Abstract: A semiconductor device is disclosed including a multi-module interposer for enabling communication between one or more semiconductor dies within the device and a host device on which the semiconductor device is mounted. The multi-module interposer may be formed at the wafer level, and provides fan-out signal paths to and from the one or more dies in the device. Additionally, the multi-module interposer allows any of a variety of different semiconductor packaging configurations to be formed at the wafer level, including for example wire bonded packages, flip chip packages and through silicon via (TSV) packages.

Abstract: A method and apparatus for automatically transferring sections from a sample block to a tape and for transferring select sections to a slide. A tissue storage system for storing cut sections on the tape and digital storage system for storing photos and other information during the transfer of the sections can also be provided, thereby creating a tissue repository and data repository for future use.

Abstract: The present disclosure relates to a visual field testing method, system, and testing apparatus based on head-mounted testing equipment (02). The method includes: transmitting, by the testing apparatus in electronic equipment (01), a start notification for starting monitoring of a movement trajectory of a pupil of a current eye to be tested to an eye movement tracking system (03) after receiving a start test instruction transmitted from a controller; receiving, by the testing apparatus, movement state information of the pupil (202) that is transmitted from the eye movement tracking system (03); and determining, by the testing apparatus, the movement trajectory (203) of the pupil according to the movement state information, wherein the controller is a component that is associated with the head-mounted testing equipment (02) and communicatively connected to the testing apparatus of the electronic equipment (01). The method can reduce the testing complexity and may also improve the testing accuracy and comfort.

Abstract: An automated tape transfer apparatus including a tape feed mechanism feeding a continuous length of an adhesive tape through the automated tape transfer apparatus and a tape applicator applying the adhesive tape to a cutting face of a sample block, wherein a section of the sample block is adhered to the adhesive tape after cutting of the section from the sample block. A slide station transfers the cut section from the adhesive tape to a slide.

Abstract: An automated tape transfer apparatus including a tape feed mechanism feeding a continuous length of an adhesive tape through the automated tape transfer apparatus and a tape applicator applying the adhesive tape to a cutting face of a sample block, wherein a section of the sample block is adhered to the adhesive tape after cutting of the section from the sample block. A slide station transfers the cut section from the adhesive tape to a slide.

Abstract: A semiconductor device is disclosed including a stack of semiconductor die. Openings are formed in the semiconductor die as they are added to the stack, which openings are aligned at different levels of the stack. The openings are filled with an electrically insulative compound to form a molded column through all semiconductor die in the stack. After all semiconductor die are added to the stack, a via may be drilled through the molded column to electrically interconnect each semiconductor die in the stack.

Abstract: A Real-Time Locating System (RTLS) and method for determining real-time spatial coordinates of a user device (UD), and a method for acquiring data associated with the UD are disclosed. Additionally, a method for characterizing data associated with the UD is disclosed. Strategic placement of one or more agents and machine learning algorithms are used in acquiring and processing the data to calculate the real-time location of the UD.

Abstract: An example method including: with respect to a local session contained in a local session list, determining a remote user account corresponding to the local session; and when it is determined that the remote user account is not included in a set particular account list, concealing the local session in the local session list. Through the above method, it is feasible to only add an account of a particular object to the particular account list. In this way, local sessions corresponding to other remote user accounts other than the account of the particular object will be concealed in the local session list, and thus it is convenient for a local user to look for a particular session.

Abstract: An example method including: with respect to a local session contained in a local session list, determining a remote user account corresponding to the local session; and when it is determined that the remote user account is not included in a set particular account list, concealing the local session in the local session list. Through the above method, it is feasible to only add an account of a particular object to the particular account list. In this way, local sessions corresponding to other remote user accounts other than the account of the particular object will be concealed in the local session list, and thus it is convenient for a local user to look for a particular session.

Abstract: A highly temperature-resistant glass fiber and a preparation method therefor. The glass fiber comprises 62-66 wt % of SiO2, 14-19 wt % of Al2O3, 15-20 wt % of CaO, 0-2 wt % of MgO, 0-3 wt % of Fe2O3, and 0-1.2 wt % of TiO2, the total content of Na2O and K2O is 0.1-0.8 wt %. By precisely controlling the mixture of the components, the glass fiber has good resistance to high temperature and formability, and significantly increases the high-temperature softening point. The glass fiber has a forming temperature of not exceeding 1380° C., an upper limit temperature of devitrification of lower than 1280° C., and a high temperature softening temperature of 950° C. or above.

