Abstract: Integrated circuit methods are described. The methods include providing a photomask that includes two main features for two via openings and further includes an optical proximity correction (OPC) feature linking the two main features; forming a hard mask layer on a substrate, the hard mask layer including two trench openings; forming a patterned resist layer over the hard mask layer using the photomask, wherein the patterned resist layer includes a peanut-shaped opening with two end portion aligned with the two trench openings of the hard mask layer, respectively; and performing a first etch process to the substrate using the hard mask layer and the patterned resist layer as a combined etch mask.

Abstract: Protection of a solder ball joint is disclosed in which the solder ball joint is located below the surface level of the encapsulating buffer layer. The buffering layer is etched to expose one or more electrode posts, each of which may be made up of a single column or multiple columns. A top layer resulting either from a top conductive cap or a plating layer around the electrode posts also lies below the buffer layer. When the solder ball is placed onto the posts, the solder/ball joint is protected in a position below the surface of the buffer layer, while still maintaining an electrical connection between the various solder balls and their associated or capping/plating material, electrode posts, wiring layers, and circuit layers. Therefore, the entire ball joint is protected from direct stress.

Abstract: The present invention is related to a resource sharing device in a communication system including multiple computing devices. The resource sharing device includes a first interface to couple with a first computing device, a second interface to couple with a second computing device, a function device to provide a function accessible to the first and second computing devices, and a switch device coupled with the function device, the switch device to generate a device descriptor of the function device so that when the first and second computing devices are coupled with the resource sharing device the device descriptor of the function device is sent to the first and second computing devices so as to share the function of the function device to the first and second computing devices and allow the first and second computing devices to be controllable at a time by the function of the function device.

Abstract: A hinge includes a first connecting member, a shaft fixed to the first connecting member, a second connecting member, and a fastener fixed to the shaft. The shaft includes a shaft body including a first resisting surface and a second resisting surface. The second connecting member defines a through hole for the shaft body rotatably passing through the second connecting member. A first block and a second block extend towards each other from a wall bounding the through hole. The first block faces the second resisting surface, and the second block faces the first resisting surface. When the second connecting member is rotated to a predetermined degree relative to the first connecting member, the first block resists against the second resisting surface, and the second block resists against the second resisting surface.

Abstract: A hinge includes a rack, a shaft, a bracket, a first stop member, and a second stop member. The shaft includes a post, and an engaging portion secured to the rack. The bracket defines a pivot hole extending through a first side to a second side of the bracket. The bracket includes a first restricting block extending from the first side and a second restricting block extending towards the second side. The first stop member contacts with the first side of the bracket and forms a first stop portion to resist against the first restricting block of the bracket. The second stop member contacts with the second side of the bracket and forms a second stop portion to resist against the second restricting block of the bracket.

Abstract: A method of tracking a vocal target is disclosed. An image-capturing device is employed to capture an image including the participating targets. Next, an image tracking method is used to determine the image regions where the participating targets are respectively located. The found image regions are compared with the vocal regions of each vocal targets detected by a sound-detecting device. Thus, the positions where the vocal targets are located are precisely detected. Thus, cost of the video system can be effectively reduced and the video image resolution can be effectively promoted.

Abstract: An extension pad has a clamp device to hold a tablet computer on the extension pad securely. The clamp device has a mounting base and a rotating clamp. A hinge for a tablet computer extension pad in accordance with the present invention is mounted in the clamp device and has a pivoting leaf, a limiting segment, a stationary leaf and a spring. The pivoting leaf is mounted in the rotating clamp. The limiting segment is mounted around the pivoting leaf to selectively limit rotation of the rotating clamp. The stationary leaf is mounted rotatably on the pivoting leaf and is mounted securely in the mounting base. The spring is mounted between the pivoting leaf and the stationary leaf. Consequently, the hinge allows the clamp device to hold the tablet computer securely on the extension pad.

Abstract: A interference assembly includes first and second elements, each of which includes a mating side, both of which face each other. Two fixing portions extend from the first mating side. The second mating side defines a first fixing slot and a second fixing slot. A first sliding portion is angled on the second mating side between an end of the first fixing slot and an end of the second fixing slot. A second sliding portion is angled on the second mating side between the opposite end of the first fixing slot and the opposite end of the second fixing slot. One of the fixing portions may engage in the first fixing slot and move along the first sliding portion, and the other may engage the second fixing slot and move along the second sliding portion. A hinge utilizing the assembly and a collapsible device utilizing the hinge are also disclosed.

Abstract: A stacked, multi-die semiconductor device and method of forming thereof. A preferred embodiment comprises disposing a stack of semiconductor dies to a substrate. The stacking arrangement is such that a lateral periphery of an upper die is cantilevered over a lower die thereby forming a recess. A supporting adhesive layer containing a filler is disposed upon the substrate about the lateral periphery of the lower die and substantially filling the recess. In one preferred embodiment, the filler comprises microspheres. In another preferred embodiment, the filler comprises a dummy die, an active die, or a passive die.

Abstract: Protection of a solder ball joint is disclosed in which the solder ball joint is located below the surface level of the encapsulating buffer layer. The buffering layer is etched to expose one or more electrode posts, each of which may be made up of a single column or multiple columns. A top layer resulting either from a top conductive cap or a plating layer around the electrode posts also lies below the buffer layer. When the solder ball is placed onto the posts, the solder/ball joint is protected in a position below the surface of the buffer layer, while still maintaining an electrical connection between the various solder balls and their associated or capping/plating material, electrode posts, wiring layers, and circuit layers. Therefore, the entire ball joint is protected from direct stress.

