Abstract: A read current high enough to threshold a phase change memory element may be used to read the element without thresholding the memory element. The higher current may improve performance in some cases. The memory element does not threshold because the element is read and the current stopped prior to triggering the memory element.

Abstract: A current mirror circuit is provided with a first current mirror including first and second mirror transistors sharing a common control terminal; the first mirror transistor has a conduction terminal for receiving, during a first operating condition, a first reference current, and the second mirror transistor has a respective conduction terminal for providing, during the first operating condition, a mirrored current based on the first reference current. The current mirror circuit is provided with a switching stage operable to connect the control terminal to the conduction terminal of the first mirror transistor during the first operating condition, and to disconnect the control terminal from the same conduction terminal of the first mirror transistor, and either letting it substantially float or connecting it to a reference voltage, during a second operating condition, in particular a condition of stand-by.

Abstract: A read current high enough to threshold a phase change memory element may be used to read the element without thresholding the memory element. The higher current may improve performance in some cases. The memory element does not threshold because the element is read and the current stopped prior to triggering the memory element.

Abstract: A read current high enough to threshold a phase change memory element may be used to read the element without thresholding the memory element. The higher current may improve performance in some cases. The memory element does not threshold because the element is read and the current stopped prior to triggering the memory element.

Abstract: According to a method for multilevel reading of a phase change memory cell a bit line (9) and a PCM cell (2) are first selected and a first bias voltage (VBL, V00) is applied to the selected bit line (9). A first read current (IRD00), that flows through the selected bit line (9) in response to the first bias voltage (VBL, V00), is compared with a first reference current (I00). The first reference current (I00) is such that the first read current (IRD00) is lower than the first reference current (I00), when the selected PCM cell (2) is in a reset state, and is otherwise greater. It is then determined whether the selected PCM cell (2) is in the reset state, based on comparing the first read current (IRD00) with the first reference current (I00). A second bias voltage (VBL, V01), greater than the first bias voltage (VBL, V00), is applied to the selected bit line (9) if the selected PCM cell (2) is not in the reset state.

Abstract: A method for accessing a phase change memory device, wherein a first sub-plurality of bitlines is grouped in a first group and a second sub-plurality of bitlines is grouped in a second group. At least a bitline in the first and second groups are selected; currents are supplied to the selected bitlines; and a selected wordline is biased. The bitlines are selected by selecting a first bitline in the first group and, while the first bitline is selected, selecting a second bitline in the second group which is arranged on the selected wordline symmetrically to the first bitline in the first group.

Abstract: A method for programming multilevel PCM cells envisages: forming an amorphous region of amorphous phase change material in a storage element of a PCM cell by applying one or more reset pulse; and forming a conductive path of crystalline phase change material through the amorphous region by applying one or more set pulse, a size of the conductive path defining a programmed state of the PCM cell and an output electrical quantity associated thereto, and being controlled by the value of the reset pulse and set pulse. The step of forming an amorphous region envisages adaptively and iteratively determining, during the programming operations, a value of the reset pulse optimized for electrical and/or physical properties of the PCM cell, and in particular determining a minimum amplitude value of the reset pulse, which allows programming a desired programmed state and a desired value of the output electrical quantity.

Abstract: Multilevel phase change memory cells may be programmed forming amorphous regions of amorphous phase change material in a storage region of the phase change memory cell. Crystalline paths of crystalline phase change material are formed through the amorphous regions of amorphous phase change material. Lengths of the crystalline paths are controlled so that at least a first crystalline path has a first length in a first programming state and a second crystalline path has a second length, different from the first length, in a second programming state.

Abstract: According to a method for multilevel reading of a phase change memory cell a bit line (9) and a PCM cell (2) are first selected and a first bias voltage (VBL, V00) is applied to the selected bit line (9). A first read current (IRD00), that flows through the selected bit line (9) in response to the first bias voltage (VBL, V00), is compared with a first reference current (I00). The first reference current (I00) is such that the first read current (IRD00) is lower than the first reference current (I00), when the selected PCM cell (2) is in a reset state, and is otherwise greater. It is then determined whether the selected PCM cell (2) is in the reset state, based on comparing the first read current (IRD00) with the first reference current (I00). A second bias voltage (VBL, V01), greater than the first bias voltage (VBL, V00), is applied to the selected bit line (9) if the selected PCM cell (2) is not in the reset state.

Abstract: A method for accessing a phase change memory device, wherein a first sub-plurality of bitlines is grouped in a first group and a second sub-plurality of bitlines is grouped in a second group. At least a bitline in the first and second groups are selected; currents are supplied to the selected bitlines; and a selected wordline is biased. The bitlines are selected by selecting a first bitline in the first group and, while the first bitline is selected, selecting a second bitline in the second group which is arranged on the selected wordline symmetrically to the first bitline in the first group.

