Patents by Inventor Chung Hsien Lin

Chung Hsien Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250043420
    Abstract: The thin film deposition system includes: a deposition chamber, a precursor source container containing a precursor source; and a precursor conduit. The precursor conduit is elongated and extends between a proximate end and a distal end, and the proximate end is coupled to an outlet of the precursor source container, and the distal end is coupled to an inlet of the deposition chamber.
    Type: Application
    Filed: July 31, 2023
    Publication date: February 6, 2025
    Inventors: Chung Hsien Liao, Jui-Mu Cho, Chien-Fang Lin
  • Publication number: 20250046734
    Abstract: A package includes a first package component; a second package component bonded to the first package component by a first plurality of solder connectors; and a first plurality of spacer connectors extending from the first package component to the second package component. A diameter of a spacer connector the first plurality of spacer connectors is larger than a height of a solder connector of the first plurality of solder connectors, and the first plurality of spacer connectors comprises a different material than the first plurality of solder connectors.
    Type: Application
    Filed: October 19, 2023
    Publication date: February 6, 2025
    Inventors: Wei-Hung Lin, Chi-Chun Hsieh, Ming-Hua Lo, Chung-Chih Chen, Hsin-Hsien Wu
  • Publication number: 20250046633
    Abstract: A semiconductor processing system is provided. The semiconductor processing system includes a first chamber arranged to perform a first semiconductor process; a second chamber arranged to perform a second semiconductor process; a cooling chamber having a pedestal; and a plurality of non-contact temperature sensors mounted in the cooling chamber, and arranged to measure a temperature of a wafer disposed on the pedestal. In one aspect, the first chamber is arranged to transfer the wafer to the cooling chamber upon completion of the first semiconductor process in the first chamber. In another aspect, the cooling chamber is arranged to measure the temperature of the wafer in the cooling chamber and arranged to transfer the wafer to the second chamber when the temperature of wafer is at a target temperature, or pause processing of the wafer when the temperature of the wafer is not at the target temperature.
    Type: Application
    Filed: August 1, 2023
    Publication date: February 6, 2025
    Inventors: Chung Hsien Liao, Po Wen Yang, Jui-Mu Cho, Chien-Fang Lin
  • Publication number: 20250046636
    Abstract: Disclosed in a robotic arm with vibration detection and image recognition, of which a main structure includes a wafer transportation device, a robotic arm rotatably mounted on the wafer transportation device, an image acquiring device arranged on the robotic arm, at least one first vibration detector arranged on the robotic arm, a second vibration detector arranged in an interior of the wafer transportation device, and a monitoring device arranged at one side of the wafer transportation device. The monitoring device includes a status inspecting part in information connection with the image acquiring device and a vibration inspecting part in information connection with the first vibration detector and the second vibration detector. By means of the above structure, the robotic arm is additionally provided with functions of wafer storage status inspecting, impact sensing, and lifespan predicting, so as to prevent mutual influence between machine structure operation instability and inspection error.
    Type: Application
    Filed: August 4, 2023
    Publication date: February 6, 2025
    Inventors: Cheng-Hsiang LU, Chung-Hsien LU, Yao-Tsung HSUEH, Bo-Wen LIN
  • Publication number: 20250046637
    Abstract: A device and a method for robotic arm automatic correction are disclosed. A main structure includes a robotic arm including an optical photographing mechanism, and a wafer storage mechanism at one side of the robotic arm and including a graphic data code. The optical photographing mechanism is in information connection with an optical recognition module that includes a data code analysis unit, an object distance analysis unit, and a wafer center analysis unit. A user uses the optical photographing mechanism to photograph the graphic data code for implementing a first round of position correction for the robotic arm. Then, the optical photographing mechanism photographs a wafer and performs an operation of focusing for calculation of a distance between the robotic arm and a center point of the wafer by means of the object distance analysis unit in combination with the wafer center analysis unit for a second round of correction.
