Patents by Inventor Chung Liu

Chung Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11079640
    Abstract: A method for repairing a white defect of a LCD panel includes providing a substrate, the substrate defining pixel areas which themselves comprise a base, a first metal layer, a first insulating layer, a semi-conductor layer, an ohmic contact layer, a source electrode, a drain electrode, and a second insulating layer; forming a through hole by laser in the second insulating layer, the through hole extending through the second insulating layer and separating the drain electrode into two spaced parts; forming a third insulating layer to cover the first conductive layers, the second insulating layer and the though hole and forming a second conductive layer by laser on the third insulating layer to couple the first conductive layer to the second conductive layer.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: August 3, 2021
    Assignee: Century Technology (Shenzhen) Corporation Limited
    Inventors: Yuan Xiong, Chih-Chung Liu, Ming-Tsung Wang, Meng-Chieh Tai
  • Patent number: 11074029
    Abstract: A value-added remote display service wireless routing server device includes one or more user-end image medium transmission electronic devices, a value-added routing server, a destination-end image medium display device and an actuation device connected to each user-end image medium transmission electronic device and having actuateable operation buttons. Each user-end image medium transmission electronic device transmits image data through a wired or wireless local area network to the value-added routing server, which, based on network band width and data processing capability, presets magnification/reduction resolution and designated displaying location to the image data transmitted from each user-end image medium transmission electronic device and transmits corresponding image display screen data to the destination-end image medium display device for displaying.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: July 27, 2021
    Assignee: Magic Control Technology Corporation
    Inventor: Pei-Chung Liu
  • Patent number: 11074428
    Abstract: A fingerprint identification device and method are provided. The fingerprint identification device includes a touch-sensing panel, a fingerprint sensor, and a processing circuit. The fingerprint sensing area of the fingerprint sensor is located in the touch-sensing area of the touch-sensing panel. The processing circuit senses the touch area of an object in the touch-sensing area via the touch-sensing panel when the object contacts the touch-sensing area of the touch-sensing panel. The processing circuit senses the fingerprint of the object via the fingerprint sensor to obtain a fingerprint template. The processing circuit determines the finger attribute of the object based on the physical characteristics of the touch area. The processing circuit selects the registered template related to the finger attribute from a plurality of registered templates according to the finger attribute, so as to perform fingerprint matching on the fingerprint template.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: July 27, 2021
    Assignee: Novatek Microelectronics Corp.
    Inventors: Hsing-Lung Chung, Chien-Chung Liu, Jou-Chia Chen
  • Patent number: 11067861
    Abstract: A thin film transistor (TFT) substrate optimized for protection against the build up of static electricity defines a display area and a non-display area surrounding the display area. The TFT substrate includes a substrate and an electrostatic protection structure on the substrate and in the non-display area. The electrostatic protection structure includes a transparent conductive layer and a discharge metal layer on the transparent conductive layer. The discharge metal layer partially overlaps with the transparent conductive layer. The discharge metal layer is in direct contact with the transparent conductive layer. The transparent conductive layer has a width that is greater than a width of the discharge metal layer.
    Type: Grant
    Filed: December 11, 2020
    Date of Patent: July 20, 2021
    Assignee: Century Technology (Shenzhen) Corporation Limited
    Inventors: Qi Xu, Tao Wang, Sheng Xiao, Hui Wang, Chih-Chung Liu, Meng-Chieh Tai
  • Publication number: 20210202780
    Abstract: An optical package structure includes a substrate, an emitter, a first detector and a light-absorption material. The substrate has a first surface and a second surface opposite to the first surface, the substrate includes a via defining a third surface extending from the first surface to the second surface. The emitter is disposed on the first surface of the substrate. The first detector is disposed on the first surface and aligned with the via of the substrate. The light-absorption material is disposed on the third surface of the substrate.
