Patents by Inventor Chung Liu

Chung Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210036658
    Abstract: A semiconductor package structure includes an organic substrate having a first surface, a first recess depressed from the first surface, a first chip over the first surface and covering the first recess, thereby defining a first cavity enclosed by a back surface of the first chip and the first recess, and a second chip over the first chip. The first cavity is an air cavity or a vacuum cavity.
    Type: Application
    Filed: October 19, 2020
    Publication date: February 4, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chi Sheng TSENG, Lu-Ming LAI, Ching-Han HUANG, Hui-Chung LIU, Kuo-Hua LAI, Cheng-Ling HUANG
  • Patent number: 10897374
    Abstract: Building blocks for a smart device such as a thermostat include a user interface (UI) unit and a terminal (TML) unit. A UI unit may support one or more input data from a user and/or sensors and/or one or more control terminals. The UI unit may process each input datum or a combination of the input data, generate a control signal to one or more control terminals based on the processing, and send the control signal to one or more control terminals over a communication channel. A terminal unit, which may consist of one or more control terminals, transforms the received control signal into one or more controls to one or more associated environmental generators. One or more UI units may control one or more controlled apparatuses in conjunction with a mobile app to allow a unified user experience.
    Type: Grant
    Filed: July 17, 2018
    Date of Patent: January 19, 2021
    Assignee: Computime Ltd.
    Inventors: Hung Bun Choi, Wai-Leung Ha, Leung Yin Chan, Yau Wai Ng, Chi Chung Liu, Luke Li, Tsz Kin Lee, Chi Lung Chan, Hamza Yilmaz
  • Patent number: 10895889
    Abstract: A notebook computer including a first body, a second body having a first display, a third body having a second display, a first hinge module, a second hinge module, a first electronic module, a second electronic module, and a switch module is provided. The first body and the second body rotate relatively via the first hinge module, and the second body and the third body rotate relatively via the second hinge module. The switch module is disposed in the first hinge module, and the switch module is electrically connected to and activates the first electronic module or the second electronic module depending on a rotating state of the first hinge module.
    Type: Grant
    Filed: January 4, 2019
    Date of Patent: January 19, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Tung-Ying Wu, Ming-Chung Liu, Kuan-Chang Lee
  • Patent number: 10891620
    Abstract: A system and method is provided for accessing data across networks and from mobile devices for providing fraud detection and risk management and that maintains anonymity of users. More particularly, a system and method implemented inside a payment server is provided that can access data across networks and from mobile devices, including encoded personally identifiable information (PII) data, and aggregate and analyze such data from multiple payment networks to generate a risk score that is sent to one or more payment networks for fraud detection and risk management, while maintaining anonymity of users.
    Type: Grant
    Filed: August 4, 2016
    Date of Patent: January 12, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yunsong Meng, Aneesh Ali Nainamvalappil Cheriyakath, Manan Kapadia, Minseok Park, Chung Liu
  • Patent number: 10883368
    Abstract: A screw expander includes a main body, at least an expansion screw and an adjusting component. The main body has a high pressure region, an expansion region and a low pressure region. The expansion screw is disposed at the expansion region and has an air inlet end and an air outlet end, wherein the air inlet end is connected to the high pressure region, and the air outlet end is connected to the low pressure region. The adjusting component covers the expansion screw, and is adapted to move relatively to the expansion screw to change an opening area of the air inlet end or an opening area of the air outlet end, such that a pressure of an air exhausted from the air outlet end is adjusted.
    Type: Grant
    Filed: March 5, 2018
    Date of Patent: January 5, 2021
    Assignee: Fu Sheng Industrial Co. Ltd.
    Inventor: Yao-Chung Liu
  • Publication number: 20200402879
    Abstract: A semiconductor package structure includes a substrate; a first die on the substrate, wherein an active surface of the first die is facing away from the substrate; a second die on the active surface of the first die, electrically connected to the first die through a plurality of conductive terminals; and a sealing structure on the active surface of the first die, surrounding the plurality of conductive terminals and abutting the second die thereby forming a cavity between the first die and the second die. A method for manufacturing the semiconductor package structure is also provided.
