Abstract: A double structure comfortable moisture-permeable waterproof shoe includes an outer shoe body unit including an outer shoe upper, a midsole and an outsole. The outer shoe upper and the midsole cooperatively define an insertion space. A sock-like inner shoe body unit is disposed in the insertion space and includes a moisture-permeable waterproof shoe-like inner sleeve, an outer sock body having a sock body portion sleeved on the shoe-like inner sleeve, and an inner adhesive layer adhered between an outer surface of the shoe-like inner sleeve and an inner surface of the sock body portion. A connecting layer is fixed between the outer shoe upper and the sock body portion and between the midsole and the sock body portion.

Abstract: A multi-style moisture-permeable waterproof shoe includes an outer shoe body unit defining an insertion space, and a plurality of sock-like inner shoe body units inserted removably and selectively into the insertion space. Each sock-like inner shoe body unit includes a moisture-permeable waterproof shoe-like inner sleeve and an outer sock body. The shoe-like inner sleeve defines a foot space and is made from at least one cut piece. The outer sock body has a sock body portion sleeved on the shoe-like inner sleeve. An inner adhesive layer is adhered between an outer surface of the shoe-like inner sleeve and an inner surface of the sock body portion.

Abstract: A zipper-free moisture-permeable waterproof high-top shoe includes a high-top inner sock body having a first foot portion and a first leg portion cooperating with each other to define a foot space. A moisture-permeable waterproof high-top shoe-like sleeve is sleeved on the high-top inner sock body and has a second foot portion. A moisture-permeable waterproof low-top shoe-like sleeve is sleeved on the second foot portion and has a sleeve body. A high-top outer sock body is sleeved on an assembly of the inner sock body, the high-top shoe-like sleeve and the low-top shoe-like sleeve, and has a third foot portion. A sole is fixed to a bottom portion of the third foot portion.

Abstract: A developing method is provided. The developing method includes rotating a wafer. The developing method also includes dispensing, through a first nozzle, a developer solution onto the rotated wafer through a first nozzle at a first rotating speed. The developing method further includes dispensing, through a second nozzle, a rinse solution onto the rotated wafer through a second nozzle at a second rotating speed. The second rotating speed is less than the first rotating speed. In addition, the developing method includes simultaneously moving the first nozzle and the second nozzle during either the dispensing of the developer solution or the dispensing of the rinse solution.

Abstract: A developing method comprises steps as follows. A wafer is rotated. A developer solution is dispensed onto the rotated wafer through a first nozzle. The first nozzle is moved back and forth between a first position and a second position, in which moving the first nozzle back and forth is performed such that the first nozzle moving forward to the second position is reversed at the second position and that the first nozzle moving forward to the first position is reversed at the first position, and the first position and the second position are directly over the wafer, and the developer solution is dispensed through the first nozzle when moving the first nozzle back and forth between the first position and the second position.

Abstract: The present invention provides vaccines comprising carbohydrate antigen conjugated to a diphtheria toxin (DT) as a carrier protein, wherein the ratio of the number of carbohydrate antigen molecule to the carrier protein molecule is higher than 5:1. Also disclosed herein is a novel saponin adjuvant and methods to inhibit cancer cells, by administering an effective amount of the vaccine disclose herein.

Abstract: A method of treating a semiconductor substrate includes converting a first main side of the semiconductor substrate having a first coefficient of static friction relative to a surface of a wafer table to a second coefficient of static friction relative to the surface of the wafer table, wherein the second coefficient of static friction is less than the first coefficient of static friction. A photoresist layer is applied over a second main side of the semiconductor substrate having the first coefficient of static friction. The second main side opposes the first main side. The semiconductor substrate is placed on the wafer table so that the first main side of the semiconductor substrate faces the wafer table.

Abstract: A method of manufacturing a semiconductor device is disclosed. In the method, a metallic layer is formed over a substrate, the metallic layer is surface-treated with an alkaline solution, and a bottom anti-reflective coating (BARC) layer is formed on the surface-treated metallic layer.

Abstract: The present invention provides vaccines comprising carbohydrate antigen conjugated to a diphtheria toxin (DT) as a carrier protein, wherein the ratio of the number of carbohydrate antigen molecule to the carrier protein molecule is higher than 5:1. Also disclosed herein is a novel saponin adjuvant and methods to inhibit cancer cells, by administering an effective amount of the vaccine disclose herein.

Abstract: A method of making a moisture-permeable waterproof shoe includes: cutting a substrate to form a cut piece having a main body and two wing portions; ultrasonically welding rear mating edges of the main body, wing lateral edges of the wing portions, front and rear curved edges of each wing portion respectively to a front convex portion and a lateral connecting edge of the main body to form a shoe-like inner sleeve: sleeving the inner sleeve on a shoe last; coating an adhesive on an inner surface of an upper; sleeving the upper on the shoe last and heating the assembly to form a moisture-permeable waterproof foot cover; and fixing a bottom portion of the moisture-permeable waterproof foot cover to a sole.

