Patents by Inventor Chung-Hao Chang
Chung-Hao Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11961892Abstract: A semiconductor device and methods of forming the same are disclosed. The semiconductor device includes a substrate, first and second source/drain (S/D) regions, a channel between the first and second S/D regions, a gate engaging the channel, and a contact feature connecting to the first S/D region. The contact feature includes first and second contact layers. The first contact layer has a conformal cross-sectional profile and is in contact with the first S/D region on at least two sides thereof. In embodiments, the first contact layer is in direct contact with three or four sides of the first S/D region so as to increase the contact area. The first contact layer includes one of a semiconductor-metal alloy, an III-V semiconductor, and germanium.Type: GrantFiled: June 10, 2022Date of Patent: April 16, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Carlos H. Diaz, Chung-Cheng Wu, Chia-Hao Chang, Chih-Hao Wang, Jean-Pierre Colinge, Chun-Hsiung Lin, Wai-Yi Lien, Ying-Keung Leung
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Patent number: 11959623Abstract: The present disclosure provides a connecting device and a lamp system. The connecting device is used to connect multiple lamps to form the lamp system. The connecting device includes a connecting element, a cover, and a shell. The cover is mounted on the connecting element and includes at least two first assembling members. The shell is detachably mounted on the cover. The shell includes a side wall, an opening, multiple gateways, and at least two second assembling members. The side wall surrounds a space. The opening and the gateways all are formed on a top of the side wall and communicate with the space. A portion of each of the lamps is received in one of the gateways. The second assembling members are disposed on the side wall and face each other in a radial line of the shell, and respectively engage with the first assembling members.Type: GrantFiled: April 27, 2023Date of Patent: April 16, 2024Assignee: Radiant Opto-Electronics CorporationInventors: Chih-Hung Ju, Cheng-Ang Chang, Guo-Hao Huang, Chung-Kuang Chen
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Publication number: 20240100880Abstract: A multi-piece wheel frame includes a rim and a disc. The rim includes a barrel, and an outer rim portion protruding outwardly from the barrel. The outer rim portion forms an inclined surface, and a ring edge surface connected to an outer edge of the inclined surface and cooperating with the inclined surface to form an obtuse angle. The disc is fixed to the rim, and includes a disc core, a plurality of spoke portions extending radially outwardly from the disc core, and a reinforced ring portion connected to the spoke portions and fixed to the outer rim portion. The reinforced ring portion abuts against at least one of the inclined surface and the ring edge surface.Type: ApplicationFiled: November 16, 2022Publication date: March 28, 2024Inventors: Te-Fu HSIAO, Che-Hao KUO, Chung-Hsin CHANG, Chia-Hsin WANG, Erh-Wei LIU
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Publication number: 20240096986Abstract: A method includes forming a first gate spacer and a second gate spacer on a sidewall of a first gate structure. The first gate spacer is between the second gate spacer and the first gate structure. A first interlayer dielectric (ILD) layer is formed to surround the first gate spacer, the second gate spacer, and the first gate structure. A portion of the second gate spacer and a portion of the first ILD layer are removed simultaneously. A top surface of the second gate spacer is lower than a top surface of the first ILD layer.Type: ApplicationFiled: December 1, 2023Publication date: March 21, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chung-Ting LI, Jen-Hsiang LU, Chih-Hao CHANG
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Patent number: 11929417Abstract: A semiconductor device and methods of forming the same are disclosed. The semiconductor device includes a substrate, first and second source/drain (S/D) regions, a channel between the first and second S/D regions, a gate engaging the channel, and a contact feature connecting to the first S/D region. The contact feature includes first and second contact layers. The first contact layer has a conformal cross-sectional profile and is in contact with the first S/D region on at least two sides thereof. In embodiments, the first contact layer is in direct contact with three or four sides of the first S/D region so as to increase the contact area. The first contact layer includes one of a semiconductor-metal alloy, an III-V semiconductor, and germanium.Type: GrantFiled: June 30, 2022Date of Patent: March 12, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Carlos H. Diaz, Chung-Cheng Wu, Chia-Hao Chang, Chih-Hao Wang, Jean-Pierre Colinge, Chun-Hsiung Lin, Wai-Yi Lien, Ying-Keung Leung
