Patents by Inventor Chung-Yi Lin

Chung-Yi Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11140327
    Abstract: An image-capturing device includes a camera module and a controller. The camera module captures an image of an object. The camera module includes a first camera and a second camera. The first camera has a first field of view (FOV) and captures an image in the first FOV, so as to produce a first image. The second camera is adjacent to the first camera and has a second FOV, in which the first FOV is wider than the second FOV. The second camera captures an image in the second FOV, so as to produce a second image. A displayer displays one of the first and second images. When a zoom ratio of the first image increases, the controller selects a display region in the first image according to an object distance, such that the display region is enlarged and then displayed on the displayer.
    Type: Grant
    Filed: June 26, 2019
    Date of Patent: October 5, 2021
    Assignee: AVer Information Inc.
    Inventors: Kuo-Hao Huang, Chung-Yi Kao, Eric Chi-Chian Yu, Shyh-Feng Lin
  • Publication number: 20210296283
    Abstract: Various embodiments of the present disclosure are directed towards a three-dimensional (3D) trench capacitor, as well as methods for forming the same. In some embodiments, a first substrate overlies a second substrate so a front side of the first substrate faces a front side of the second substrate. A first trench capacitor and a second trench capacitor extend respectively into the front sides of the first and second substrates. A plurality of wires and a plurality of vias are stacked between and electrically coupled to the first and second trench capacitors. A first through substrate via (TSV) extends through the first substrate from a back side of the first substrate, and the wires and the vias electrically couple the first TSV to the first and second trench capacitors. The first and second trench capacitors and the electrical coupling therebetween collectively define the 3D trench capacitor.
    Type: Application
    Filed: March 20, 2020
    Publication date: September 23, 2021
    Inventors: Xin-Hua Huang, Chung-Yi Yu, Yeong-Jyh Lin, Rei-Lin Chu
  • Publication number: 20210290085
    Abstract: An optical medical detection device includes a first physiological sensor and a processor. The first physiological sensor is adapted to continuously output a first photoplethysmography (PPG) signal generated by a first skin area of an object, and further to optionally and continuously output a second photoplethysmography (PPG) signal generated by a second skin area of the object. The second skin area is different from the first skin area. The processor is electrically connected to the first physiological sensor. The processor is adapted to convert the first PPG signal and the second PPG signal into a physiological feature, and the physiological feature is at least one of a blood pressure ratio and a blood flow velocity.
    Type: Application
    Filed: March 18, 2020
    Publication date: September 23, 2021
    Inventors: Shih-Jen Lu, Yang-Ming Chou, Chien-Yi Kao, Hsin-Yi Lin, Chih-Ming Sun, Chung-Yuo Wu
  • Patent number: 11128227
    Abstract: A secondary controller applied to a secondary side of a power converter includes a control signal generation circuit. The control signal generation circuit is coupled to an output terminal of the secondary side of the power converter for detecting an output voltage of the secondary side and enabling a pulse signal to a signal source of the secondary side of the power converter, wherein the signal source enables a turning-on signal according to the pulse signal. The turning-on signal is coupled to a primary-side auxiliary winding of the power converter through a secondary-side auxiliary winding of the power converter to make the primary-side auxiliary winding generate a voltage, and a primary controller of a primary side of the power converter makes the primary side of the power converter be turned on according to the voltage.
    Type: Grant
    Filed: January 2, 2020
    Date of Patent: September 21, 2021
    Assignee: Leadtrend Technology Corp.
    Inventors: Hung-Ching Lee, Chung-Wei Lin, Tsung-Chien Wu, Bo-Yi Wu
  • Patent number: 11126813
    Abstract: The invention provides a fingerprint sensing device. A control circuit controls a part of point light sources to irradiate a fingerprint of a user. Reflected light generated by using the plurality of point light sources to irradiate the fingerprint of the user forms a light-emitted pattern including a plurality of reflected light patterns on a sensing layer, wherein each of the reflected light patterns is provided by a corresponding point light source, and each of the sensing units senses the reflected light patterns corresponding to at least two point light sources.
