Abstract: The present disclosure provides a package structure having a photonic integrated circuit, the package structure includes a substrate, a chip and an optical module. The chip has an optical waveguide structure and a recessed portion. The optical waveguide structure is adjacent to the recessed portion. The recessed portion faces the substrate, and the chip is engaged to the substrate by flip chip. The optical module is provided in the recessed portion of the chip.

Abstract: A cell module is provided. The cell module includes a first substrate; a second substrate disposed opposite to the first substrate; a cell unit disposed between the first substrate and the second substrate; a first thermosetting resin layer disposed between the cell unit and the first substrate; a first protective layer disposed between the cell unit and the first thermosetting resin layer; and a second thermosetting resin layer disposed between the cell unit and the second substrate. The first protective layer includes a first polymer, wherein the cross-linking degree of the first polymer is 0 to 42.3%.

Abstract: A system for determining cardiovascular characteristics is to be disposed on the body of a subject. The body has a detection area. The system includes a detector member and a processor. The detector member includes at least sixteen precordial electrodes which are to be placed on the chest of the subject within the detection area and which produce at least sixteen electrocardiogram (ECG) signals. The processor calculates at least twenty-four characteristic values based on the ECG signals. The characteristic values serve as basis for determining a location of chronic or acute myocardial ischemia in the body and a region of chronic or acute myocardial ischemia in the heart of the subject.

Abstract: The present disclosure provides a package structure having a photonic integrated circuit, the package structure includes a substrate, a chip and an optical module. The chip has an optical waveguide structure and a recessed portion. The optical waveguide structure is adjacent to the recessed portion. The recessed portion faces the substrate, and the chip is engaged to the substrate by flip chip. The optical module is provided in the recessed portion of the chip.

Abstract: An exemplary process for forming a cured hybrid magnesium cement composition may include first combining a mixture of magnesium-containing material, a metal silicate inorganic polymer having a repeat unit of SiP2O7, and a salt having a non-metallic oxide anion, and then mixing the mixture with water.

Abstract: A judging method for a module peeling time of a soft electronic fabric module is provided. The method includes: preselecting a plurality of module material combinations, the plurality of module material combinations respectively comprising a substrate material, a wire material and a packaging material; extracting the plurality of module material combinations to generate a plurality of module material combination parameters; generating a plurality of machine learning training data based on the plurality of module material combination parameters and a plurality of module pre-processing conditions; and training a machine learning model according to the plurality of machine learning training data to provide an optimized prediction model for judging a module peeling time.

Abstract: The present invention relates to antibodies that bind to ENO1 and applications thereof. The applications encompass therapies and diagnostics of diseases or disorders associated with ENO1 activation and progression thereof using such antibodies. Specifically, the antibodies of the present invention bind to ENO1 on the surface of cancer cells and are useful in reducing cancer cell growth and metastasis and prolonging survival time. The antibodies of the present invention may also be used in detecting ENO1, diagnosis and prognosis of cancer and monitoring cancer progression. The present invention also provides a method for screening for a candidate agent for cancer therapy.

Abstract: An apparatus may include a heat pipe with a first portion residing in a first plane, a second portion residing in the first plane and a third portion positioned between the first portion and the second portion, the third portion residing in a second plane spaced-apart from the first plane. The apparatus further includes a base plate including an opening and a clip plate having a first region, a second region and a third region positioned between the first and the second regions. The third portion of the heat pipe is positioned within the opening, and the clip plate is coupled to the base plate such that i) the third region of the clip plate is in superimposition with the third portion of the heat pipe and ii) third region of the clip plate resides in the first plane.

Abstract: The present disclosure provides a package structure having a photonic integrated circuit, the package structure includes a substrate, a chip and an optical module. The chip has an optical waveguide structure and a recessed portion. The optical waveguide structure is adjacent to the recessed portion. The recessed portion faces the substrate, and the chip is engaged to the substrate by flip chip. The optical module is provided in the recessed portion of the chip.

Abstract: A multi-layer textile includes fabric tiles bonded to a base textile layer. The fabric tiles might be cut from one or more larger fabric pieces, which are textile remnants or scraps from prior manufacturing processes. The fabric tiles are bonded to the base textile layer in a manner that reduces the susceptibility of the fabric tiles to peel away from the base textile layer.

