Abstract: The present disclosure is directed to a physical vapor deposition system configured to heat a semiconductor substrate or wafer. In some embodiments the disclosed physical vapor deposition system comprises at least one heat source having one or more lamp modules for heating of the substrate. The lamp modules may be separated from the substrate by a shielding device. In some embodiments, the shielding device comprises a one-piece device or a two piece device. The disclosed physical vapor deposition system can heat the semiconductor substrate, reflowing a metal film deposited thereon without the necessity for separate chambers, thereby decreasing process time, requiring less thermal budget, and decreasing substrate damage.

Abstract: A thin film deposition system and method provide for multiple target assemblies that may be separately powered. Each target assembly includes a target and associated magnet or set of magnets. The disclosure provides a tunable film profile produced by multiple power sources that separately power the target arrangements. The relative amounts of power supplied to the target arrangements may be customized to provide a desired film and may be varied in time to produce a film with varied characteristics.

Abstract: A workpiece transfer system has a plurality of joints having a bearing and a primary and secondary transformer coil, wherein power provided to the primary transformer coil and secondary transformer coil of each joint produces mutual inductance between the primary and secondary transformer coil of the respective joint. A first pair of arms are rotatably coupled to a blade by a first pair of the joints, wherein the primary transformer coil of each of the first pair of joints is operably coupled to the first pair of arms, and the secondary transformer coil of each of the first pair of joints is operably coupled to the blade and an electrode beneath a dielectric workpiece retaining surface of the blade. The electrode is contactlessly energized through the transformer coils of the joint and the blade can chuck and de-chuck a workpiece by reversing current directions and by voltage adjustment.

Abstract: An RFID system, which operates at different frequencies, for information interchange is provided. The system includes a user RFID module and a proprietor RFID module. The two RFID modules include a tag and a tag reader which operate at different frequencies, respectively. The frequency of the tag of the proprietor RFID module is the same as that of the tag reader of the user RFID module. According to the frequency, the data in the proprietor RFID module is able to be read by the tag reader of the user RFID module. The frequency of the tag reader of the proprietor RFID module is the same as that of the tag of the user RFID module. According to the frequency, the data in the user RFID module is able to be read by the tag reader of the proprietor RFID module.

Abstract: A tax refund system and method are disclosed. By the tax refund system of the present invention, a tax refund card embedded with memory is utilized to purchase merchandises in a tax-free shop so that the work of the tax-free shop can record the information relating to those purchased merchandises matching tax-refund regulations into the memory of the tax refund card for enabling the recorded information to be used as refund basis. The tax refund system and method can avoid the trouble of safekeeping many tax-return receipts while purchasing merchandises, and also it can facilitate tax refund procedure and thus enhanced the service convenience. Moreover, the tax refund card can be integrated with passports so that the certification of identity for tax-refund can be facilitated.

Abstract: An RFID system, which operates at different frequencies, for information interchange is provided. The system includes a user RFID module and a proprietor RFID module. The two RFID modules include a tag and a tag reader which operate at different frequencies, respectively. The frequency of the tag of the proprietor RFID module is the same as that of the tag reader of the user RFID module. According to the frequency, the data in the proprietor RFID module is able to be read by the tag reader of the user RFID module. The frequency of the tag reader of the proprietor RFID module is the same as that of the tag of the user RFID module. According to the frequency, the data in the user RFID module is able to be read by the tag reader of the proprietor RFID module.

Abstract: The present invention relates to a personal shopping assistant system applying radio frequency identification (RFID) technology, i.e. an RFID-enabled personal shopping assistant system. The system of the invention is comprised of a plurality of trade articles, each having an RFID tag attached thereon, at least a mobile device, each having an RIFD reader, and a commodity database, by which a custom service program with real-time personal shopping assistant ability is established. By the RFID-enabled personal shopping assistant system of the invention, a relating method can be established for enabling a service provider to successfully acquire the shopping behavior of its customers so as to proceed with a responsive promotion just in time. Moreover, a consumer can also benefit from the method, that is, a consumer is enabled to rapidly query and obtain his favor goods with respect to his personal preference among a great amount of similar goods.

