Abstract: An electrostatic protection structure able to discharge static electricity of either polarity from a functional circuit including signal lines includes a discharge electrode and a plurality of electrostatic protection units electrically coupled to the discharge electrode. Each electrostatic protection unit includes a first TFT and a second TFT. The first TFT includes first gate, source, and drain, the second TFT includes second gate, source, and drain. The first gate and the first drain are electrically connected to one signal line. The first source is electrically connected to the second drain, the first drain is electrically connected to the second source, the second gate is electrically connected to the discharge electrode, and the second gate is electrically connected to the second drain.

Abstract: A thin film transistor array substrate includes an insulating substrate, a plurality of data lines, a plurality of common electrodes, and a common electrode layer. The insulating substrate defines a plurality of sub-pixel area arranged into a sub-pixel array including a plurality of rows and a plurality of columns. The plurality of data lines extend in a direction of the columns in the sub-pixel array. The plurality of common electrodes extend in the direction of the columns in the sub-pixel array. At least two of the plurality of data lines are between adjacent common electrodes of the plurality of common electrodes, and the plurality of common electrodes are applied with a same voltage. The common electrode layer is on the insulating substrate and the common electrodes are connected to different locations of the common electrode layer.

Abstract: An electrical conductivity test structure for testing an electrical conductivity of target traces in a display panel includes a controller, a first conductive layer, and a second conductive layer. The first conductive layer includes first and second traces. The at least one first trace and the at least one second trace are connected in parallel. Each first trace connects with the target trace and with the controller and each second trace connects with the target trace and with the controller. The second conductive layer connects with the first trace but is electrically insulated from the second trace. The second conductive layer transmits test signals to the first trace to test electrical conductivity between the controller and the target trace.

Abstract: Embodiments disclosed herein relate generally to methods for measuring a characteristic of a substrate. In an embodiment, the method includes scanning over the substrate with a scanning probe microscope, the substrate having fins thereon, the scanning obtaining images showing respective fin top regions of the fins, the scanning probe microscope interacting with respective portions of sidewalls of the fins by a scanning probe oscillated during the scanning, selecting images obtained at a predetermined depth below the fin top regions to obtain a line edge profile of the fins, by a processor-based system, analyzing the line edge profile of the fins using power spectral density (PSD) method to obtain spatial frequency data of the line edge profile of the fins, and by the processor-based system, calculating line edge roughness of the fins based on the spatial frequency data.

Abstract: The detailed principle, structure, manufacture and designing method of a retractable roof for large stadiums or other huge spaces are established. This roof is formed by using a number of connected and paralleled inflatable arc shaped tubes (called “air beams”) made of soft material (membrane). Using successive inflation to the tubes can realize deploying of the roof, and using successive deflation of tubes can realize retraction of the roof. All these processes can be completed by an automatically controlled program. A rigorous mathematics derivation and mechanics proof show that, the retractable air beam roof with durable membrane of ordinary durability can have a large span of over 100 meters, and can withstand in a regularly extreme (critical) weather (heavy wind, rain, snow and hail). The outstanding strong point of this kind of retractable roof is absolutely safe for spectators and performers (or competitors) inside the stadium.

Abstract: A semiconductor package structure includes a substrate; a first die on the substrate, wherein an active surface of the first die is facing away from the substrate; a second die on the active surface of the first die, electrically connected to the first die through a plurality of conductive terminals; and a sealing structure on the active surface of the first die, surrounding the plurality of conductive terminals and abutting the second die thereby forming a cavity between the first die and the second die. A method for manufacturing the semiconductor package structure is also provided.

Abstract: A liquid crystal display panel defines a display area and a non-display surrounding the display area. The panel includes a color filter substrate and a thin film transistor array substrate opposite to the color filter substrate. The color filter substrate includes a first substrate and a black matrix on the first substrate. The black matrix is in the display area and extending to the non-display area. A gap is defined in the black matrix and in the non-display area. The gap extends to be a circle around the display area and divides the black matrix into two independent parts. The color filter substrate includes a second substrate and a metal ring on a side of the second substrate facing the thin film transistor array substrate. The metal ring surrounds the display area and aligns with the gap.

Abstract: Disclosed are a 360-degree panorama image selective displaying camera and method, including a 360-degree panoramic image camera body that is provided, on an outside thereof, with at least one wide-angle lens module and a triggering section, at least one image displaying processing unit arranged inside the 360-degree panoramic image camera body, and a displaying-position triggering sensing mechanism. The image displaying processing unit is connected to the wide-angle lens module to process and output a 360-degree panorama image photographed and captured by the wide-angle lens module.

Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a semiconductor package structure includes a semiconductor die and a light absorbing layer. The semiconductor die has a first surface, a second surface and a third surface. An active layer of the semiconductor die is adjacent to the first surface. The second surface is opposite to the first surface. The third surface extends from the first surface to the second surface. The light absorbing layer covers the second surface and the third surface of the semiconductor die. The semiconductor die has a thickness defined from the first surface to the second surface, and the thickness of the semiconductor die is less than or equal to about 300 micrometers (?m).

Abstract: A method for repairing a white defect of a LCD panel includes providing a substrate, the substrate defining pixel areas which themselves comprise a base, a first metal layer, a first insulating layer, a semi-conductor layer, an ohmic contact layer, a source electrode, a drain electrode, and a second insulating layer; forming a through hole by laser in the second insulating layer, the through hole extending through the second insulating layer and separating the drain electrode into two spaced parts; forming a third insulating. layer to cover the first conductive layers, the second insulating layer and the though hole and forming a second conductive layer by laser on the third insulating layer to couple the first conductive layer to the second conductive layer.

Abstract: A controlling method and a communication device are disclosed. The controlling method is applied to a communication device with a plurality of antennas. The controlling method includes the following operations: comparing a plurality of environmental parameters of the antennas in a comparison time interval to generate a determination result, wherein the determination result includes whether to switch the plurality of the antennas; adjusting the comparison time interval and a maintenance time interval according to the determination result; and transmitting or receiving wireless signals in the maintenance time interval. The controlling method and the communication device have the advantages of communication capability optimization and power saving.

Abstract: A system and method for powering up a portable information handling system based on a position of a kickstand and a position of a keyboard relative to a chassis. When a kickstand is opened, a power control system determines if a keyboard is attached and opened. If the keyboard is not attached and the kickstand is opened, the power control system initiates powering up the portable information handling system. If the keyboard is attached and closed, the portable information handling system is not powered up. If the keyboard is attached and opened, the power control system initiates powering up the portable information handling system. If the kickstand is opened and the keyboard is opened, the power control system initiates powering up the portable information handling system.

Abstract: An example backlight module, an example display, and an example mobile terminal are provided. The backlight module includes a backplane having a light reflecting surface, a light source layer disposed on the light reflecting surface, and at least one light mixing component disposed on the light source layer. The light source layer has at least one point light source, and the at least one light mixing component is in a one-to-one correspondence with the at least one point light source. Each light mixing component includes a light reflecting layer configured to reflect some light rays emitted by a corresponding point light source, and a light transmission layer configured to transmit a light ray reflected by the light reflecting layer and further reflected by the light reflecting surface. The light reflecting layer is disposed above the light source layer and is configured to reflect some light rays emitted by the corresponding point light source.

Abstract: The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.

Abstract: An apparatus supports smart assistant services with a plurality of smart service providers. The apparatus includes an audio device that receives a speech signal having a user utterance, captures the user utterance when the user utterance includes a user wake word, and sends the captured utterance to a backend computing device. The backend computing device replaces the user wake word with specific wake words associated with different smart service providers. The processed utterances are then sent to selected smart service providers. The backend computing device subsequently constructs feedback to the user utterance based on voice responses from the different smart service providers. The backend computing device then passes a digital representation of the feedback to the audio device, and the audio device converts the digital representation to an audio reply to the user utterance.

Abstract: A lead frame includes a die pad having a pad top surface and a pad bottom surface opposite to the top pad surface, a plurality of leads, each having a top lead surface and a bottom lead surface opposite to the top lead surface and disposed around the die pad, and a first molding compound disposed between the die pad and each of the leads. The first molding compound exposes the top pad surface of the die pad by covering a portion of the periphery of the top pad surface of the die pad. A method for manufacturing the lead frame is also disclosed.

Abstract: A fingerprint recognition apparatus with dynamically adjustable power levels of light-emitting modules is introduced, including: a touch detecting module detecting a touch coordinate and a touch area of a finger on a panel; a plurality of light-emitting modules emitting light to the finger on the panel; a processing module coupling to the touch detecting module and the plurality of light-emitting modules and outputting a setting value according to the touch coordinate, the touch area and positions of the plurality of light-emitting modules; a light-emitting power adjusting module adjusting power levels of the plurality of light-emitting modules according to the setting value; and an image outputting module outputting the fingerprint according to the fingerprint image.