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Publication number: 20240074027Abstract: A capacitor capable of releasing reactive oxygen species and reactive nitrogen species after powering of claim 1 is composed of the dielectric material. A plurality of through holes are designed on the capacitor, the through holes being used as air gaps to supply plasma gas and blow a fan to increase the gas flow, and the voltage being connected to the two corresponding electrode edges of the capacitor so that the capacitor generating a heating temperature (lower than 200 degrees Celsius). Thereby, after the capacitor is perforated to form honeycomb shape and powered, the air surrounding the capacitor flowing through the capacitor is ionized to the oxygen ion and nitrogen ion via heating and charge-discharge, generates plasma at room temperature and atmospheric pressure and releases the reactive oxygen ions and reactive nitrogen ions healing and helpful for body healing.Type: ApplicationFiled: August 23, 2022Publication date: February 29, 2024Inventors: Chung-Tai Chang, Chia-Hao Chang, Ting-Yi Chang
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Publication number: 20240068652Abstract: The present disclosure provides a connecting device and a lamp system. The connecting device is used to connect multiple lamps to form the lamp system. The connecting device includes a connecting element, a cover, and a shell. The cover is mounted on the connecting element and includes at least two first assembling members. The shell is detachably mounted on the cover. The shell includes a side wall, an opening, multiple gateways, and at least two second assembling members. The side wall surrounds a space. The opening and the gateways all are formed on a top of the side wall and communicate with the space. A portion of each of the lamps is received in one of the gateways. The second assembling members are disposed on the side wall and face each other in a radial line of the shell, and respectively engage with the first assembling members.Type: ApplicationFiled: April 27, 2023Publication date: February 29, 2024Inventors: Chih-Hung JU, Cheng-Ang CHANG, Guo-Hao HUANG, Chung-Kuang CHEN
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Patent number: 11786014Abstract: A method for making a moisture-permeable waterproof shoe includes: (A) sleeving an inner sleeve unit on a last; (B) coating a bonding agent on an inner surface of an upper unit; (C) sleeving the upper unit on an assembly of the inner sleeve unit and the last; (D) placing an assembly of the upper unit, the inner sleeve unit and the last in a heating device; (E) placing the assembly in a vacuum bag; (F) placing the vacuum bag in a freezing device; (G) removing the assembly from the vacuum bag; (H) pulling out the last from the inner sleeve unit; and (I) fixing a sole to a bottom portion of a three-dimensional upper structure.Type: GrantFiled: July 13, 2021Date of Patent: October 17, 2023Inventors: Chung-Hao Chang, Chia-Ying Chang
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Patent number: 11752204Abstract: The present invention provides vaccines comprising carbohydrate antigen conjugated to a diphtheria toxin (DT) as a carrier protein, wherein the ratio of the number of carbohydrate antigen molecule to the carrier protein molecule is higher than 5:1. Also disclosed herein is a novel saponin adjuvant and methods to inhibit cancer cells, by administering an effective amount of the vaccine disclose herein.Type: GrantFiled: November 1, 2019Date of Patent: September 12, 2023Assignee: OBI PHARMA INC.Inventors: Wei-Han Lee, Nan-Hsuan Wang, Chung-Hao Chang, Yih-Huang Hsieh, Cheng-Der Tony Yu, Cheng-Chi Wang, Yu-Hsin Lin, Yu-Chen Lin, I-Ju Chen
