Abstract: Exemplary slurry delivery systems may include a slurry source. The systems may include a slurry line coupled with the slurry source. The systems may include a slurry dispensing nozzle. The nozzle may include a lumen having an inlet that is fluidly coupled with a slurry outlet of the slurry line. The nozzle may include a body defining a reservoir and an exit port. The reservoir may be fluidly coupled with a downstream end of the lumen. The exit port may be coupled with the reservoir. The nozzle may include a valve seat. The nozzle may include a valve member having a first surface positioned against the valve seat when in a closed position. The valve member may be movable to an open position in which the first surface is spaced apart from the valve seat. The nozzle may include an actuator coupled with a second surface of the valve member.

Abstract: A laser projector includes a laser light source, a first dichroic mirror, a second dichroic mirror, three light valves and a beam combining module. The laser light source is used to generate a composite polarized beam. The first dichroic mirror is used to receive the composite polarized beam, and separate the composite polarized beam into a first color beam and a relay beam. The second dichroic mirror is used to receive the relay beam, and separate the relay beam into a second color beam and a third color beam. The three light valves are used to modulate the three color beams into three light beams. The beam combining module is used to combine the three light beams to form a multi-color image.

Abstract: A method of temperature control for a chemical mechanical polishing system includes directing a gas that includes steam from an orifice onto the component in the polishing system while the component is spaced away from a polishing pad of the polishing system to raise a temperature of the component to an elevated temperature, and before the component returns to an ambient temperature, moving the component into contact with the polishing pad.

Abstract: A method of cleaning for a chemical mechanical polishing system includes directing a gas that includes steam from an orifice onto a component in the polishing system while the component is spaced away from a polishing pad of the polishing system to clean the component, and moving the component into contact with the polishing pad.

Abstract: Exemplary slurry delivery assemblies may include a slurry fluid source. The assemblies may include a flurry delivery lumen having a lumen inlet and a lumen outlet. The lumen inlet may be fluidly coupled with an output of the slurry fluid source. The assemblies may include a deagglomeration tube fluidly coupled with the lumen outlet. The deagglomeration tube may include a tube inlet and a tube outlet. The assemblies may include one or more ultrasonic transducers coupled with the deagglomeration tube.

Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, and a pad cooling assembly. The pad cooling assembly has an arm extending over the platen, a nozzle suspended by the arm and coupled to a source of coolant fluid, the nozzle positioned to spray coolant fluid from the source onto the polishing surface of the polishing pad, and an opening in the arm adjacent the nozzle and a passage extending in the arm from the opening, the opening positioned sufficiently close to the nozzle that a flow of coolant fluid from the nozzle entrains air from the opening.

Abstract: A radio frequency (RF) receiver includes a radiating element, a chip and a phase shifting circuit. The radiating element is arranged to receive an RF input signal to produce a plurality of electrical signals. The chip includes an amplifier circuit. The amplifier circuit is configured to receive a plurality of phase shifted signals from a plurality of input terminals respectively, and amplify the phase shifted signals to generate an RF output signal. The phase shifting circuit is located outside the chip, and coupled to the output terminals and the input terminals. The phase shifting circuit is arranged to phase shift the electrical signals and accordingly generate the phase shifted signals. The phase shifting circuit and the radiating element are formed on a same substrate.

Abstract: A radio frequency (RF) transmitter includes a radiating element, a chip and a phase shifting circuit. The radiating element is arranged to receive a plurality of electrical signals to produce an RF output signal. The chip includes an amplifier circuit. The amplifier circuit is configured to amplify an RF input signal to generate a plurality of amplified signals at a plurality of output terminals, respectively. The phase shifting circuit is located outside the chip, and coupled to the output terminals and the radiating element. The phase shifting circuit is arranged to phase shift the amplified signals, and accordingly generate the electrical signals fed to the radiating element. The phase shifting circuit and the radiating element are formed on a same substrate.

Abstract: A dust-proof sensing device includes a mechanical body, a feeding path, a first photoelectric sensor disposed above the feeding path, a second photoelectric sensor disposed under the feeding path, and an upper bracket. The mechanical body has a feeding path. The upper bracket is mounted above the feeding path. The upper bracket has an upper fastening portion fastened to the mechanical body, an upper wedging portion fastened at the upper fastening portion, an L-shaped upper light guiding holder fastened at the upper fastening portion, and a first light guider fastened at the upper light guiding holder. The upper fastening portion has a first inclined section. An inner edge of an upper surface of the first inclined section is intersected with a top edge of an inner surface of the upper wedging portion to form a clamping angle.

Abstract: Methods and apparatuses for dispensing polishing fluids onto a polishing pad within a chemical mechanical polishing (CMP) system are disclosed herein. In particular, embodiments herein relate to a CMP polishing method including urging a substrate against a surface of a pad of a polishing system using a carrier assembly. A fluid is dispensed onto the pad from a fluid delivery assembly at a variable flow rate and a first flow rate of the variable flow rate is pulsed at a frequency and a duty cycle. The frequency refers to a number of pulses of the fluid at the first flow rate per rotation of the pad. The term duty cycle refers to a percentage of the pad exposed to fluid per rotation of the pad. The carrier assembly is translated across a surface of the pad while rotating the carrier assembly about a rotational axis.