Abstract: Microelectromechanical devices and methods of manufacture are presented. Embodiments include bonding a mask substrate to a first microelectromechanical system (MEMS) device. After the bonding has been performed, the mask substrate is patterned. A first conductive pillar is formed within the mask substrate, and a second conductive pillar is formed within the mask substrate, the second conductive pillar having a different height from the first conductive pillar. The mask substrate is then removed.

Abstract: Semiconductor devices and methods of manufacturing the semiconductor devices are presented. In embodiments the methods of manufacturing include depositing a first bonding layer on a first substrate, wherein the first substrate comprises a semiconductor substrate and a metallization layer. The first bonding layer and the semiconductor substrate are patterned to form first openings. A second substrate is bonded to the first substrate. After the bonding the second substrate, the second substrate is patterned to form second openings, at least one of the second openings exposing at least one of the first openings. After the patterning the second substrate, a third substrate is bonded to the second substrate, and after the bonding the third substrate, the third substrate is patterned to form third openings, at least one of the third openings exposing at least one of the second openings.

Abstract: A semiconductor chip and a manufacturing method thereof are provided. The semiconductor chip includes: an array of pillar structures, disposed on a front surface of the semiconductor chip, and respectively including a ground pillar and multiple working pillars laterally spaced apart from and substantially parallel with a line portion of the ground pillar; and dummy pillar structures, disposed on the front surface of the semiconductor chip and laterally surrounding the pillar structures. Active devices formed inside the semiconductor chip are electrically connected to the working pillar. The ground pillars of the pillar structures and the dummy pillar structures are electrically connected to form a current pathway on the front surface of the semiconductor chip.

Abstract: The disclosure includes a convertible light device comprising a device housing, a battery pack removably coupled to the housing, and an elongate flexible light source detachably coupled to the device housing and electrically coupled to the battery pack, where the elongate flexible light source comprises a plurality of LEDs. In some embodiments, the convertible light device is configured to convert between a rope mode and a lantern mode. In the rope mode, the elongate flexible light source may be configured to extend from the device housing. In the lantern mode, the elongate flexible light source may be configured to wrap around the device housing.

Abstract: A time-of-flight sensor includes a substrate, a single photon avalanche detection chip, a vertical cavity surface-emitting laser, a first narrowband pass filter glass, and a second narrowband pass filter glass and a resin shell. The single photon avalanche detection chip is attached on the substrate, and the vertical cavity surface-emitting laser is also attached on the substrate. The first narrowband pass filter glass is arranged above the single photon avalanche detection chip, and the second narrowband pass filter glass is arranged above the vertical cavity surface-emitting laser. The resin shell covers the first narrowband pass filter glass and the second narrowband pass filter glass, and an upper surface of the first narrowband pass filter glass and an upper surface of the second narrowband pass filter glass are coplanar with an upper surface of the resin shell.

Abstract: A filament spool dry box includes a shell, a dehumidifier and a sleeve component. The shell includes a hanging structure configured to allow a bracket to be disposed in for hanging the shell. The dehumidifier is disposed inside the shell. The sleeve component is rotatably disposed inside the shell and configured to allow a filament to be disposed on. A central axis of the hanging structure is offset from and above a central axis of the sleeve component. The filament spool dry box can isolate the filament from an external environment outside the shell and remove moisture from an internal environment inside the shell by the dehumidifier. Therefore, the filament spool dry box can prevent the filament inside the shell from absorbing moisture. Furthermore, the filament spool dry box can replace disposable spools in the prior art and be energy saving and environmental protecting.

Abstract: A semiconductor device includes a substrate, one or more wiring layers disposed over the substrate, a passivation layer disposed over the one or more wiring layers, a first conductive layer disposed over the passivation layer, a second conductive layer disposed over the first conductive layer, an isolation structure formed in the first and second conductive layers to isolate a part of the first and second conductive layers, and a first metal pad disposed over the isolation structure and the part of the first and second conductive layers. In one or more of the foregoing or following embodiments, the semiconductor device further includes a second metal pad disposed over the second conductive layer and electrically isolated from the first metal pad.

Abstract: A portable information handling system touchpad detects button inputs with a downward press at the touch surface that translates to a central button under the touch surface through a frame biased up by a central beam and plural biasing members. Downward presses at the touch surface off center translate towards the center of the frame to provide a central button input that is attributed with right, left and or center button push input values based upon detection of a location at which the downward press touch is sensed by the touch surface.