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Publication number: 20220382168Abstract: In a method of manufacturing a semiconductor device, in an EUV scanner, an EUV lithography operation using an EUV mask is performed on a photo resist layer formed over a semiconductor substrate. After the EUV lithography operation, the EUV mask is unloaded from a mask stage of the EUV scanner. The EUV mask is placed under a reduced pressure below an atmospheric pressure. The EUV mask is heated under the reduced pressure at a first temperature in a range from 100° C. to 350 C°. After the heating, the EUV mask is stored in a mask stocker.Type: ApplicationFiled: December 30, 2021Publication date: December 1, 2022Inventors: Chung-Hao CHANG, Ming-Wei CHEN, Ai-Jay MA, Ching-Yueh CHEN
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Publication number: 20220338598Abstract: A method for making a moisture-permeable waterproof shoe includes: (A) sleeving an inner sleeve unit on a last; (B) coating a bonding agent on an inner surface of an upper unit; (C) sleeving the upper unit on an assembly of the inner sleeve unit and the last; (D) placing an assembly of the upper unit, the inner sleeve unit and the last in a heating device; (E) placing the assembly in a vacuum bag; (F) placing the vacuum bag in a freezing device; (G) removing the assembly from the vacuum bag; (H) pulling out the last from the inner sleeve unit; and (I) fixing a sole to a bottom portion of a three-dimensional upper structure.Type: ApplicationFiled: July 13, 2021Publication date: October 27, 2022Inventors: Chung-Hao CHANG, Chia-Ying CHANG
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Publication number: 20220338597Abstract: A shoe is suitable to be made in cooperation with a last having a wear forming portion with a forming volume, and includes an upper unit having a bottom surface and a peripheral surface cooperatively defining a foot space that has a top open end for entry of the wear forming portion and that has a volume smaller than the forming volume of the wear forming portion by 5-10%. The upper unit has a toe stitching portion and a heel stitching portion located on the bottom surface of the upper unit. A sole is fixedly disposed on the bottom surface of the upper unit.Type: ApplicationFiled: July 13, 2021Publication date: October 27, 2022Inventors: Chung-Hao CHANG, Chia-Ying CHANG
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Patent number: 11445780Abstract: A moisture-permeable waterproof shoe includes an outer shoe body unit including an outer shoe upper, a midsole and an outsole. The outer shoe upper and the midsole cooperatively define an insertion space. A sock-shaped inner shoe body unit is disposed in the insertion space and includes a moisture-permeable waterproof shoe-shaped inner sleeve, an outer sock body having a sock body portion sleeved on the shoe-shaped inner sleeve, and an inner adhesive layer adhered between an outer surface of the shoe-shaped inner sleeve and an inner surface of the sock body portion. A connecting layer is fixed between the outer shoe upper and the sock body portion and between the midsole and the sock body portion.Type: GrantFiled: October 3, 2019Date of Patent: September 20, 2022Inventors: Chung-Hao Chang, Chia-Ying Chang
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Publication number: 20220192318Abstract: A moisture-permeable waterproof shoe includes a shoe-shaped inner sleeve defining a foot space and having an inclined annular top edge inclining downwardly from a front side to a rear side thereof, and an outer sock body including a main sock body portion that is sleeved on the shoe-shaped inner sleeve, an insertion portion higher than the inclined annular top edge, and an annular sewing portion extending from the insertion portion to the foot space and fixed to the shoe-shaped inner sleeve. The insertion portion defines an insertion opening communicating with the foot space, and has opposite front and rear ears, and two side portions connected between the front and rear ears.Type: ApplicationFiled: September 24, 2021Publication date: June 23, 2022Inventors: Chung-Hao CHANG, Chia-Ying Chang
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Patent number: 11150558Abstract: A developing method is provided. The developing method includes rotating a wafer. The developing method also includes dispensing, through a first nozzle, a developer solution onto the rotated wafer through a first nozzle at a first rotating speed. The developing method further includes dispensing, through a second nozzle, a rinse solution onto the rotated wafer through a second nozzle at a second rotating speed. The second rotating speed is less than the first rotating speed. In addition, the developing method includes simultaneously moving the first nozzle and the second nozzle during either the dispensing of the developer solution or the dispensing of the rinse solution.Type: GrantFiled: April 15, 2020Date of Patent: October 19, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yi-Rem Chen, Ming-Shane Lu, Chung-Hao Chang, Jui-Ping Chuang, Li-Kong Turn, Fei-Gwo Tsai