Abstract: A laser projector includes a laser source, a first dichroic mirror, a wavelength conversion module, a second dichroic mirror, a first, a second and a third light valves and a beam combiner. The laser source is for providing a blue beam including a first portion and a second portion. The first dichroic mirror is for receiving and allowing the blue beam to penetrate. The wavelength conversion module is for receiving the first portion and emitting a yellow beam to the first dichroic mirror. The second dichroic mirror is for receiving and separating the yellow beam reflected by the first dichroic mirror into a green and a red beam. The first, second and third light valve are for receiving and modulating respectively the second portion of the blue beam, the green beam and the red beam. The beam combiner is for the beams to form a multi-color image.

Abstract: An apparatus for steam treatment of a conditioner head and/or conditioner disk in a chemical mechanical polishing system includes a conditioner cleaning cup, a boiler to generate steam, one or more nozzles positioned to direct steam inwardly into a cavity defined by the load cup, and a supply line running from the boiler to the one or more nozzles to supply steam to the one or more nozzles.

Abstract: An apparatus for steam treatment of a carrier head or a substrate in a chemical mechanical polishing system includes a load cup, a pedestal in a cavity defined by the load cup, the pedestal configured to receive a substrate from or supply a substrate to a carrier head, a boiler to generate steam, one or more nozzles positioned to direct steam inwardly into the cavity defined by the load cup, and a supply line running from the boiler to the one or more nozzles to supply steam to the one or more nozzles.

Abstract: The invention provides a temperature sensing device of an integrated circuit. The integrated circuit includes a plurality of stacked metal wire layers, and the temperature sensing device includes a first metal sheet, a first via and a second via. The first metal sheet is disposed between the first metal wire layer and the second metal wire layer of the metal wire layers. The first via and the second via are used to connect the first metal sheet and the first metal wire layer, wherein a temperature sensing signal enters the first metal sheet through the first via and leaves the first metal sheet through the second via to measure the temperature of the integrated circuit.

Abstract: A voltage generation device and a voltage generation method are provided. The voltage generation device includes a first voltage generator, a second voltage generator, a third voltage generator and an output voltage generator. The first to third voltage generators respectively generate first to third voltages. The output voltage generator generates an output voltage at an output end according to the first voltage, the second voltage and the third voltage. When the output voltage is converted between the first voltage and the second voltage, during a first time period, the first voltage generator provides the first voltage to a first capacitor, and the third voltage generator causes the output voltage to change from the second voltage to the third voltage. During a second time period, the first voltage generator and the first capacitor cause the output voltage to change from the third voltage to the first voltage.

Abstract: A chemical mechanical polishing pad conditioner includes a bottom substrate, an intermediate substrate and a diamond film. The intermediate substrate is arranged on the bottom substrate; the intermediate substrate includes a hollow portion and an annular portion surrounding the hollow portion; the annular portion includes a plurality of first polishing areas arranged at intervals along an annular area and a plurality of second polishing areas arranged among the first polishing areas; and the first polishing areas extend along a radial direction on the intermediate substrate. The diamond film is arranged on the intermediate substrate, and the diamond film overlays the first polishing areas and the second polishing areas. The diamond film is provided with a plurality of first surfaces and a plurality of second surfaces, and first polishing tips protruding from the first surfaces and second polishing tips protruding from the second surface are formed on the diamond film.

Abstract: The present disclosure provides a semiconductor device.

Abstract: The present invention relates to a polishing pad conditioner and a manufacturing method thereof. The polishing pad conditioner includes a substrate, an abrasive layer and a protective layer. The abrasive layer covers the surface of the substrate. The abrasive layer includes a bonding layer and a plurality of abrasive particles embedded in the bonding layer. Each of the abrasive particles has a protrusion exposed out of the bonding layer, and the protrusion is insulated. The protective layer covers the surface of the bonding layer, and the protrusion is exposed out of the protective layer. The polishing pad conditioner of the present invention can protect the bonding layer from being damaged by abrasion and hold the abrasive particles, avoid the abrasive particles from falling off or out of position, and maintain the polishing effect and service life of the polishing pad conditioner.

Abstract: A controller for managing a battery pack includes: a detection terminal, for transmitting an enable signal when values of battery parameters for the battery pack satisfy a sleep condition, where the enable signal enables the detection circuit to detect whether the battery pack is connected to a load and whether the battery pack is connected to the charger; and a receiving terminal, for receiving a detection result transmitted by the detection circuit. The detection result indicates whether the battery pack is connected to at least one of the load and charger. The controller controls the battery pack to enter a sleep mode of the sleep modes based on the detection result. The controller also includes a control terminal, for transmitting a control signal to control an on/off state of a charging switch and/or a discharging switch. The control signal is generated by the controller based on the detection result.