    Type: Application
    Filed: August 4, 2023
    Publication date: February 6, 2025
    Inventors: Cheng-Hsiang LU, Chung-Hsien LU, Yu-Hsin LIU, Jen-Wei CHANG, Jyun-Yi LU, Bo-Wen LIN
  • Patent number: 12219880
    Abstract: A memory device includes a bottom electrode contact, a magnetic tunnel junction pattern, a protection insulating layer, a first capping layer, an interlayer insulating layer, and a second capping layer. The magnetic tunnel junction pattern is over the bottom electrode contact. The protection insulating layer surrounds the magnetic tunnel junction pattern. The first capping layer surrounds the protection insulating layer. The interlayer insulating layer surrounds the first capping layer. The second capping layer is over the first capping layer and the interlayer insulating layer.
    Type: Grant
    Filed: March 4, 2024
    Date of Patent: February 4, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Tai-Yen Peng, Hui-Hsien Wei, Wei-Chih Wen, Pin-Ren Dai, Chien-Min Lee, Sheng-Chih Lai, Han-Ting Tsai, Chung-Te Lin
  • Patent number: 12180067
    Abstract: A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.
    Type: Grant
    Filed: December 13, 2021
    Date of Patent: December 31, 2024
    Assignee: InvenSense, Inc.
    Inventors: Pei-Wen Yen, Ting-Yuan Liu, Jye Ren, Chung-Hsien Lin, Joseph Seeger, Calin Miclaus
  • Patent number: 12140489
    Abstract: A pressure sensor comprises a polysilicon sensing membrane. The pressure sensor further includes one or more polysilicon electrodes disposed over a silicon substrate. The sensor also includes one or more polysilicon routing layers that electrically connects electrodes of the one or more polysilicon electrodes to one another, wherein the polysilicon sensing membrane deforms responsive to a stimuli and changes a capacitance between the polysilicon sensing membrane and the one or more polysilicon electrodes. The sensor also includes one or more vacuum cavities positioned between the polysilicon sensing membrane and the one or more polysilicon electrodes.
    Type: Grant
    Filed: August 30, 2022
    Date of Patent: November 12, 2024
    Assignee: InvenSense, Inc.
    Inventors: Tsung Lin Tang, Chung-Hsien Lin, Ting-Yuan Liu, Weng Shen Su, Yaoching Wang
  • Patent number: 12139398
    Abstract: A method includes depositing a passivation layer on a substrate; depositing and patterning a first polysilicon layer on the passivation layer; depositing and patterning a first oxide layer on the first polysilicon layer forming a patterned first oxide layer; depositing and patterning a second polysilicon layer on the patterned first oxide layer. A portion of the second polysilicon layer directly contacts a portion of the first polysilicon layer. A portion of the patterned second polysilicon layer corresponds to a bottom electrode. A second oxide layer is deposited on the patterned second polysilicon layer and on an exposed portion of the patterned first oxide layer. A portion of the second oxide layer corresponding to a sensing cavity is etched, exposing the bottom electrode. Another substrate is bonded to the second oxide layer enclosing the sensing cavity. A top electrode is disposed within the another substrate and positioned over the bottom electrode.
    Type: Grant
    Filed: September 21, 2022
    Date of Patent: November 12, 2024
    Assignee: InvenSense, Inc.
    Inventors: Weng Shen Su, CHung-Hsien Lin, Yaoching Wang, Tsung Lin Tang, Ting-Yuan Liu, Calin Miclaus
  • Patent number: 11768122
    Abstract: A device includes a housing unit with an internal volume. The device further includes a sensor coupled to a substrate via an electrical coupling, wherein the sensor is disposed within the internal volume of the housing unit, and wherein the sensor is in communication with an external environment of the housing unit from a side other than a side associated with the substrate. The device also includes a moisture detection unit electrically coupled to the sensor, wherein the moisture detection unit comprises at least two looped wires at different heights, and wherein the moisture detection unit is configured to detect presence of a moisture within an interior environment of the housing unit when the moisture detection unit becomes in direct contact with the moisture.
    Type: Grant
    Filed: October 12, 2022
    Date of Patent: September 26, 2023
    Assignee: InvenSense, Inc.