Abstract: A current mirror circuit is provided with a first current mirror including a first and a second mirror transistors sharing a common control terminal; the first mirror transistor has a conduction terminal for receiving, during a first operating condition, a first reference current, and the second mirror transistor has a respective conduction terminal for providing, during the first operating condition, a mirrored current based on the first reference current. The current mirror circuit is provided with a switching stage operable to connect the control terminal to the conduction terminal of the first mirror transistor during the first operating condition, and to disconnect the control terminal from the same conduction terminal of the first mirror transistor, and either letting it substantially floating or connecting it to a reference voltage, during a second operating condition, in particular a condition of stand-by.

Abstract: A phase change memory device includes a bitline biasing unit; and a bitline selection unit connecting a selected bitline to the bitline biasing unit and disconnecting deselected bitlines from the bitline biasing unit in an operative condition. A bitline discharge unit is connected to the bitlines to discharge leakage currents in the bitlines. The bitline discharge unit has a voltage regulation unit and a plurality of bitline discharge switches coupled between the voltage regulation unit and a respective bitline. The bitline discharge switches are controlled to connect the deselected bitlines to the voltage regulation unit and to disconnect the selected bitline from the voltage regulation unit. The voltage regulation unit comprises a PMOS transistor coupled between a regulated voltage bus and a reference potential line. The regulated voltage bus is connected to the bitline discharge switches and the control terminal of the PMOS transistor is biased to a constant voltage.

Abstract: In a current reference generator device, a voltage reference generator stage generates a reference voltage (Vref) and an active element output stage receives the reference voltage (Vref) and outputs a reference current (Iref) as a function of the reference voltage (Vref). A control stage is operatively coupled to the voltage reference generator stage and to the active element output stage and controls a first trimmable parameter (m) associated to the voltage reference generator stage and a second trimmable parameter associated to the active element output stage, so as to compensate for changes in a value of the reference current (Iref) due to manufacturing process deviations.

Abstract: A read circuit for reading at least one memory cell adapted to storing a logic value, the at least one memory cell including: a storage element made of a phase-change material; and an access element for coupling the storage element to the read circuit in response to a selection of the memory cell, the read circuit including: a sense current supply arrangement for supplying a sense current to the at least one memory cell; and at least one sense amplifier for determining the logic value stored in the memory cell on the basis of a voltage developing thereacross, the at least one sense amplifier comprising a voltage limiting circuit for limiting the voltage across the memory cell for preserving the stored logic value, wherein the voltage limiting circuit includes a current sinker for sinking a clamping current, which is subtracted from the sense current and depends on the stored logic value.

Abstract: A read circuit for reading at least one memory cell adapted to storing a logic value, the at least one memory cell including: a storage element made of a phase-change material; and an access element for coupling the storage element to the read circuit in response to a selection of the memory cell, the read circuit including: a sense current supply arrangement for supplying a sense current to the at least one memory cell; and at least one sense amplifier for determining the logic value stored in the memory cell on the basis of a voltage developing thereacross, the at least one sense amplifier comprising a voltage limiting circuit for limiting the voltage across the memory cell for preserving the stored logic value, wherein the voltage limiting circuit includes a current sinker for sinking a clamping current, which is subtracted from the sense current and depends on the stored logic value.

Abstract: A read current high enough to threshold a phase change memory element may be used to read the element without thresholding the memory element. The higher current may improve performance in some cases. The memory element does not threshold because the element is read and the current stopped prior to triggering the memory element.

Abstract: A bit alterable memory may include current generators in a periphery outside the main memory core. Current may be generated in the periphery and driven into the core. As a result, the capacitance of the memory cells has a lowered effect. The current may be generated using the chip supply voltage and then mirrored using a pump voltage. In some embodiments, the mirroring may be ratioed at the partition level and multiplied at the plane level. A delay may be provided before applying the currents to the cell to accommodate for transients.

Abstract: Multilevel phase change memory cells may be programmed forming amorphous regions of amorphous phase change material in a storage region of the phase change memory cell. Crystalline paths of crystalline phase change material are formed through the amorphous regions of amorphous phase change material. Lengths of the crystalline paths are controlled so that at least a first crystalline path has a first length in a first programming state and a second crystalline path has a second length, different from the first length, in a second programming state.

Abstract: In a current reference generator device, a voltage reference generator stage generates a reference voltage (Vref) and an active element output stage receives the reference voltage (Vref) and outputs a reference current (Iref) as a function of the reference voltage (Vref). A control stage is operatively coupled to the voltage reference generator stage and to the active element output stage and controls a first trimmable parameter (m) associated to the voltage reference generator stage and a second trimmable parameter associated to the active element output stage, so as to compensate for changes in a value of the reference current (Iref) due to manufacturing process deviations.

Abstract: A read current high enough to threshold a phase change memory element may be used to read the element without thresholding the memory element. The higher current may improve performance in some cases. The memory element does not threshold because the element is read and the current stopped prior to triggering the memory element.