Abstract: The present invention relates to a novel antibody, an antigen-binding fragment thereof and the uses of the antibody and fragment, wherein the antibody and the fragment comprise specific complementarity-determining regions (CDRs) and/or specifically bind to human CD73 at specific epitopes.

Abstract: This application discloses a computing system implementing a reliability verification tool to identify a portion of a layout design describing an integrated circuit includes a victim transistor having a gate connected to an aggressor transistor. The reliability verification tool can extract a resistance network for connections between the victim transistor and the aggressor transistor, and simulate the resistive network to determine connectivity between the wells of the victim transistor and the aggressor transistor occurs prior to the victim transistor having a gate connected to an aggressor transistor.

Abstract: A modular AC/DC power conversion module for power sources and loads and a method of driving the same is provided. When an AC/DC converter is electrically coupled to an external power source, a microprocessor is electrically energized by a buck auxiliary circuit, under control of the microprocessor, a DC/DC converter is activated for a certain time period, and then, the AC/DC converter is activated. Thereafter, an output voltage of the AC/DC converter is boosted, and an output voltage of the DC/DC converter is boosted accordingly. Power elements in the downstream side DC/DC converter are activated first, and then power elements in the upstream side AC/DC converter are activated, thereby an inrush current is suppressed. Once the external power source is connected, the buck auxiliary circuit will automatically reduce a voltage of the power input to activate the module. It realizes that the module will autonomously operate after being electrically energized.

Abstract: The present disclosure is directed to an improved stiffener that has a body that has extension members positioned proximally to the corners of a semiconductor package substrate, and the extension members have bottom extension surfaces that extend beyond a periphery of a bottom surface of the semiconductor package substrate, and the bottom extension surfaces and the bottom surface of the semiconductor package substrate are co-planar. The present disclosure is also directed to a method for forming the improved stiffener with the extension members for a semiconductor package.

Abstract: A packaged semiconductor device has a top surface and a bottom surface opposite the top surface. The packaged semiconductor device includes a device die, a plurality of perimeter landings, connection lines, and molding compound. The device die has a first surface and a second surface opposite the first surface. The device die is arranged in a central region of the packaged semiconductor device. The first surface of the device die is arranged towards the bottom surface of the packaged semiconductor device, and the second surface of the device die is arranged towards the top surface of the packaged semiconductor device. The plurality of perimeter landings are exposed on the bottom surface of the packaged semiconductor device and are arranged at perimeter regions of the bottom surface surrounding the device die. The connection lines are connected to the second surface of the device die.

Abstract: A semiconductor device includes a first substrate, a first chip, a second chip, and a first substrate conductive pillar. The first chip is disposed on the first substrate and has a first lateral surface. The second chip is disposed on the first chip and includes a first protrusion protruding relative to the first lateral surface. The first substrate conductive pillar connects the first protrusion with the first substrate.

Abstract: An injection molding method is provided. A molding device is provided and includes a first mold, a second mold over the first mold and a mold cavity defined by the first mold and the second mold. A first mixture is injected into the mold cavity through a first feeding port. A first component is formed from the first mixture. A second mixture is injected into the mold cavity through a second feeding port. A second component is formed from the second mixture. The second component is at least partially contact with the first component, and the first component and the second component have different physical properties.

Abstract: A process operating system includes a process control platform, a process operation platform and an endpoint task robot. The process control platform is configured to receive operation information, extract a task from the operation information using a semantic analysis method, and publish the task. The process operation platform is configured to receive the task and store the task in a task queue. After receiving the task, the process operating platform defines a processing flow based on the task, and sorts the order of the task in the task queue. The endpoint task robot is configured to automatically obtain the task from the process operation platform, executes the task according to the processing flow. It then writes the execution result into the log queue and transmits the execution result to the process control platform.

Abstract: A modified polyphenylene ether resin having a structure represented by [Formula 1] is provided.

Abstract: The present invention discloses a hacking detection method, including: deploying a plurality of trap IP addresses in a trap IP address list; collecting access logs from a plurality of network devices to create a connection record list, wherein the connection record list includes a plurality of connection records; and comparing the trap IP address list and the connection record list to obtain a suspicious source list. The suspicious source list includes a plurality of suspicious source IP addresses. The suspicious source IP addresses match a portion of the trap IP addresses in the trap IP address list.

Abstract: An electric vehicle (EV) charging system is described herein. The EV charging system may be configured to determine if a component in the EV charging system is operating properly based upon current usage. For example, an EV charging station controller may measure a current corresponding to an input to an EV charging station. The EV charging station controller may further measure currents of reference components in the EV charging station, and then use the measured currents to determine if a component in the EV charging station is operating properly. In some examples, the component is a heating, ventilation, and air conditioning (HVAC) component in an EV charging station because it is particularly useful to know the operational status of an HVAC in EV charging systems (e.g., to ensure that the components charging the EV are the correct temperature).

