Abstract: A semiconductor package and a method for fabricating the same are provided. The semiconductor package includes a wafer, a plurality of semiconductor chips each having a connection pad and being stacked on the wafer, resin layers formed to expose top surfaces of the connection pads and to cover lateral surfaces and top surfaces of the semiconductor chips, through lines formed in at least one side of opposite sides of each of the semiconductor chips, to be spaced apart from the semiconductor chips, and to extend in a first direction, and redistribution lines arranged between the through lines, formed to extend in a second direction on the resin layers, and connected to the connection pads, wherein the through lines and the redistribution lines include barrier layers formed on lateral surfaces and bottom surfaces of the through lines and the redistribution lines, and conductive layers formed on the barrier layers.

Abstract: A method for checking and modulating battery capacity and power based on charging/discharging characteristics is provided. In terms of discharge, a relationship between an open circuit voltage and an output electric capacity of a battery is measured to obtain a first characteristic curve. A relationship between a voltage and the output electric capacity of a battery at a predetermined maximum charge/discharge current rate is measured to obtain a second characteristic curve. A characteristic boundary line passing the first and the second characteristic points respectively selected from the first and the second characteristic curves is established. A voltage value corresponding to the first characteristic point is higher than a voltage value corresponding to the second characteristic point. The first and the second characteristic curves, and the characteristic boundary line define an operation range. The battery is charged/discharged within the operation range.

Abstract: A stack package usable in a three-dimensional (3D) system-in-package (SIP) includes a first semiconductor chip, a second semiconductor chip, and a supporter. The first semiconductor chip includes a through silicon via (TSV), and the second semiconductor chip is stacked on the first semiconductor chip and is electrically connected to the first semiconductor chip through the TSV of the first semiconductor chip. The supporter is attached onto the first semiconductor chip so as to be spaced apart from an edge of the second semiconductor chip.

Abstract: A charging method for a rechargeable battery and a related charging architecture are provided. The provided charging method includes following steps. A characteristic curve of the rechargeable battery related to charge cycle vs. a residual capacity of a non-constant voltage charging stage under a warranty life limitation is provided. An expected residual capacity corresponding to a condition when a terminal voltage of the rechargeable battery reaches a limited charge voltage is found from the characteristic curve related to the charge cycle vs. the residual capacity of the non-constant voltage charging stage by using a current charge cycle count of the rechargeable battery. A real residual capacity corresponding to a condition when the terminal voltage of the rechargeable battery reaches the limited charge voltage approaches to the expected residual capacity by adjusting a charging current of the rechargeable battery.

Abstract: A stack of semiconductor chips, a semiconductor device, and a method of manufacturing are disclosed. The stack of semiconductor chips may comprise a first chip of the stack, a second chip of the stack over the first chip, conductive bumps, a homogeneous integral underfill material, and a molding material. The conductive bumps may extend between an upper surface of the first chip and a lower surface of the second chip. The homogeneous integral underfill material may be interposed between the first chip and the second chip, encapsulate the conductive bumps, and extend along sidewalls of the second chip. The homogeneous integral underfill material may have an upper surface extending in a direction parallel to an upper surface of the second chip and located adjacent the upper surface of the second chip.

Abstract: A stack of semiconductor chips, a semiconductor device, and a method of manufacturing are disclosed. The stack of semiconductor chips may comprise a first chip of the stack, a second chip of the stack over the first chip, conductive bumps, a homogeneous integral underfill material, and a molding material. The conductive bumps may extend between an upper surface of the first chip and a lower surface of the second chip. The homogeneous integral underfill material may be interposed between the first chip and the second chip, encapsulate the conductive bumps, and extend along sidewalls of the second chip. The homogeneous integral underfill material may have an upper surface extending in a direction parallel to an upper surface of the second chip and located adjacent the upper surface of the second chip.

Abstract: An electronic apparatus with improved heat dissipation comprises a first body with a first shell and a second shell, a second body, a coupling device and a linkage device. The first shell is pivotally connected to the second shell to form an accommodation space. The first shell can pivot relative to the second shell to enlarge the accommodation space and form an opening between the first shell and the second shell. The coupling device couples the second body and the second shell to pivot the second body relative to the second shell to expose or hide the first shell. The linkage device drives the first shell to pivot relative to the second shell. When the second body pivots relative to the second shell toward a first direction, the linkage device drives the first shell to pivot relative to the second shell toward a second direction opposite to the first direction.

Abstract: A battery pack and a method for controlling charge-and-discharge of the battery pack by its thermoelectric property are provided, in which the battery pack has a plurality of thermal regions divided by different ranges of temperature. The battery pack includes a plurality of parallel-connected battery groups and a plurality of variable resistances. The parallel-connected battery groups are located in the thermal regions respectively, and each of the parallel-connected battery groups includes batteries connected in parallel. The variable resistances are disposed between two parallel-connected battery groups.

Abstract: A method for estimating a capacity of a battery is provided includes providing a look-up table storing data relating to a voltage and a capacity of the battery, and initializing the battery to reach an initialization state which serves as a starting point for a discharging process. The method also includes discharging the battery, from the initialization state, by a first amount of charge to reach a first state, calculating an actual capacity of the battery based on a measured amount of charge discharged from the initialization state to the first state, measuring an open-circuit voltage at the first state, obtaining a look-up capacity of the battery from the look-up table according to the open-circuit voltage measured at the first state, calculating a difference between the actual capacity and the look-up capacity, and correcting the look-up table based on the difference.