    Type: Application
    Filed: June 21, 2019
    Publication date: December 24, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chi Sheng TSENG, Lu-Ming LAI, Hui-Chung LIU
  • Patent number: 10872547
    Abstract: A gate driver with reduced voltage fluctuations driving a display device generates pulse signals shifted in a specified phase. The gate driver includes connected unit circuits. Each unit circuit includes an output terminal, input and output transistors, and a holding module. First and second control signals, alternating oppositely between high and low states, govern the two transistors. The input transistor is controlled by a first control signal and outputs a high level voltage to a first node based on a trigger signal. The output transistor outputs the shifted pulse signal synchronously with a clock control signal, based on the high level voltage of the first node. Initially, the trigger signal is low and the first and second control signals are high. The holding module outputs the low level voltage to the output terminal based on the first control signal and the second control signal.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: December 22, 2020
    Assignee: Century Technology (Shenzhen) Corporation Limited
    Inventors: Hui Wang, Ning Fang, Chih-Chung Liu, Ming-Tsung Wang, Meng-Chieh Tai
  • Patent number: 10840637
    Abstract: An electronic assembly including a first device, a second device, a third device, and a triggering member is provided. The first device has at least one first positioning member, at least one first electrical connector, and at least one second electrical connector. The second device has at least one second positioning member and at least one third electrical connector. The third device has at least one fourth electrical connector. The triggering member is disposed in the third device. The triggering member has a driven portion and a locking portion opposite to each other. In a first state, the first device is detachably assembled and electrically connected to the second device. In a second state, the first device is detachably assembled and electrically connected to the second device, and the first device is also detachably assembled and electrically connected to the third device.
    Type: Grant
    Filed: February 20, 2019
    Date of Patent: November 17, 2020
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Yun Bai, Ming-Chung Liu, Yu-Ning Chang, Hong-Tien Wang, Shih-Chin Chou
  • Publication number: 20200340807
    Abstract: Embodiments disclosed herein relate generally to methods for measuring a characteristic of a substrate. In an embodiment, the method includes scanning over the substrate with a scanning probe microscope, the substrate having fins thereon, the scanning obtaining images showing respective fin top regions of the fins, the scanning probe microscope interacting with respective portions of sidewalls of the fins by a scanning probe oscillated during the scanning, selecting images obtained at a predetermined depth below the fin top regions to obtain a line edge profile of the fins, by a processor-based system, analyzing the line edge profile of the fins using power spectral density (PSD) method to obtain spatial frequency data of the line edge profile of the fins, and by the processor-based system, calculating line edge roughness of the fins based on the spatial frequency data.
    Type: Application
    Filed: July 13, 2020
    Publication date: October 29, 2020
    Inventors: Wei-Shan HU, Dong GUI, Jang Jung LEE, Che-Liang LI, Duen-Huei HOU, Wen-Chung LIU
  • Patent number: 10812017
    Abstract: A semiconductor package structure includes an organic substrate having a first surface, a first recess depressed from the first surface, a first chip over the first surface and covering the first recess, thereby defining a first cavity enclosed by a back surface of the first chip and the first recess, and a second chip over the first chip. The first cavity is an air cavity or a vacuum cavity.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: October 20, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chi Sheng Tseng, Lu-Ming Lai, Ching-Han Huang, Hui-Chung Liu, Kuo-Hua Lai, Cheng-Ling Huang
  • Patent number: 10802548
    Abstract: An electronic device including a first body and a second body pivoted to each other is provided. The first body includes a frame, a display assembled an inner side of the frame, and a latch assembly disposed within the frame to lock or release the display. When the first body and the second body are rotated relatively to a tent position, the display is released by the latch assembly so as to be moved along the frame.