    Inventors: Calin Miclaus, Chung-Hsien Lin, Jye Ren, Tim Piessens, Pei-Wen Yen, Manish Sharma-Kulamarva
  • Publication number: 20230296461
    Abstract: A pressure sensor includes a first electrode, a plurality of cavities, and a second electrode. The second electrode is disposed opposite the first electrode through the plurality of cavities. The second electrode includes a flat structure spanning two adjacent cavities of the plurality of cavities.
    Type: Application
    Filed: February 23, 2023
    Publication date: September 21, 2023
    Inventors: Yoshitaka Sasaki, Jotaro Akiyama, Sal Akram, Yaoching Wang, Weng Shen Su, Tsung Lin Tang, Ting-Yuan Liu, Yuki Shibano, Chung-Hsien Lin
  • Publication number: 20230089813
    Abstract: A method includes depositing a passivation layer on a substrate; depositing and patterning a first polysilicon layer on the passivation layer; depositing and patterning a first oxide layer on the first polysilicon layer forming a patterned first oxide layer; depositing and patterning a second polysilicon layer on the patterned first oxide layer. A portion of the second polysilicon layer directly contacts a portion of the first polysilicon layer. A portion of the patterned second polysilicon layer corresponds to a bottom electrode. A second oxide layer is deposited on the patterned second polysilicon layer and on an exposed portion of the patterned first oxide layer. A portion of the second oxide layer corresponding to a sensing cavity is etched, exposing the bottom electrode. Another substrate is bonded to the second oxide layer enclosing the sensing cavity. A top electrode is disposed within the another substrate and positioned over the bottom electrode.
    Type: Application
    Filed: September 21, 2022
    Publication date: March 23, 2023
    Inventors: Weng Shen Su, Chung-Hsien Lin, Yaoching Wang, Tsung Lin Tang, Ting-Yuan Liu, Calin Miclaus
  • Publication number: 20230088319
    Abstract: A pressure sensor comprises a polysilicon sensing membrane. The pressure sensor further includes one or more polysilicon electrodes disposed over a silicon substrate. The sensor also includes one or more polysilicon routing layers that electrically connects electrodes of the one or more polysilicon electrodes to one another, wherein the polysilicon sensing membrane deforms responsive to a stimuli and changes a capacitance between the polysilicon sensing membrane and the one or more polysilicon electrodes. The sensor also includes one or more vacuum cavities positioned between the polysilicon sensing membrane and the one or more polysilicon electrodes.
    Type: Application
    Filed: August 30, 2022
    Publication date: March 23, 2023
    Inventors: Tsung Lin Tang, Chung-Hsien Lin, Ting-Yuan Liu, Weng Shen Su, Yaoching Wang
  • Publication number: 20230035487
    Abstract: A device includes a housing unit with an internal volume. The device further includes a sensor coupled to a substrate via an electrical coupling, wherein the sensor is disposed within the internal volume of the housing unit, and wherein the sensor is in communication with an external environment of the housing unit from a side other than a side associated with the substrate. The device also includes a moisture detection unit electrically coupled to the sensor, wherein the moisture detection unit comprises at least two looped wires at different heights, and wherein the moisture detection unit is configured to detect presence of a moisture within an interior environment of the housing unit when the moisture detection unit becomes in direct contact with the moisture.
    Type: Application
    Filed: October 12, 2022
    Publication date: February 2, 2023
    Inventors: Calin Miclaus, Chung-Hsien Lin, Jye Ren, Tim Piessens, Pei-Wen Yen, Manish Sharma-Kulamarva
  • Publication number: 20230030211
    Abstract: A device includes a housing unit with an internal volume. The device further includes a sensor coupled to a substrate via an electrical coupling, wherein the sensor is disposed within the internal volume of the housing unit, and wherein the sensor is in communication with an external environment of the housing unit from a side other than a side associated with the substrate. The device also includes a moisture detection unit electrically coupled to the sensor, wherein the moisture detection unit comprises at least two looped wires forming electrodes, and wherein the moisture detection unit is configured to detect presence of a moisture within an interior environment of the housing unit by measuring a capacitance between the electrodes and by detecting a change between the measured capacitance and a capacitance between the electrodes in absence of moisture.