    Type: Grant
    Filed: April 6, 2020
    Date of Patent: September 21, 2021
    Assignees: Egis Technology Inc., Igistec Co., Ltd.
    Inventors: Ming-Yuan Cheng, Chung-Yi Wang, Sung-Hua Chen, Yu-Hsuan Lin
  • Patent number: 11101209
    Abstract: An embodiment semiconductor package includes a bare semiconductor chip, a packaged semiconductor chip adjacent the bare semiconductor chip, and a redistribution structure bonded to the bare semiconductor chip and the packaged semiconductor chip. The redistribution structure includes a first redistribution layer having a first thickness; a second redistribution layer having a second thickness; and a third redistribution layer between the first redistribution layer and the second redistribution layer. The third redistribution layer has a third thickness greater than the first thickness and the second thickness. The package further includes an underfill disposed between the bare semiconductor chip and the redistribution structure and a molding compound encapsulating the bare semiconductor chip, the packaged semiconductor chip, and the underfill.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: August 24, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Shi Liu, Chien-Hsun Lee, Jiun Yi Wu, Hao-Cheng Hou, Hung-Jen Lin, Jung Wei Cheng, Tsung-Ding Wang, Yu-Min Liang, Li-Wei Chou
  • Patent number: 11036911
    Abstract: A method of the present disclosure includes receiving a design layout; performing routing to the design layout to obtain a routed layout including an interconnect structure including a first metal layer, a second metal layer over the first metal layer, a third metal layer over the second metal layer, and a plurality of functional vias; performing optical proximity correction (OPC) operations to the routed layout to obtain an OPC'ed layout; and modifying the OPC'ed layout to obtain a modified layout. The modifying of the routed layout includes inserting a first plurality of dummy vias between the first metal layer and the second metal layer to avoid horizontal bridging between two adjacent metal lines in the first metal layer, and inserting a second plurality of dummy vias between the second metal layer and the third metal layer to avoid vertical coupling to the first plurality of dummy vias.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: June 15, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Han-Chung Lin, Chung-Yi Lin, Yen-Sen Wang
  • Publication number: 20210097228
    Abstract: A method of the present disclosure includes receiving a design layout; performing routing to the design layout to obtain a routed layout including an interconnect structure including a first metal layer, a second metal layer over the first metal layer, a third metal layer over the second metal layer, and a plurality of functional vias; performing optical proximity correction (OPC) operations to the routed layout to obtain an OPC'ed layout; and modifying the OPC'ed layout to obtain a modified layout. The modifying of the routed layout includes inserting a first plurality of dummy vias between the first metal layer and the second metal layer to avoid horizontal bridging between two adjacent metal lines in the first metal layer, and inserting a second plurality of dummy vias between the second metal layer and the third metal layer to avoid vertical coupling to the first plurality of dummy vias.
    Type: Application
    Filed: December 30, 2019
    Publication date: April 1, 2021
    Inventors: Han-Chung Lin, Chung-Yi Lin, Yen-Sen Wang
  • Publication number: 20210093825
    Abstract: A respiratory system includes a gas supply unit and a heating and humidifying unit. The gas supply unit includes a gas supply port; the heating and humidifying unit is detachably combined with the gas supply unit. The heating and humidifying unit includes a base, an adapter and a water tank. The base includes a control element, and the adapter is combined with the base and can rotate at least 90 degrees relative to the base. The water tank is detachably combined with the base, and the water tank includes a gas inlet and a gas outlet, wherein when the water tank is combined with the base, the gas inlet penetrates through an aperture of the base to be fluidly connected to the gas supply port, and the gas outlet is fluidly connected to the adapter.