Abstract: A device with a touch-sensitive display provides a virtual keyboard having several 3D graphical objects as virtual keys, while 3D graphical objects are displayed on the touch-sensitive display and are three-dimensionally rotatable. When the device detects contact and determines the contact as matching a rotation operation, the 3D image rotates and the device can determine, from the final position into which the 3D image has been rotated, the representative plane of the 3D image. When the key is executed by a selecting operation, the character associated with the representative plane is input to the device.

Abstract: A characteristic tracking method for a battery module including at least one battery is disclosed. A look-up table is provided according to a primary characteristic of the battery. It is determined whether a battery has satisfied a preset condition when the battery module is operated from a usage state to an idling state. The battery is measured to have obtained a first voltage and a real capacity when the battery satisfies the preset condition. The measured first voltage is utilized to locate a table capacity of the battery from the look-up table. The look-up table is updated according to the real capacity and the table capacity. A peripheral circuit of characteristic tracking method has been exhibited.

Abstract: A method for manufacturing a tape wiring board in accordance with the present invention may employ an imprinting process in forming a wiring pattern, thereby reducing the number of processes for manufacturing a tape wiring board and allowing the manufacturing process to proceed in a single production line. Therefore, the manufacturing time and cost may be reduced. A profile of the wiring pattern may be determined by the shape of an impression pattern of a mold. This may establish the top width of inner and outer leads and incorporate tine pad pitch. Although ILB and OLB process may use an NCP, connection reliability may be established due to the soft and elastic wiring pattern.

Abstract: A stack of semiconductor chips, a semiconductor device, and a method of manufacturing are disclosed. The stack of semiconductor chips may comprise a first chip of the stack, a second chip of the stack over the first chip, conductive bumps, a homogeneous integral underfill material, and a molding material. The conductive bumps may extend between an upper surface of the first chip and a lower surface of the second chip. The homogeneous integral underfill material may be interposed between the first chip and the second chip, encapsulate the conductive bumps, and extend along sidewalls of the second chip. The homogeneous integral underfill material may have an upper surface extending in a direction parallel to an upper surface of the second chip and located adjacent the upper surface of the second chip.

Abstract: A method for checking and modulating battery capacity and power based on charging/discharging characteristics is provided. In terms of discharge, a relationship between an open circuit voltage and an output electric capacity of a battery is measured to obtain a first characteristic curve. A relationship between a voltage and the output electric capacity of a battery at a predetermined maximum charge/discharge current rate is measured to obtain a second characteristic curve. A characteristic boundary line passing the first and the second characteristic points respectively selected from the first and the second characteristic curves is established. A voltage value corresponding to the first characteristic point is higher than a voltage value corresponding to the second characteristic point. The first and the second characteristic curves, and the characteristic boundary line define an operation range. The battery is charged/discharged within the operation range.

Abstract: An electronic apparatus and a keyboard supporting module thereof are provided. The electronic apparatus includes a heat source, the keyboard supporting module and a push-button key module. The keyboard supporting module includes a keyboard supporting structure and an insulator. The keyboard supporting structure is thermally connected to the heat source. Particularly, the keyboard supporting structure supports the push-button key module with the insulator.

Abstract: An electronic apparatus with improved heat dissipation comprises a first body with a first shell and a second shell, a second body, a coupling device and a linkage device. The first shell is pivotally connected to the second shell to form an accommodation space. The first shell can pivot relative to the second shell to enlarge the accommodation space and form an opening between the first shell and the second shell. The coupling device couples the second body and the second shell to pivot the second body relative to the second shell to expose or hide the first shell. The linkage device drives the first shell to pivot relative to the second shell. When the second body pivots relative to the second shell toward a first direction, the linkage device drives the first shell to pivot relative to the second shell toward a second direction opposite to the first direction.

Abstract: A charging method for a rechargeable battery is disclosed. A preset power is provided to the rechargeable battery when the rechargeable battery is connected to a charger for execution of a first charge process. A use state of the rechargeable battery is obtained. A first adjustable charge power is provided to the rechargeable battery when the rechargeable battery is reconnected to the charger for execution of a second charge process.

Abstract: A power adapter for an electronic device selectively works in different modes according to a working state signal of the electronic device. When the electronic device is powered off or on with a battery in a determined charge state, the power adapter controls a relay to turn off the relay to disconnect power to the electronic device.

Abstract: Provided are camera modules capable of effectively shielding electromagnetic (EM) waves and methods of fabricating the same. A method of fabricating a camera module includes, preparing a first wafer including an array of lens units. Then, a second wafer including an array of image sensor CSPs (chip-scale packages) is prepared. Each of the image sensor CSPs includes an image sensor chip corresponding to one of the lens units. The first wafer is stacked on the second wafer. The first wafer and the second wafer are cut to form a trench exposing the top surface of the image sensor chip at the interface between adjacent lens units. The trench is filled with a first material used for forming a housing. The first material and the image sensor chip are cut at the interface between the adjacent lens units.

Abstract: A stack package usable in a three-dimensional (3D) system-in-package (SIP) includes a first semiconductor chip, a second semiconductor chip, and a supporter. The first semiconductor chip includes a through silicon via (TSV), and the second semiconductor chip is stacked on the first semiconductor chip and is electrically connected to the first semiconductor chip through the TSV of the first semiconductor chip. The supporter is attached onto the first semiconductor chip so as to be spaced apart from an edge of the second semiconductor chip.