Abstract: An adjustable multi-function support assembly comprises an extension mechanism, a first abutting mechanism and a second abutting mechanism. The extension mechanism includes a plurality of tubes that are axially pivotally coupled with each other. An assistant sleeve is disposed between tubes for assisting the extension of the respective tubes, so that the user can adjust the support assembly according to the requirements. The extension mechanism further utilizes the anti-slip block disposed on the first abutting mechanism and the anti-slip block disposed on the second abutting mechanism to increase the abutting friction.

Abstract: A hinge is mounted between a body and a cover of an electronic device and has a bracket, two leaves and two fasteners. The bracket is formed integrally as a single piece and has two barrels formed integrally with each other. The leaves correspond to and are rotatably mounted respectively through the barrels. The fasteners are securely mounted respectively on the leaves and hold the leaves in the corresponding bracket. The hinge allows the cover to pivot on the body 360 degrees.

Abstract: An extension pad has a clamp device to hold a tablet computer on the extension pad securely. The clamp device has a mounting base and a rotating clamp. A hinge for a tablet computer extension pad in accordance with the present invention is mounted in the clamp device and has a pivoting leaf, a limiting segment, a stationary leaf and a spring. The pivoting leaf is mounted in the rotating clamp. The limiting segment is mounted around the pivoting leaf to selectively limit rotation of the rotating clamp. The stationary leaf is mounted rotatably on the pivoting leaf and is mounted securely in the mounting base. The spring is mounted between the pivoting leaf and the stationary leaf. Consequently, the hinge allows the clamp device to hold the tablet computer securely on the extension pad.

Abstract: A hinge has a pintle with a flange, a base disk having a mounting hole mounted securely around the pintle and multiple positioning holes formed concentrically around the mounting hole, a positioning disk abutting a side of the base disk and having a limiting hole mounted securely around the pintle and protrusions protruding from the positioning disk and selectively engaging with the positioning holes and a fastener mounted on the pintle to hold the base disk and the positioning disk on the pintle. A frame and a supporting stem of an electronic photo frame can be respectively mounted securely on a front and rear end of the pintle, so that the supporting stem can be rotated to position at multiple stay positions which are distributed at a circular route parallel to the frame for selectively erecting the electronic photo frame in vertical type or horizontal type.

Abstract: A pivotal device has a first support, a first axle, a second support and a second axle. The first support has a first seat with an axle hole. The first axle is pivotally mounted on the first support and has a first post and a first holder. The first post is inserted rotatably into the axle hole. The first holder is attached securely to the first seat. The second support is attached securely to the first support and has a second seat with an opening. The second axle is pivotally mounted on the second support and has a second post and a second holder. The second post is inserted rotatably into the opening of the second seat. The second holder is attached securely to a cover of an electrical device. Hence, the electrical device can be folded or unfolded through the pivotal device smoothly.

Abstract: A semiconductor package assembly is presented. The assembly comprises a first chip and a second chip. The back surfaces of the first and the second chips are thermally attached through a die attach material. The front surface of the first chip is attached to a substrate through bumps. A heat spreader extends from a surface of the semiconductor package assembly into the semiconductor package assembly and thermally attaches to the back surface of the first chip or the front surface of the second chip. Depending on the sizes of the chips and the location of the bonding pads, the heat spreader may be attached to the back surface of the first chip or the front surface of the second chip.

Abstract: A method of tracking a vocal target is disclosed. An image-capturing device is employed to capture an image including the participating targets. Next, an image tracking method is used to determine the image regions where the participating targets are respectively located. The found image regions are compared with the vocal regions of each vocal targets detected by a sound-detecting device. Thus, the positions where the vocal targets are located are precisely detected. Thus, cost of the video system can be effectively reduced and the video image resolution can be effectively promoted.

Abstract: A semiconductor structure less affected by stress and a method for forming the same are provided. The semiconductor structure includes a semiconductor chip. Stress-sensitive circuits are substantially excluded out of an exclusion zone to reduce the effects of the stress to the stress-sensitive circuits. The stress-sensitive circuits include analog circuits. The exclusion zone preferably includes corner regions of the semiconductor chip, wherein the corner regions preferably have a diagonal length of less than about one percent of the diagonal length of the semiconductor chip. The stress-sensitive analog circuits preferably include devices having channel lengths less than about five times the minimum channel length.

Abstract: A thermally-enhanced cavity down ball grid array (CDBGA) package is provided. In one embodiment, the CDBGA package comprises a heat dissipating substrate having a heat spreader and a chip carrier, the chip carrier having a cavity therethrough to allow a chip to be attached to the heat spreader. A chip having an active surface and a corresponding back surface, has the back surface of the chip mounted on the heat spreader. A dummy chip is attached to the active surface of the chip. The dummy chip has a coefficient of thermal expansion approximately equal to the coefficient of thermal expansion of the chip. An encapsulant encapsulates the chip and portions of the dummy chip. Dummy chip 90 has a coefficient of thermal expansion (CTE) approximately equal to the coefficient of thermal expansion of the chip 40.

Abstract: A stacked, multi-die semiconductor device and method of forming thereof. A preferred embodiment comprises disposing a stack of semiconductor dies to a substrate. The stacking arrangement is such that a lateral periphery of an upper die is cantilevered over a lower die thereby forming a recess. A supporting adhesive layer containing a filler is disposed upon the substrate about the lateral periphery of the lower die and substantially filling the recess. In one preferred embodiment, the filler comprises microspheres. In another preferred embodiment, the filler comprises a dummy die, an active die, or a passive die.