display. Content generating circuitry may generate content that includes a plurality of two-dimensional images, each two-dimensional image corresponding to a respective viewing zone. Pixel mapping circuitry may be used to map the two-dimensional images to the array of pixels in the lenticular display. The array of pixels may have a diagonal layout. An offset map may be used by the pixel mapping circuitry to account for the diagonal layout.Type: GrantFiled: June 11, 2021Date of Patent: April 9, 2024Assignee: Apple Inc.Inventors: Sheng Zhang, Chaohao Wang, Yi-Pai Huang, Yue Ma, Ping-Yen Chou, Fu-Chung Huang
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Publication number: 20240109163Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a conduit having an inlet to be coupled to a gas source, and a dispenser coupled to the conduit and having a convergent-divergent nozzle suspended over the platen to direct gas from the gas source onto the polishing surface of the polishing pad.Type: ApplicationFiled: December 12, 2023Publication date: April 4, 2024Inventors: Haosheng Wu, Shou-Sung Chang, Chih Chung Chou, Jianshe Tang, Hui Chen, Hari Soundararajan, Brian J. Brown
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Publication number: 20240112628Abstract: An electronic device may include a lenticular display. The lenticular display may have a lenticular lens film formed over an array of pixels. A plurality of lenticular lenses may extend across the length of the display. The lenticular lenses may be configured to enable stereoscopic viewing of the display such that a viewer perceives three-dimensional images. The display may have a number of independently controllable viewing zones. The viewer may be particularly susceptible to artifacts caused by crosstalk at the edge viewing zones within the primary field of view of the display. Certain types of content may also be more vulnerable to crosstalk than other types of content. Therefore, to mitigate crosstalk artifacts, the pixel value for each pixel may be adjusted based on the viewing zone of the respective pixel and content information (such as texture information or brightness information) associated with the respective pixel.Type: ApplicationFiled: December 14, 2023Publication date: April 4, 2024Inventors: Yunhui Hou, Yi-Pai Huang, Fu-Chung Huang, Sheng Zhang, Chaohao Wang, Ping-Yen Chou, Yi Huang, Juan He, Alfred B. Huergo Wagner, Seung Wook Kim
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Publication number: 20240088154Abstract: The present disclosure relates to an integrated circuit (IC) that includes a boundary region defined between a low voltage region and a high voltage region, and a method of formation. In some embodiments, the integrated circuit comprises an isolation structure disposed in the boundary region of the substrate. A first polysilicon component is disposed directly on an upper surface of the substrate alongside the isolation structure. A boundary dielectric layer is disposed on the isolation structure. A second polysilicon component is disposed on the sacrifice dielectric layer.Type: ApplicationFiled: November 21, 2023Publication date: March 14, 2024Inventors: Yi-Huan Chen, Chien-Chih Chou, Alexander Kalnitsky, Kong-Beng Thei, Ming Chyi Liu, Shih-Chung Hsiao, Jhih-Bin Chen
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Publication number: 20240087961Abstract: The embodiments described herein are directed to a method for reducing fin oxidation during the formation of fin isolation regions. The method includes providing a semiconductor substrate with an n-doped region and a p-doped region formed on a top portion of the semiconductor substrate; epitaxially growing a first layer on the p-doped region; epitaxially growing a second layer different from the first layer on the n-doped region; epitaxially growing a third layer on top surfaces of the first and second layers, where the third layer is thinner than the first and second layers. The method further includes etching the first, second, and third layers to form fin structures on the semiconductor substrate and forming an isolation region between the fin structures.Type: ApplicationFiled: November 21, 2023Publication date: March 14, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Hung-Ju CHOU, Chih-Chung Chang, Jun-Ming Kuo, Che-Yuan Hsu, Pei-Ling Kao, Chen-Hsuan Liao
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Patent number: 11923250Abstract: The embodiments described herein are directed to a method for reducing fin oxidation during the formation of fin isolation regions. The method includes providing a semiconductor substrate with an n-doped region and a p-doped region formed on a top portion of the semiconductor substrate; epitaxially growing a first layer on the p-doped region; epitaxially growing a second layer different from the first layer on the n-doped region; epitaxially growing a third layer on top surfaces of the first and second layers, where the third layer is thinner than the first and second layers. The method further includes etching the first, second, and third layers to form fin structures on the semiconductor substrate and forming an isolation region between the fin structures.Type: GrantFiled: July 28, 2022Date of Patent: March 5, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Hung-Ju Chou, Chih-Chung Chang, Jiun-Ming Kuo, Che-Yuan Hsu, Pei-Ling Gao, Chen-Hsuan Liao