    Type: Application
    Filed: December 31, 2019
    Publication date: July 1, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chi Sheng TSENG, Hui-Chung LIU, Ching-Han HUANG
  • Publication number: 20210200180
    Abstract: The present invention provides a planar three-dimensional displacement sensor for a multiaxis machining device. With the measurement of the (planar) three-dimensional displacement sensor in the multiaxis machining device, the multiaxis machining device and a multiaxis machining compensation method are able to eliminate various deformation effects effectively.
    Type: Application
    Filed: December 25, 2019
    Publication date: July 1, 2021
    Inventors: Yi-Yuh Hwang, Li-Chung Liu
  • Publication number: 20210176444
    Abstract: A video conference panoramic image spreading method is provided, in which an image capturing (acquiring) step is applied by using at least one panoramic camera to capture at least one video conference panoramic picture or image and a bodily human features recognition step is applied to achieve bodily human features recognition for recognizing each of conferee photographed subjects in the video conference panoramic picture or image, and then, based on the result of bodily human features recognition, steps of searching out a dividing point for a two-dimensional (2D)spread picture, image cutting and two-dimensional picture spreading, and stitching are carried out so as to avoid, in a real-time manner, conflicts of cutting of a human body in the conference panoramic picture or image based on the dividing point for two-dimensional spreading and correct the dividing point, for acquiring a two-dimensional panoramic picture that instantaneously reflects and completely and correctly corresponds to a primitive video co
    Type: Application
    Filed: February 5, 2020
    Publication date: June 10, 2021
    Inventor: PEI-CHUNG LIU
  • Patent number: 11024307
    Abstract: An apparatus supports smart assistant services with a plurality of smart service providers. The apparatus includes an audio device that receives a speech signal having a user utterance, captures the user utterance when the user utterance includes a user wake word, and sends the captured utterance to a backend computing device. The backend computing device replaces the user wake word with specific wake words associated with different smart service providers. The processed utterances are then sent to selected smart service providers. The backend computing device subsequently constructs feedback to the user utterance based on voice responses from the different smart service providers. The backend computing device then passes a digital representation of the feedback to the audio device, and the audio device converts the digital representation to an audio reply to the user utterance.
    Type: Grant
    Filed: September 18, 2018
    Date of Patent: June 1, 2021
    Assignee: Computime Ltd.
    Inventors: Hung Bun Choi, Kai Nang Pang, Yau Wai Ng, Chi Chung Liu, Tsz Kin Lee
  • Patent number: 11022131
    Abstract: Dual operation centrifugal fan apparatus and methods of operating same that may be used, for example, to cool the internal heat-generating components of an information handling system or other device. The dual operation centrifugal fan apparatus may be implemented in one embodiment as a self-cleaning blower apparatus that is operated in a first normal cooling direction to dissipate heat from internal components of an information handling system, and operated in second cleaning direction to reverse airflow and expel accumulated dust from the interior of the information handling system.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: June 1, 2021
    Assignee: Dell Products L.P.
    Inventors: Gurmeet S. Bhutani, Cheng-Kuo Wang, Hung-Pin Chien, Li-Chung Liu, Tien Hsiang Wu
  • Publication number: 20210144025
    Abstract: Building blocks for a smart device such as a thermostat include a user interface (UI) unit and a terminal (TML) unit. A UI unit may support one or more input data from a user and/or sensors and/or one or more control terminals. The UI unit may process each input datum or a combination of the input data, generate a control signal to one or more control terminals based on the processing, and send the control signal to one or more control terminals over a communication channel. A terminal unit, which may consist of one or more control terminals, transforms the received control signal into one or more controls to one or more associated environmental generators. One or more UI units may control one or more controlled apparatuses in conjunction with a mobile app to allow a unified user experience.
    Type: Application
    Filed: January 15, 2021
    Publication date: May 13, 2021
    Inventors: Hung Bun Choi, Wai-Leung Ha, Leung Yin Chan, Yau Wai Ng, Chi Chung Liu, Luke Li, Tsz Kin Lee, Chi Lung Chan, Hamza Yilmaz
  • Publication number: 20210132452
    Abstract: A thin film transistor substrate of reduced repaired line length and capacitance includes first repairing lines, data lines and second repairing lines insulated from each other. If one of the data lines is broken, the first repairing lines is electrically coupled to the input end of the broken data line, the second repairing line is electrically coupled to the output end of the broken data line, and the first repairing is electrically coupled to the second repairing line.