Abstract: A method of making a moisture-permeable waterproof shoe includes: cutting a substrate to form a cut piece having a main body and two wing portions; ultrasonically welding rear mating edges of the main body, wing lateral edges of the wing portions, front and rear curved edges of each wing portion respectively to a front convex portion and a lateral connecting edge of the main body to form a shoe-like inner sleeve: sleeving the inner sleeve on a shoe last; coating an adhesive on an inner surface of an upper; sleeving the upper on the shoe last and heating the assembly to form a moisture-permeable waterproof foot cover; and fixing a bottom portion of the moisture-permeable waterproof foot cover to a sole.

Abstract: A developing method comprises steps as follows. A wafer is rotated. A developer solution is dispensed onto the rotated wafer through a first nozzle. The first nozzle is moved back and forth between a first position and a second position, in which moving the first nozzle back and forth is performed such that the first nozzle moving forward to the second position is reversed at the second position and that the first nozzle moving forward to the first position is reversed at the first position, and the first position and the second position are directly over the wafer, and the developer solution is dispensed through the first nozzle when moving the first nozzle back and forth between the first position and the second position.

Abstract: A developing method includes rotating a wafer. A developer solution is dispensed onto the rotated wafer through a first nozzle. The first nozzle is moved from a first position to a second position. The first position and the second position are over the wafer and within a perimeter of the wafer when viewed from a top of the wafer. The developer solution is dispensed through the first nozzle when moving the first nozzle from the first position to the second position. The first nozzle is moved back from the second position to the first position immediately after the first nozzle is moved from the first position to the second position. The developer solution is dispensed through the first nozzle when moving the first nozzle from the second position to the first position.

Abstract: A developing method includes rotating a wafer. A developer solution is dispensed onto the rotated wafer through a first nozzle. The first nozzle is moved from a first position to a second position. The first position and the second position are over the wafer and within a perimeter of the wafer when viewed from a top of the wafer. The developer solution is dispensed through the first nozzle when moving the first nozzle from the first position to the second position. The first nozzle is moved back from the second position to the first position immediately after the first nozzle is moved from the first position to the second position. The developer solution is dispensed through the first nozzle when moving the first nozzle from the second position to the first position.

Abstract: A tool and a method of developing are provided. In various embodiments, the method of developing includes rotating a wafer at a first rotating speed. The method further includes dispensing a developer solution onto the wafer at the first rotating speed by a first nozzle above the wafer, wherein the first nozzle moves back and forth along a path during dispensing the developer solution. The method further includes rotating the wafer at a second rotating speed to spread the developer solution onto the wafer uniformly. The method further includes dispensing a rinse solution onto the wafer at the second rotating speed by a second nozzle above the wafer.

Abstract: A display apparatus includes a receiving module, a processing module, a selecting module, a power circuit, and a backlight module. The receiving module receives a pulse width modulating (PWM) signal from an external component. The processing module processes the PWM signal in a predetermined time duration. The selecting module outputs the unadjusted PWM signal to the power circuit in the predetermined time duration, and outputs an adjusted signal after the predetermined duration. The power circuit generates a first driving current for driving the backlight module to emit lights in response to the unadjusted PWM signal while the processing module processes the PWM signal. The backlight module remains a predetermined brightness after the predetermined time.

Abstract: One embodiment relates to a method to achieve enhanced overlay control while maintaining manufacturing throughput for a fabrication process. Locations of a plurality of alignment structures on a wafer comprising a plurality of reticle fields are determined with a layout tool to define a layout-based wafer map. The topography of the wafer is then measured as a function of wafer position by a surface measuring tool. The layout-based wafer map is then projected onto the measured wafer topography to define a modeled wafer map. A subset of alignment structure locations are measured with an alignment tool in an in-line fabrication flow so as not to delay subsequent fabrication steps. Disagreement between the measured alignment structure locations and modeled alignment structure locations is then minimized mathematically to enhance overlay control while maintaining manufacturing throughput.

Abstract: A display apparatus includes a receiving module, a processing module, a selecting module, a power circuit, and a backlight module. The receiving module receives a pulse width modulating (PWM) signal from an external component. The processing module processes the PWM signal in a predetermined time duration. The selecting module outputs the unadjusted PWM signal to the power circuit in the predetermined time duration, and outputs an adjusted signal after the predetermined duration. The power circuit generates a first driving current for driving the backlight module to emit lights in response to the unadjusted PWM signal while the processing module processes the PWM signal. The backlight module remains a predetermined brightness after the predetermined time.

Abstract: The present invention provides vaccines comprising carbohydrate antigen conjugated to a diphtheria toxin (DT) as a carrier protein, wherein the ratio of the number of carbohydrate antigen molecule to the carrier protein molecule is higher than 5:1. Also disclosed herein is a novel saponin adjuvant and methods to inhibit cancer cells, by administering an effective amount of the vaccine disclose herein.

Abstract: A tool and a method of developing are provided. In various embodiments, the method of developing includes rotating a wafer at a first rotating speed. The method further includes dispensing a developer solution onto the wafer at the first rotating speed by a first nozzle above the wafer, wherein the first nozzle moves back and forth along a path during dispensing the developer solution. The method further includes rotating the wafer at a second rotating speed to spread the developer solution onto the wafer uniformly. The method further includes dispensing a rinse solution onto the wafer at the second rotating speed by a second nozzle above the wafer.