Abstract: One embodiment relates to a method to achieve enhanced overlay control while maintaining manufacturing throughput for a fabrication process. Locations of a plurality of alignment structures on a wafer comprising a plurality of reticle fields are determined with a layout tool to define a layout-based wafer map. The topography of the wafer is then measured as a function of wafer position by a surface measuring tool. The layout-based wafer map is then projected onto the measured wafer topography to define a modeled wafer map. A subset of alignment structure locations are measured with an alignment tool in an in-line fabrication flow so as not to delay subsequent fabrication steps. Disagreement between the measured alignment structure locations and modeled alignment structure locations is then minimized mathematically to enhance overlay control while maintaining manufacturing throughput.

Abstract: A high heat resistant, low elastic modulus and fire resistant resin and its compounds are provided. The resin mainly comprises a thermo-hardening resin, a chain extender and a softening agent. Wherein the thermo-hardening resin amounts to 70˜92 wt % in the composite formula, the chain extender amounts to 3˜20 wt % in the composite formula and the softening agent amounts to 5˜10 wt % in the composite formula. The compound composed of 35˜50 wt % of the resin and 50˜65 wt % of a thermal conductive powder has a high thermal conductivity and a low elastic modulus, and is high heat resistant and fire resistant. The compound composed of 60˜95 wt % of the resin and 5˜40 wt % of a multifunctional polyester has a low dielectric constant and a low elastic modulus, and is high heat resistant and fire resistant.

Abstract: A double-sided metal drilling entry board for drilling comprises a metal bottom layer, a soft metal surface layer and a binding layer, in which the binding layer is disposed between the metal bottom layer and the soft metal surface layer to bind the metal bottom layer and the soft metal surface layer.

Abstract: A drilling entry board for a printed circuit board (PCB) includes a metal substrate and a lubricating copolymer. The lubricating copolymer is bonded on the metal substrate surface and comprises a water-soluble structure and a water insoluble structure.

Abstract: A thermosetting resin composition and a prepreg or laminate using the same are provided. The thermosetting resin composition includes an epoxy resin and a curing agent, in which the curing agent is a dual-curing agent system formed with a multi-functional aromatic polyester curing agent in combination with a phenolphthalein benzoxazine phenol aldehyde or a poly(styrene-co-maleic anhydride). An organic or inorganic fiber reinforced material is impregnated with the thermosetting resin composition to form a prepreg, and the prepreg is bonded to a substrate with a metal foil disposed thereon, to form a laminate.

Abstract: A halogen- and phosphorus-free thermosetting resin composition is provided, which is mainly a varnish resin formed by mixing a mixture of two curing agents, an epoxy resin mixture, and an inorganic additive. The mixture of two curing agents is formed by mixing a phenolphthalein modified benzoxazine phenol aldehyde curing agent and an amino triazine novolak, and the epoxy resin mixture is formed by mixing an epoxy resin having an oxazolidone ring or a polyamide-imide-modified epoxy resin and a Bisphenol F epoxy resin.

Abstract: A method for preparing a high thermal conductivity and low dissipation factor adhesive varnish for build-up (combining) additional insulation layers is disclosed, where the adhesive varnish is used for high-density interconnected printed circuit boards or package substrates.

Abstract: A high thermal conductivity and low dissipation factor adhesive varnish for (build-up) combining additional insulation layers is disclosed to be used for high-density interconnected printed circuit boards or IC-package substrates and to be formed by well mixing an epoxy resin precursor, a bi-hardener mixture, a catalyst, a flow modifier, an inorganic filler with high thermal conductivity, and a solvent. The epoxy resin precursor is formed by mixing at least two epoxy resins with a certain ratio, where the at least two epoxy resins are selected from a group including a tri-functional epoxy resin, a rubber-modified or Dimmer-acid-modified epoxy resin, a bromide-contained epoxy resin, a halogen-free/phosphorus-contained epoxy resin, a halogen-free/phosphorus-free epoxy resin, a long-chain/halogen-free epoxy resin, and a bisphenol A (BPA) epoxy resin.

Abstract: Provided is a method of automatic white-balance calibration. The method firstly uses a predefined gain. Each color value for pixels of an inputted image is calculated. A number of the placements representing the pixels within each gray region of a color space are then obtained. Next, a new gain is obtained by linearly combining those placements. Further, in order to overcome a possible chromatic aberration on account of the overlapping regions in the color space, the method introduces a specific deletion ratio to delete a portion of placements positioned in the overlapping regions. Therefore the method provides a proper image. Furthermore, users may decide a level of the chromatic aberration by adjusting the predefined gain.