    Type: Application
    Filed: January 13, 2021
    Publication date: May 6, 2021
    Inventors: NING FANG, CHIH-CHUNG LIU, MENG-CHIEH TAI
  • Patent number: 10973144
    Abstract: Provided is an electronic device, including a main body, a first functional module, a linkage mechanism, and a second functional module. The first functional module is slidably provided on the main body between a first position and a second position. The linkage mechanism is provided on the main body and is connected to the first functional module. The second functional module is linked to the linkage mechanism and is provided on the main body in a turnover manner, in which when the first functional module is located at the first position, the second functional module is covered by the first functional module, and when the first functional module moves to the second position and the second functional module is exposed, the second functional module is driven by the linkage mechanism to be turned up.
    Type: Grant
    Filed: May 23, 2018
    Date of Patent: April 6, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Kuan-Chang Lee, Ming-Chung Liu, Wei-Ting Chen, Tung-Ying Wu
  • Publication number: 20210082791
    Abstract: A lead frame includes a die pad having a pad top surface and a pad bottom surface opposite to the top pad surface, a plurality of leads, each having a top lead surface and a bottom lead surface opposite to the top lead surface and disposed around the die pad, and a first molding compound disposed between the die pad and each of the leads. The first molding compound exposes the top pad surface of the die pad by covering a portion of the periphery of the top pad surface of the die pad. A method for manufacturing the lead frame is also disclosed.
    Type: Application
    Filed: September 13, 2019
    Publication date: March 18, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chi Sheng TSENG, Lu-Ming LAI, Ying-Chung CHEN, Hui-Chung LIU
  • Patent number: 10936018
    Abstract: An electronic device includes a supporting plate, at least one main positioning magnet and a body. The supporting plate has an edge. The supporting plate is provided with a first positioning magnet structure therein. The main positioning magnet is disposed at the supporting plate. The body is movably disposed at the supporting plate, wherein the body has a first axis and a second axis intersected with the first axis. The body is provided with a main auxiliary magnet and a first auxiliary magnet structure therein. The main auxiliary magnet is located at the intersection of the first axis and the second axis, and the first auxiliary magnet structure is located on the first axis. The main auxiliary magnet is configured to be aligned with the main positioning magnet and magnetically attracted to the main positioning magnet.
    Type: Grant
    Filed: June 11, 2019
    Date of Patent: March 2, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Hsing-Yi Kao, Ming-Chung Liu, Tung-Ying Wu, Kuan-Chang Lee
  • Patent number: 10928692
    Abstract: A thin film transistor substrate of reduced repaired line length and capacitance includes first repairing lines, data lines and second repairing lines insulated from each other. When one of the data lines is broken, the first repairing lines is electrically coupled to the input end of the broken data line, the second repairing line is electrically coupled to the output end of the broken data line, and the first repairing is electrically coupled to the second repairing line.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: February 23, 2021
    Assignee: Century Technology (Shenzhen) Corporation Limited
    Inventors: Ning Fang, Chih-Chung Liu, Meng-Chieh Tai
  • Patent number: D912127
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: March 2, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Tung-Ying Wu, Ming-Chung Liu, Kuan-Chang Lee
  • Patent number: D917460
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: April 27, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Chun-Wen Wang, Wang-Hung Yeh, Hsin-Chieh Fang, Che-Hsien Lin, Shu-Hung Lin, Che-Hsien Chu, Ming-Chung Liu, Tung-Ying Wu
  • Patent number: D920967
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: June 1, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Shu-Hsien Chu, Yu-Wen Cheng, Ming-Chung Liu
  • Patent number: D923617
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: June 29, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Tung-Ying Wu, Ming-Chung Liu, Kuan-Chang Lee
  • Patent number: D927048
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: August 3, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Yu-Hsin Chen, Hsing-Yi Kao, Ming-Chung Liu