Abstract: A semiconductor cube is disclosed including one or more highly planar vertical sidewalls on which to form a pattern of electrical traces. The semiconductor cube may be fabricated from a semiconductor cube assembly including a vertical semiconductor die stack and a pair of wire bond landing blocks. The vertical semiconductor die stack may be wire bonded off of first and second opposed edges to different levels of the first and second wire bond landing blocks. Once all wire bonds are formed, the semiconductor cube assembly may be encapsulated in mold compound. The mold compound may then be cut to separate the semiconductor die stack from the wire bond landing blocks, leaving the wire bonds exposed in a sidewall of the semiconductor cube.

Abstract: A radio frequency coil apparatus for a magnetic resonance imaging system comprising an inductor circular carrier, a first capacitor circular carrier, and a second capacitor circular carrier. A plurality of inductor bars are provided at intervals on the inductor circular carrier. A plurality of first capacitor elements are provided on the first capacitor circular carrier, the first capacitor circular carrier being configured to be detachably connected to one end of the inductor circular carrier, the plurality of first capacitor elements being configured to be connected to one end of the plurality of inductor bars. A plurality of second capacitor elements are provided on the second capacitor circular carrier, the second capacitor circular carrier being configured to be detachably connected to the other end of the inductor circular carrier, the plurality of second capacitor elements being configured to be connected to the other end of the plurality of inductor bars.

Abstract: The disclosure is directed to a video processing apparatus and a video processing method thereof. In one of the exemplary embodiments, the disclosure is directed to a video processing apparatus which includes not limited to a storage medium configured to store a first video file, a down-scaling module coupled to the storage medium and configured to down-scale the first video file into a second video file, a learning machine module configured to receive the first video file and a third video file which is processed from the second multimedia file and generate a trained model out of the first video file and the third video file, and a transmitter configured to transmit a data package which comprises a compression of the second video file and a compression of the trained model.

Abstract: A semiconductor package is disclosed including a number of stacked semiconductor die, electrically connected to each other with wire bonds. The stacked semiconductor die are provided in a mold compound such that a spacing exists between a top die in the die stack and a surface of the mold compound. The wire bonds to the top die may be provided in the spacing. An RDL pad is affixed to the surface of the mold compound. Columns of bumps may be formed on the die bond pads of the top die in the die stack to electrically couple the RDL pad to the die stack across the spacing.

Abstract: The exemplary non-limiting embodiments described herein provide a display suspension device and related display device. In at least one embodiment, the display suspension device includes: a vertical slider, which is connected to a display so as to guide the display to slide in the vertical direction; a suspension part, with one end of the suspension part joined with the vertical slider and the other end connected to a suspension point; an air spring, which is located on the suspension part and used to retain the location of the vertical slider when the vertical slider stops sliding; a movable pulley, a rotation shaft of which is connected to a piston rod of the air spring; and a cable, which winds around the movable pulley, with one end of the cable connected to the suspension part and the other end connected to the vertical slider.

Abstract: A semiconductor package is disclosed including a number of stacked semiconductor die, electrically connected to each other with wire bonds. The stacked semiconductor die are provided in a mold compound such that a spacing exists between a top die in the die stack and a surface of the mold compound. The wire bonds to the top die may be provided in the spacing. An RDL pad is affixed to the surface of the mold compound. Columns of bumps may be formed on the die bond pads of the top die in the die stack to electrically couple the RDL pad to the die stack across the spacing.

Abstract: A method and apparatus for automatically transferring sections from a sample block to a tape and for transferring select sections to a slide. A tissue storage system for storing cut sections on the tape and digital storage system for storing photos and other information during the transfer of the sections can also be provided, thereby creating a tissue repository and data repository for future use.

Abstract: The present disclosure discloses a method, device and system for recognizing network behavior of a program. The method comprises: during the program's access to a network, acquiring application layer data in a current network behavior of the program; judging whether the application layer data includes an unknown protocol; if protocols in the application layer data are all known protocols, identifying the current network behavior of the program as a network behavior of a recognizable program; and if the application layer data includes an unknown protocol, identifying the current network behavior of the program as a network behavior of a suspicious program.

Abstract: An automated tape transfer apparatus including a tape feed mechanism feeding a continuous length of an adhesive tape through the automated tape transfer apparatus and a tape applicator applying the adhesive tape to a cutting face of a sample block, wherein a section of the sample block is adhered to the adhesive tape after cutting of the section from the sample block. A slide station transfers the cut section from the adhesive tape to a slide.

Abstract: A detection apparatus and method for parking space detection and an image processing device where the detection method includes: performing conversion on a side-view image that is photographed on the parking space and is acquired from a camera, to obtain a top-view image including said parking space; acquiring an edge image including a plurality of edges based on gradient information of said top-view image; performing conversion on said edge image and obtains a voting vector according to said gradient information, and determining marking lines according to peak values of said voting vector; and determining one or more parking spaces based on a plurality of said marking lines.