Abstract: There is provided a structure to improve BSI global shutter efficiency. In a sensor pixel circuit, at least one strong electric field is formed at the position of a floating diffusion region to accordingly have the effect of shielding the floating diffusion region. Or, the semiconductor material from the floating diffusion node toward a light incident direction is removed in the manufacturing process such that a depletion region cannot be formed in this direction. Or, a reflection layer or a photoresist layer is formed in the light incident direction to block the light. In these ways, charges generated by the undesired noises are reduced, and noise charges are difficult to reach the floating diffusion region thereby improving the shutter efficiency.

Abstract: A character recognition method includes the stages as detailed in the following paragraph. An image is received, wherein the image is one in a plurality of consecutive images. A target object in the image is detected. Object information of the target object is defined according to the area ratio of the target object occupied in the image. Whether the target object in the image is the same as the target object in the previous image is determined according to the object information. Character recognition on the target object is performed to obtain a recognition result. The weighting score of the recognition result is calculated according to the object information and the recognition result. The weighting score of the recognition result of the target object in the consecutive images is accumulated until the weighting score is higher than a preset value, and the recognition result is output.

Abstract: The present invention relates to a novel antibody, an antigen-binding fragment thereof and the uses of the antibody and fragment, wherein the antibody and the fragment comprise specific complementarity-determining regions (CDRs) and/or specifically bind to human CD73 at specific epitopes.

Abstract: A semiconductor device is provided. The semiconductor device includes a metal layer. The semiconductor includes a gyroscope including a getter structure overlying the metal layer, wherein the getter structure comprises titanium.

Abstract: An electronic circuit adapted to drive a display panel is provided. The electronic circuit includes a touch sensing circuit, a fingerprint sensing circuit and a display driving circuit. The touch sensing circuit senses a touch of a finger and determines a first area corresponding to the touch on the display panel. The fingerprint sensing circuit senses a fingerprint image of the finger corresponding to the first area. The display driving circuit drives pixels of the first area with respective first gray levels and pixels of a second area outside the first area with respective second gray levels. The display driving circuit processes respective third gray levels to obtain the respective first gray levels or the respective second gray levels. The display driving circuit generates gamma voltages corresponding to the respective first gray levels and the respective second gray levels according to a same gamma curve.

Abstract: A molding device includes a first mold, a second mold, a mold cavity, and a position control mechanism attached to the first mold and the second mold, wherein the first mold and the second mold are movable by the position control mechanism individually. A molding method includes providing a molding device having a first mold, a second mold and a third mold; engaging the first mold with the second mold to form a first mold cavity; injecting a first material into the first mold cavity to form a first layer; disengaging the first mold from the second mold by a position control mechanism; engaging the third mold with the second mold to form a second mold cavity; injecting a second material into the second mold cavity to form an article; and disengaging the third mold from the second mold by the position control mechanism.

Abstract: An electric vehicle (EV) charging system is described herein. The EV charging system may be configured to determine if a component in the EV charging system is operating properly based upon current usage. For example, an EV charging station controller may measure a current corresponding to an input to an EV charging station. The EV charging station controller may further measure currents of reference components in the EV charging station, and then use the measured currents to determine if a component in the EV charging station is operating properly. In some examples, the component is a heating, ventilation, and air conditioning (HVAC) component in an EV charging station because it is particularly useful to know the operational status of an HVAC in EV charging systems (e.g., to ensure that the components charging the EV are the correct temperature).

Abstract: A parallel module driver is disclosed and includes a modular backplane structure, a rectifier module and an inverter module. The modular backplane structure includes a plurality of connectors arranged equidistantly in a first direction. The rectifier module includes a rectifier-connection slot connected to one of the plurality of connectors in a second direction. The inverter module includes an inverter-connection slot connected to one of the plurality of connectors in the second direction. The rectifier module and the inverter module are arranged adjacent to each other, the rectifier-connection slot and the inverter-connection slot are connected to two adjacent connectors on the modular backplane structure, respectively. The lateral sides of the rectifier module and the inverter module are attached to each other, and respectively include a guiding element and a guiding groove matched with each other and limiting the rectifier module and the inverter module to slide in the second direction.

Abstract: An injection molding system is provided. The injection molding system includes a first carrier, a first injector, a second carrier, a second injector, and a bridging mechanism. The first carrier is configured to hold a first mold. The first injector is disposed over the first carrier and configured to inject a first polymeric material. The second carrier is configured to hold a second mold. The second injector is disposed over the second carrier and configured to inject a second polymeric material. The bridging mechanism is disposed between and rotatable relative to the first carrier and the second carrier. The bridging mechanism is configured to receive a third mold from the first carrier or the second carrier and convey the third mold between the first carrier and the second carrier.