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Publication number: 20240068705Abstract: This disclosure is a condensate evaporation device. An air conditioning apparatus includes a compressor, an evaporator and a condenser connected with one another. A water tray is arranged to receive the condensate. A water distribution module includes a water separator base and a water separator piece. The water separator piece and the water separator base are combined to define a water channel. The condensate flows through the water channel to evenly flow out. A multi-folded water absorbing body is arranged on one side of the water separator base to absorb the condensate flowed out from the water separator base. The water tank is arranged on a bottom side of the multi-folded water absorbing body. A fan is arranged on one side of the multi-folded water absorbing body. Accordingly, the condensate may be evaporated efficiently.Type: ApplicationFiled: January 18, 2023Publication date: February 29, 2024Inventors: Chao-Hsien CHAN, Yi-Chung CHOU, Chun-Hsun CHEN
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Publication number: 20240066664Abstract: The present disclosure relates to a pad surface cleaning system to be used with a conditioning module to condition a polishing surface of a polishing pad. The pad surface cleaning system may be used to spray the polishing surface with a high-pressure fluid spray to loosen debris from the polishing surface. The pad surface cleaning system may also be used to remove the loosened debris. Further, the pad surface cleaning system may isolate a conditioning disk from a polishing fluid to protect the conditioning disk from reacting with the polishing fluid.Type: ApplicationFiled: August 1, 2023Publication date: February 29, 2024Inventors: Shou-Sung CHANG, Hui CHEN, Haosheng WU, Jianshe TANG, Sidney P. HUEY, Jeonghoon OH, Chad POLLARD, Chih Chung CHOU, Sameer A. DESHPANDE
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Patent number: 11911871Abstract: A method of manufacturing a composite article includes providing a polishing pad; rubbing over the polishing pad to produce a polishing pad debris; collecting the polishing pad debris; providing a wood material; and applying a force over the wood material and the polishing pad debris to form the composite article, wherein the composite article includes the wood material and the polishing pad debris, and the rubbing of the polishing pad includes removing a portion of the polishing pad to produce the polishing pad debris.Type: GrantFiled: February 26, 2019Date of Patent: February 27, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Hua-Chou Chiang, Chandler Ying Lai See, Chung-Chieh Ko
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Publication number: 20240042571Abstract: Methods and apparatuses for dispensing polishing fluids onto a polishing pad within a chemical mechanical polishing (CMP) system are disclosed herein. In particular, embodiments herein relate to a CMP apparatus for processing a substrate including a pad disposed on a platen. The pad has a pad radius and a central axis from which the pad radius extends. The apparatus also include a carrier assembly configured to be disposed on a surface of the pad and having a carrier radius that extends from a rotational axis of the carrier assembly and a fluid delivery assembly comprising one or more nozzles, each nozzle coupled to a fast actuating valve.Type: ApplicationFiled: October 18, 2023Publication date: February 8, 2024Applicant: Applied Materials, Inc.Inventors: Chih Chung CHOU, Anand Nilakantan IYER, Ekaterina A. MIKHAYLICHENKO, Christopher Heung-Gyun LEE, Erik RONDUM, Tiffany Yu-nung CHEUNG, Shou-Sung CHANG
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Patent number: 11881616Abstract: A smart ring includes an antenna chip and a metal ring used as an antenna, and the antenna chip is electrically connected to the metal ring to form an antenna circuit. The metal body of the smart ring is designed as a composition structure of the antenna circuit, that is, the antenna is integrated into the metal ring, the space for accommodating the antennas and the cost for additional physical antennas are saved, and the design flexibility and the competitiveness of the product are improved. Nickel-zinc ferrite is unnecessary, which can reduce the cost. The ring can keep the radiation characteristic of the circular antenna that is not susceptible to the interference from human body. The metal body of the ring is a metal structure, which can fulfill both of strength requirement and texture requirement of the structure, and at the same time has good antenna characteristics.Type: GrantFiled: October 11, 2019Date of Patent: January 23, 2024Assignees: INVENTEC APPLIANCES (PUDONG) CORPORATION, INVENTEC APPLIANCES CORP., INVENTEC APPLIANCES (SHANGHAI) CO. LTD.Inventors: Chun-Chieh Hsu, Chih-Hsuan Hsiao, Kuang-Chung Chou
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Patent number: 11865671Abstract: A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier laterally movable by an actuator across the polishing pad to hold a substrate against a polishing surface of the polishing pad during a polishing process, a thermal control system including a plurality of independently controllable heaters and coolers to independently control temperatures of a plurality of zones on the polishing pad, and a controller configured to cause the thermal control system to generate a first zone having a first temperature and a second zone having a different second temperature on the polishing pad.Type: GrantFiled: April 15, 2020Date of Patent: January 9, 2024Assignee: Applied Materials, Inc.Inventors: Haosheng Wu, Shou-Sung Chang, Jianshe Tang, Chih Chung Chou, Hui Chen, Hari Soundararajan, Benjamin Cherian