    Type: Application
    Filed: October 12, 2022
    Publication date: February 2, 2023
    Inventors: Calin Miclaus, Chung-Hsien Lin, Jye Ren, Tim Piessens, Pei-Wen Yen, Manish Sharma-Kulamarva
  • Patent number: 11499884
    Abstract: A device includes a sensor die, an electrical coupling, a substrate, a liquid detection unit, and a housing unit. The sensor die is coupled to the substrate via the electrical coupling. The liquid detection unit electrically is coupled to the sensor die. The housing unit and the substrate are configured to house the sensor die, the liquid detection unit, and the electrical coupling. The housing unit comprises an opening that exposes the sensor die to an environment external to the housing unit. The liquid detection unit detects presence of liquid within an interior environment of the housing unit. In some embodiments, the device further includes a gel filled within the interior environment of the housing unit covering the sensor die and the substrate. The gel, e.g., silicone, fluoro silicone, etc., is configured to protect the sensor die, the electrical coupling, and the substrate from exposure to the liquid.
    Type: Grant
    Filed: July 22, 2019
    Date of Patent: November 15, 2022
    Assignee: InvenSense, Inc.
    Inventors: Calin Miclaus, Chung-Hsien Lin, Jye Ren, Tim Piessens, Pei-Wen Yen, Manish Sharma-Kulamarva
  • Patent number: 11490186
    Abstract: Robust microelectromechanical systems (MEMS) sensors and related manufacturing techniques are described. Disclosed MEMS membranes and backplate structures facilitate manufacturing robust MEMS microphones. Exemplary MEMS membranes and backplate structures can comprise edge pattern holes having a length to width ratio greater than one and/or configured in a radial arrangement. Disclosed implementations can facilitate providing robust MEMS membranes and backplate structures, having edge pattern holes with a profile resembling at least one of an oval, an egg, an ellipse, a droplet, a cone, or a capsule or similar suitable configurations according to disclosed embodiments.
    Type: Grant
    Filed: March 24, 2021
    Date of Patent: November 1, 2022
    Assignees: INVENSENSE, INC., TDK ELECTRONICS AG
    Inventors: Tsung Lin Tang, Chia-Yu Wu, Chung-Hsien Lin, Dennis Mortensen, Pirmin Rombach
  • Patent number: 11326972
    Abstract: A sensor includes a substrate, an oxide layer, a membrane, an electrode, and a trench. The oxide layer is disposed on the substrate. The membrane is positioned on the oxide layer. The membrane with the oxide layer and the substrate forms an enclosed cavity therein. The membrane comprises a rigid portion and a deformable portion wherein the deformable portion of the membrane deforms responsive to stimuli. The oxide layer forms side walls of the cavity. The electrode is positioned on the substrate and within the cavity. The trench is formed in the oxide layer, and wherein the trench is covered with barrier material.
    Type: Grant
    Filed: May 15, 2020
    Date of Patent: May 10, 2022
    Assignee: InvenSense, Inc.
    Inventors: Pei-Wen Yen, Yu-Tao Lee, Chung-Hsien Lin
  • Publication number: 20220098030
    Abstract: A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.
    Type: Application
    Filed: December 13, 2021
    Publication date: March 31, 2022
    Inventors: Pei-Wen Yen, Ting-Yuan Liu, Jye Ren, Chung-Hsien Lin, Joseph Seeger, Calin Miclaus
  • Publication number: 20220070568
    Abstract: Robust microelectromechanical systems (MEMS) sensors and related manufacturing techniques are described. Disclosed MEMS membranes and backplate structures facilitate manufacturing robust MEMS microphones. Exemplary MEMS membranes and backplate structures can comprise edge pattern holes having a length to width ratio greater than one and/or configured in a radial arrangement.
    Type: Application
    Filed: March 24, 2021
    Publication date: March 3, 2022
    Inventors: Tsung Lin Tang, Chia-Yu Wu, Chung-Hsien Lin, Dennis Mortensen, Pirmin Rombach