    Type: Grant
    Filed: September 11, 2018
    Date of Patent: October 13, 2020
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Tung-Ying Wu, Ming-Chung Liu, Kuan-Chang Lee
  • Patent number: 10746542
    Abstract: Embodiments disclosed herein relate generally to methods for measuring a characteristic of a substrate. In an embodiment, the method includes scanning over the substrate with a scanning probe microscope, the substrate having fins thereon, the scanning obtaining images showing respective fin top regions of the fins, the scanning probe microscope interacting with respective portions of sidewalls of the fins by a scanning probe oscillated during the scanning, selecting images obtained at a predetermined depth below the fin top regions to obtain a line edge profile of the fins, by a processor-based system, analyzing the line edge profile of the fins using power spectral density (PSD) method to obtain spatial frequency data of the line edge profile of the fins, and by the processor-based system, calculating line edge roughness of the fins based on the spatial frequency data.
    Type: Grant
    Filed: March 22, 2019
    Date of Patent: August 18, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wei-Shan Hu, Dong Gui, Jang Jung Lee, Che-Liang Li, Duen-Huei Hou, Wen-Chung Liu
  • Publication number: 20200259539
    Abstract: A controlling method and a communication device are disclosed. The controlling method is applied to a communication device with a plurality of antennas. The controlling method comprises: comparing a plurality of environmental parameters of the antennas in a comparison time interval to generate a determination result, wherein the determination result includes whether to switch the plurality of the antennas; adjusting the comparison time interval and a maintenance time interval according to the determination result; and transmitting or receiving wireless signals in the maintenance time interval. The controlling method and the communication device have the advantages of communication capability optimization and power saving.
    Type: Application
    Filed: February 4, 2020
    Publication date: August 13, 2020
    Inventors: Wei-Fan LAI, Ssu-Hao SU, Che-Yao FAN, Chi-Chung LIU
  • Publication number: 20200242328
    Abstract: A fingerprint identification device and method are provided. The fingerprint identification device includes a touch-sensing panel, a fingerprint sensor, and a processing circuit. The fingerprint sensing area of the fingerprint sensor is located in the touch-sensing area of the touch-sensing panel. The processing circuit senses the touch area of an object in the touch-sensing area via the touch-sensing panel when the object contacts the touch-sensing area of the touch-sensing panel. The processing circuit senses the fingerprint of the object via the fingerprint sensor to obtain a fingerprint template. The processing circuit determines the finger attribute of the object based on the physical characteristics of the touch area. The processing circuit selects the registered template related to the finger attribute from a plurality of registered templates according to the finger attribute, so as to perform fingerprint matching on the fingerprint template.
    Type: Application
    Filed: January 30, 2019
    Publication date: July 30, 2020
    Applicant: Novatek Microelectronics Corp.
    Inventors: Hsing-Lung Chung, Chien-Chung Liu, Jou-Chia Chen
  • Publication number: 20200215816
    Abstract: The invention provides a process for producing a printed article wherein a deposit liquid is provided to a substrate together with a carrier liquid. Also provided is a printed article obtained or obtainable by the process of the invention, such as a printed article. The invention further provides an apparatus suitable for carrying out the process of the invention, comprising devices configured to provide a flow of each of the deposit liquid and carrier liquid to a substrate, a flow channel for carrying each of the said liquids and an aperture through which at least the deposit liquid must pass. In some embodiments, the process of the invention is performed using the apparatus of the invention. The invention therefore also provides the use of the apparatus of the invention to perform the process of the invention.
    Type: Application
    Filed: June 22, 2018
    Publication date: July 9, 2020
    Inventors: Andrew WATT, Wing Chung LIU
  • Patent number: D902283
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: November 17, 2020
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Hsing-Yi Kao, Ming-Chung Liu, Shih-Neng Hong
  • Patent number: D904493
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: December 8, 2020
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Tung-Ying Wu, Ming-Chung Liu, Kuan-Chang Lee
  • Patent number: D906401
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: December 29, 2020
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Tung-Ying Wu, Ming-Chung Liu, Kuan-Chang Lee
  • Patent number: D907046
    Type: Grant
    Filed: June 11, 2019
    Date of Patent: January 5, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Hsing-Yi Kao, Ming-Chung Liu, Yu-Hsin Chen
  • Patent number: D907047
    Type: Grant
    Filed: September 18, 2019
    Date of Patent: January 5, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Hsing-Yi Kao, Ming-Chung Liu, Chia-Wei Huang, Yu-Hsin Chen, Hong-Tien Wang