    Type: Application
    Filed: September 25, 2020
    Publication date: April 1, 2021
    Inventors: Chun-Yen LIN, Chung-Yi LIN, Jhih-Teng YAO, Chih-Tsan CHIEN, Tsung-Chung KAN, Hao-Yu CHAN
  • Patent number: 10709255
    Abstract: An inflation identification connector and an air mattress system having the same is provided. The inflation identification connector is insertable into a connection seat of a gas delivery host. The connection seat has a light detection component coupled to a controller disposed in the gas delivery host. The inflation identification connector includes a body and an identification structure. The detection result of the light detection component depends on the identification structure and thus is conducive to identification. Upon its insertion into the connection seat, the inflation identification connector is identified by the gas delivery host, enhancing ease of use and protecting manual operation against mistakes. The gas delivery host is not only applicable to different types of air mattresses but also conducive to streamlined management of the air mattress system and reduction of management costs and risks.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: July 14, 2020
    Assignee: APEX MEDICAL CORP.
    Inventors: David Huang, Wen-Bin Shen, Ju-Chien Cheng, Ming-Heng Hsieh, Fu-Wei Chen, Chih-Kuang Chang, Yi-Ling Liu, Sheng-Wei Lin, Chung-Yi Lin
  • Publication number: 20200194326
    Abstract: A package includes a die, a plurality of conductive structures, an encapsulant, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The conductive structures surround the die. The conductive structures include elliptical columns. The encapsulant encapsulates the die and the conductive structures. The redistribution structure is over the active surface of the die and the encapsulant. The redistribution structure is electrically connected to the die and the conductive structures.
    Type: Application
    Filed: February 24, 2020
    Publication date: June 18, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Sheng-Huan Chiu, Chun-Jen Chen, Chen-Shien Chen, Kuo-Chio Liu, Kuo-Hui Chang, Chung-Yi Lin, Hsi-Kuei Cheng, Yi-Jen Lai
  • Patent number: 10573573
    Abstract: A package includes a die, a plurality of first conductive structures, a plurality of second conductive structures, an encapsulant, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The first conductive structures and the second conductive structures surround the die. The first conductive structures include cylindrical columns and the second conductive structures include elliptical columns or conical frustums. The encapsulant encapsulates the die, the first conductive structures, and the second conductive structures. The redistribution structure is over the active surface of the die and the encapsulant. The redistribution structure is electrically connected to the die, the first conductive structures, and the second conductive structures.
    Type: Grant
    Filed: March 20, 2018
    Date of Patent: February 25, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Sheng-Huan Chiu, Chun-Jen Chen, Chen-Shien Chen, Kuo-Chio Liu, Kuo-Hui Chang, Chung-Yi Lin, Hsi-Kuei Cheng, Yi-Jen Lai
  • Publication number: 20190295913
    Abstract: A package includes a die, a plurality of first conductive structures, a plurality of second conductive structures, an encapsulant, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The first conductive structures and the second conductive structures surround the die. The first conductive structures include cylindrical columns and the second conductive structures include elliptical columns or conical frustums. The encapsulant encapsulates the die, the first conductive structures, and the second conductive structures. The redistribution structure is over the active surface of the die and the encapsulant. The redistribution structure is electrically connected to the die, the first conductive structures, and the second conductive structures.
    Type: Application
    Filed: March 20, 2018
    Publication date: September 26, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Sheng-Huan Chiu, Chun-Jen Chen, Chen-Shien Chen, Kuo-Chio Liu, Kuo-Hui Chang, Chung-Yi Lin, Hsi-Kuei Cheng, Yi-Jen Lai
  • Publication number: 20190142180
    Abstract: An inflation identification connector and an air mattress system having the same is provided. The inflation identification connector is insertable into a connection seat of a gas delivery host. The connection seat has a light detection component coupled to a controller disposed in the gas delivery host. The inflation identification connector includes a body and an identification structure. The detection result of the light detection component depends on the identification structure and thus is conducive to identification. Upon its insertion into the connection seat, the inflation identification connector is identified by the gas delivery host, enhancing ease of use and protecting manual operation against mistakes. The gas delivery host is not only applicable to different types of air mattresses but also conducive to streamlined management of the air mattress system and reduction of management costs and risks.