Abstract: A wafer lifter for self-centering a wafer onto a wafer pedestal situated in a physical vapor deposition chamber and a method for self-centering a wafer onto the wafer pedestal are described. The wafer lifter is constructed by a lifter body of annular shape, at least four support fingers emanating upwardly from the wafer lifter body and are spaced-apart from each other, and a platform on a tip portion of each of the at least four support fingers defined by a slanted surface from a vertical plane of an outside surface of the support finger. The platform, when supporting a wafer thereon, leaves substantially no gap between the slanted surface and an outer periphery of the wafer.

Abstract: A new method is provided for the removal of metal residue or nodules from surfaces that are target surfaces during the process of metal sputtering. A polishing bit is applied in a rotating manner to a surface on which nodules have been formed, this application removes the nodules from the target surface and prepares the surface for further processing steps.

Abstract: An apparatus and a method for self-aligning a cover ring onto a wafer pedestal in a physical vapor deposition chamber are described. The apparatus for self-aligning a cover ring to a wafer pedestal includes a wafer pedestal in the shape of a circular disk equipped on an outer periphery of the disk at least two, and preferably four, male alignment members such as protruding tabs; and a cover ring of annular shape that has an inwardly, horizontally extending lip and at least one downwardly, vertically extending lip equipped on an inner periphery at least two, and preferably four, female alignment members such as recessed slots that are adapted for receiving the at least two male alignment members when the wafer pedestal is raised to engage the cover ring.

Abstract: An apparatus and a method for self-aligning a cover ring onto a wafer pedestal in a physical vapor deposition chamber are described. The apparatus for self-aligning a cover ring to a wafer pedestal includes a wafer pedestal in the shape of a circular disk equipped on an outer periphery of the disk at least two, and preferably four, male alignment members such as protruding tabs; and a cover ring of annular shape that has an inwardly, horizontally extending lip and at least one downwardly, vertically extending lip equipped on an inner periphery at least two, and preferably four, female alignment members such as recessed slots that are adapted for receiving the at least two male alignment members when the wafer pedestal is raised to engage the cover ring.

Abstract: An wafer lifter for self-centering a wafer onto a wafer pedestal situated in a physical vapor deposition chamber and a method for self-centering a wafer onto the wafer pedestal are described. The wafer lifter is constructed by a lifter body of annular shape, at least four support fingers emanating upwardly from the wafer lifter body and are spaced-apart from each other, and a platform on a tip portion of each of the at least four support fingers defined by a slanted surface from a vertical plane of an outside surface of the support finger. The platform, when supporting a wafer thereon, leaves substantially no gap between the slanted surface and an outer periphery of the wafer.

Abstract: The present invention is a system and means for supporting transportations and distributions, which is the logistic system and means applied on the management of supporting T&D of delivering goods from a place to at least one other place. For system, which has plural systems for distribution plans of goods before distributions, monitoring, control and recording operations of goods in distributions and result evaluation operations of goods after distributions; the plural systems include a supporting T&D system, a distribution and returning process system and a transportation result management system. For means, which has plural modules as following: a basic data module, a distribution cost module, an geographic information system application module, a vehicle-arrangement and path plan module, a vehicle and driver assignment module, a monitoring and recording module, and a result management module. The modules may cooperate with general business enterprises.

Abstract: A new method is provided for the removal of metal residue or nodules from surfaces that are target surfaces during the process of metal sputtering. A polishing bit is applied in a rotating manner to a surface on which nodules have been formed, this application removes the nodules from the target surface and prepares the surface for further processing steps.

Abstract: A new method is provided for the removal of metal residue or nodules from surfaces that are target surfaces during the process of metal sputtering. A polishing bit is applied in a rotating manner to a surface on which nodules have been formed, this application removes the nodules from the target surface and prepares the surface for further processing steps.