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Patent number: 11140944Abstract: A multi-style moisture-permeable waterproof shoe includes an outer shoe body unit defining an insertion space, and a plurality of sock-like inner shoe body units inserted removably and selectively into the insertion space. Each sock-like inner shoe body unit includes a moisture-permeable waterproof shoe-like inner sleeve and an outer sock body. The shoe-like inner sleeve defines a foot space and is made from at least one cut piece. The outer sock body has a sock body portion sleeved on the shoe-like inner sleeve. An inner adhesive layer is adhered between an outer surface of the shoe-like inner sleeve and an inner surface of the sock body portion.Type: GrantFiled: September 30, 2019Date of Patent: October 12, 2021Inventors: Chung-Hao Chang, Chia-Ying Chang
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Patent number: 11127583Abstract: A method of treating a semiconductor substrate includes converting a first main side of the semiconductor substrate having a first coefficient of static friction relative to a surface of a wafer table to a second coefficient of static friction relative to the surface of the wafer table, wherein the second coefficient of static friction is less than the first coefficient of static friction. A photoresist layer is applied over a second main side of the semiconductor substrate having the first coefficient of static friction. The second main side opposes the first main side. The semiconductor substrate is placed on the wafer table so that the first main side of the semiconductor substrate faces the wafer table.Type: GrantFiled: August 15, 2019Date of Patent: September 21, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chung-Hao Chang, Chitong Chen
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Patent number: 11081365Abstract: A method of manufacturing a semiconductor device is disclosed. In the method, a metallic layer is formed over a substrate, the metallic layer is surface-treated with an alkaline solution, and a bottom anti-reflective coating (BARC) layer is formed on the surface-treated metallic layer.Type: GrantFiled: May 30, 2019Date of Patent: August 3, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chung-Hao Chang, Chih-Jen Yu, Keh-Wen Chang
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Patent number: 10881165Abstract: A zipper-free moisture-permeable waterproof high-top shoe includes a high-top inner sock body having a first foot portion and a first leg portion cooperating with each other to define a foot space. A moisture-permeable waterproof high-top shoe-like sleeve is sleeved on the high-top inner sock body and has a second foot portion. A moisture-permeable waterproof low-top shoe-like sleeve is sleeved on the second foot portion and has a sleeve body. A high-top outer sock body is sleeved on an assembly of the inner sock body, the high-top shoe-like sleeve and the low-top shoe-like sleeve, and has a third foot portion. A sole is fixed to a bottom portion of the third foot portion.Type: GrantFiled: May 30, 2019Date of Patent: January 5, 2021Inventors: Chung-Hao Chang, Chia-Ying Chang
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Publication number: 20200405013Abstract: A multi-style comfortable shoe includes an outer shoe body unit defining an insertion space that has an open top end and a closed bottom end, and a plurality of sock-like inner shoe body units inserted removably and selectively into the insertion space. Each sock-like inner shoe body unit includes a shoe-like inner sleeve and an outer sock body. The shoe-like inner sleeve defines a foot space that has an open top end and a closed bottom end and is made from at least one cut piece. The outer sock body has a sock body portion sleeved on the shoe-like inner sleeve. An inner adhesive layer is adhered between an outer surface of the shoe-like inner sleeve and an inner surface of the sock body portion.Type: ApplicationFiled: September 30, 2019Publication date: December 31, 2020Inventors: Chung-Hao Chang, Chia-Ying Chang