    Type: Application
    Filed: October 30, 2018
    Publication date: May 16, 2019
    Inventors: DAVID HUANG, WEN-BIN SHEN, JU-CHIEN CHENG, MING-HENG HSIEH, FU-WEI CHEN, CHIH-KUANG CHANG, YI-LING LIU, SHENG-WEI LIN, CHUNG-YI LIN
  • Patent number: 10164002
    Abstract: A semiconductor device is disclosed. The semiconductor device includes a first set of conductive layers coupled with an active device, a second set of conductive layers for connection to an external device, a set of intermediate conductive layers between the first set of conductive layers and the second set of conductive layers, and a resistive layer disposed in the set of intermediate conductive layers.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: December 25, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Wan-Te Chen, Chung-Hui Chen, Chii-Ping Chen, Chung-Yi Lin, Wen-Sheh Huang
  • Publication number: 20180151665
    Abstract: A semiconductor device is disclosed. The semiconductor device includes a first set of conductive layers coupled with an active device, a second set of conductive layers for connection to an external device, a set of intermediate conductive layers between the first set of conductive layers and the second set of conductive layers, and a resistive layer disposed in the set of intermediate conductive layers.
    Type: Application
    Filed: February 16, 2017
    Publication date: May 31, 2018
    Inventors: WAN-TE CHEN, CHUNG-HUI CHEN, CHII-PING CHEN, CHUNG-YI LIN, WEN-SHEH HUANG
  • Patent number: 9691749
    Abstract: A semiconductor structure less affected by stress and a method for forming the same are provided. The semiconductor structure includes a semiconductor chip. Stress-sensitive circuits are substantially excluded out of an exclusion zone to reduce the effects of the stress to the stress-sensitive circuits. The stress-sensitive circuits include analog circuits. The exclusion zone preferably includes corner regions of the semiconductor chip, wherein the corner regions preferably have a diagonal length of less than about one percent of the diagonal length of the semiconductor chip. The stress-sensitive analog circuits preferably include devices having channel lengths less than about five times the minimum channel length.
    Type: Grant
    Filed: August 12, 2014
    Date of Patent: June 27, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chao-Yuan Su, Chung-Yi Lin
  • Patent number: 9678541
    Abstract: A pivot shaft transmission device provides a security system and is easy to assemble. The pivot shaft transmission device includes at least one rotary shaft, a drive section movable with the rotation of the rotary shaft, a driver (transversely) movable along a rail between a first position and a second position, a turning unit having a first end connected with the driver and a second end, and a transmission unit assembled with the second end of the turning unit. The transmission unit includes a first section, a second section and at least one elastic body assembled with each other. When the turning unit is swung, the transmission unit is driven to (longitudinally) move to drive a connection section and a carrier body for lifting or lowering a substrate body or a frame in accordance with the operation mode of an electronic apparatus.
    Type: Grant
    Filed: October 17, 2014
    Date of Patent: June 13, 2017
    Assignee: First Dome Corporation
    Inventors: An Szu Hsu, Wang Jui Lee, Chung Yi Lin, Ya Ching Lin
  • Patent number: 9563015
    Abstract: An optical waveguide structure and a manufacturing method thereof are disclosed. The optical waveguide structure has a first waveguide layer, a binding layer, and a second waveguide layer. The first waveguide layer has a taper portion, a connecting portion, and a strip portion. The manufacturing method of the optical waveguide structure has steps of etching to form the first waveguide layer, and then etching to form the second waveguide layer under the first waveguide layer.
    Type: Grant
    Filed: December 7, 2015
    Date of Patent: February 7, 2017
    Assignee: National Sun Yat-sen University
    Inventors: Yi-Jen Chiu, Yi-Jhe Chen, Chung-Yi Lin, Wei Lin
  • Publication number: 20170023734
    Abstract: An optical waveguide structure and a manufacturing method thereof are disclosed. The optical waveguide structure has a first waveguide layer, a binding layer, and a second waveguide layer. The first waveguide layer has a taper portion, a connecting portion, and a strip portion. The manufacturing method of the optical waveguide structure has steps of etching to form the first waveguide layer, and then etching to form the second waveguide layer under the first waveguide layer.
    Type: Application
    Filed: December 7, 2015
    Publication date: January 26, 2017
    Inventors: Yi-Jen CHIU, Yi-Jhe CHEN, Chung-Yi LIN, Wei LIN