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Publication number: 20240004207Abstract: A laser projector includes a light combining device, a light splitting system, a plurality of light valves, and a beam combiner. The light combining device is for emitting an illumination beam. The light splitting system is for receiving the illumination beam to generate a plurality of color beams. The plurality of light valves is for receiving and modulating the plurality of color beams to generate modulated color beams. The beam combiner is for combining the modulated color beams to form a full-color image.Type: ApplicationFiled: July 17, 2023Publication date: January 4, 2024Applicant: QISDA CORPORATIONInventors: Chun-Hao Hu, Tsung-Hsun Wu, Ching-Shuai Huang, Ping-Chung Chou
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Publication number: 20230390895Abstract: A polishing system includes a platen to hold a polishing pad, a carrier head to hold a substrate against the polishing pad, a conditioner including a conditioner head to hold a conditioner disk against the polishing pad, a motor to move the conditioner head laterally movable relative to the platen, a conditioning disk cleaning station positioned adjacent the platen to clean the conditioning disk, and a controller configured to cause the motor to, during polishing of the substrate, move the conditioner head back and forth between a first position with the conditioner head over the polishing pad and a second position with the conditioner head in the conditioner disk cleaning station.Type: ApplicationFiled: October 17, 2022Publication date: December 7, 2023Inventors: Haosheng Wu, Shou-Sung Chang, Jianshe Tang, Jeonghoon Oh, Chad Pollard, Chih Chung Chou, Ningzhuo Cui, Hui Chen
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Patent number: 11834867Abstract: An anti-theft lock includes an engaging member arranged on a chassis, a latch module including a connecting member and a latch coupled to the connecting member, a fixing module coupled to the connecting member, a magnetic module arranged on the top cover and used to cooperate with the fixing module to control movement of the connecting member, and an unlocking mechanism including magnetic members. The connecting member is movably arranged on a top cover. The latch is engaged with or separated from the engaging member through movement of the connecting member. The magnetic members are attracted to or repelled from the magnetic module so that the magnetic module fixes or loosens the connecting member. When the connecting member can move, the latch is disengaged from and separated from the engaging member.Type: GrantFiled: January 5, 2021Date of Patent: December 5, 2023Assignee: Fulian Precision Electronics (Tianjin) Co., LTD.Inventors: Tung-Ho Shih, Hung-Wei Chen, Wei-Chung Chou, Ming-Heng Lu
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Publication number: 20230377746Abstract: A method for establishing robust prediction model is adapted for solving the problem that the conventional prediction model cannot generate stable and credible results with missing data. The method of the present invention includes the following steps: obtaining pre-established single-modality standard models respectively based on each type of modalities from samples; extracting modality sets each having the same modality types from the samples to establish corresponding multi-modalities standard models; extracting multiple combinations of the modality sets from the samples having complete modalities to be training data, wherein the multiple combinations of the modality sets can be classified into single-modality, multi-modalities and complete-modalities; inputting said training data into a to-be trained prediction model, and modifying the prediction model by said single-modality standard models and said multi-modalities standard models to obtain a well-trained prediction model.Type: ApplicationFiled: June 30, 2022Publication date: November 23, 2023Inventors: Yuh-Jyh JONG, Yuan-Han YANG, Ming-Chung CHOU, Shin-Mu TSENG, Jui-Hung HUNG, Hui-Min HSIEH, Shyh-Shin CHIOU
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Patent number: RE49901Abstract: An electrical connector includes an insulative housing defining a front cavity for receiving and a rear cavity, a terminal assembly assembled in the rear cavity, and a ground member. The terminal assembly includes an upper terminal module, a lower terminal module sandwiching a shielding module therebetween. Said The upper terminal module includes a pair of upper ground terminals. Said The lower terminal module includes a plurality of lower ground terminals. Said The shielding module includes a metallic shielding plate. The ground member is associated with the shielding module to mechanically and electrically connect at least one of the upper ground terminals and the lower ground terminals with the shielding plate.Type: GrantFiled: July 29, 2021Date of Patent: April 2, 2024Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITEDInventors: Terrance F. Little, Chih-Hsien Chou, Chun-Hsiung Hsu, Kuei-Chung Tsai