Patents by Inventor Cory Watkins
Cory Watkins has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9464992Abstract: An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc., and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.Type: GrantFiled: April 7, 2016Date of Patent: October 11, 2016Assignee: Rudolph Technologies, Inc.Inventors: Jeffrey L. O'Dell, Thomas Verburgt, Mark Harless, Cory Watkins
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Publication number: 20160223470Abstract: An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc., and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.Type: ApplicationFiled: April 7, 2016Publication date: August 4, 2016Inventors: Jeffrey L. O'Dell, Thomas Verburgt, Mark Harless, Cory Watkins
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Patent number: 9337071Abstract: An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc., and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.Type: GrantFiled: May 28, 2010Date of Patent: May 10, 2016Assignee: Rudolph Technologies, Inc.Inventors: Jeffrey L. O'Dell, Thomas Verburgt, Mark Harless, Cory Watkins
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Publication number: 20120087569Abstract: An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc., and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.Type: ApplicationFiled: October 14, 2011Publication date: April 12, 2012Applicant: RUDOLPH TECHNOLOGIES, INC.Inventors: Jeffrey O'Dell, Thomas Verburgt, Mark Harless, Cory Watkins
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Patent number: 8130372Abstract: A wafer holding mechanism for holding a wafer of the type used in the manufacture of semiconductor devices is herein described. The mechanism has a first plate having a number of offsets that define at least one lip that extends radially inward of the offsets. A second plate is positioned adjacent the first plate and generally between the first plate and the lip such that one or more fingers coupled to the second plate oppose the lip that depends from the first plate. When the second plate is moved to a closed position, the at least one lip and the one or more fingers cooperatively grasp an edge of a wafer therebetween. The wafer holding mechanism is coupled to a drive that rotates the wafer before an imaging mechanism for capturing images of the wafer as it rotates.Type: GrantFiled: March 12, 2010Date of Patent: March 6, 2012Assignee: Rudolph Technologies, Inc.Inventors: Mark Harless, Cory Watkins, Pat Simpkins, Kevin Barr
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Patent number: 8045788Abstract: An inspection tool includes a camera for obtaining images of a wafer and a controller configured for performing light source flat field correction, optical image warping correction, and optical image scale correction of the images. In operation, separate inspection tools are calibrated separately to obtain a characteristic response with respect to imaging and/or illumination for each such inspection tool. A standard target is then imaged by each inspection tool and the response of each of the inspection tools is normalized to ensure uniformity of the output of each inspection tool with respect to the other inspection tools.Type: GrantFiled: July 14, 2004Date of Patent: October 25, 2011Assignee: August Technology Corp.Inventors: Cory Watkins, Patrick Simpkins
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Patent number: 7822260Abstract: A semiconductor inspection tool comprises an edge top camera for obtaining images of a top edge of a wafer, an edge normal camera for obtaining images of a normal edge of the wafer, and a controller for receiving the images of the top edge of the wafer and the images of the normal edge of the wafer and for analyzing the images of the top edge of the wafer and the images of the normal edge of the wafer for wafer edge defects.Type: GrantFiled: March 4, 2008Date of Patent: October 26, 2010Assignee: Rudolph Technologies, Inc.Inventors: Cory Watkins, Mark Harless, Francy Abraham
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Patent number: 7813638Abstract: A system for generating a camera trigger that causes a camera to capture image data includes a memory for storing a plurality of trigger values. Each trigger value corresponds to a position of a moving stage. The system includes a controller for receiving position information indicative of a current position of the moving stage, generating a current position value based on the position information, comparing the current position value to at least one of the trigger values, and generating a camera trigger if the current position value matches one of the trigger values.Type: GrantFiled: June 6, 2005Date of Patent: October 12, 2010Assignee: Rudolph Technologies, Inc.Inventors: Cory Watkins, David Bocek
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Publication number: 20100239157Abstract: An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc., and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.Type: ApplicationFiled: May 28, 2010Publication date: September 23, 2010Applicant: RUDOLPH TECHNOLOGIES, INC.Inventors: Jeffrey O'Dell, Thomas Verburgt, Mark Harless, Cory Watkins
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Publication number: 20100166292Abstract: A wafer holding mechanism for holding a wafer of the type used in the manufacture of semiconductor devices is herein described. The mechanism has a first plate having a number of offsets that define at least one lip that extends radially inward of the offsets. A second plate is positioned adjacent the first plate and generally between the first plate and the lip such that one or more fingers coupled to the second plate oppose the lip that depends from the first plate. When the second plate is moved to a closed position, the at least one lip and the one or more fingers cooperatively grasp an edge of a wafer therebetween. The wafer holding mechanism is coupled to a drive that rotates the wafer before an imaging mechanism for capturing images of the wafer as it rotates.Type: ApplicationFiled: March 12, 2010Publication date: July 1, 2010Inventors: Mark Harless, Cory Watkins, Pat Simpkins, Kevin Barr
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Patent number: 7729528Abstract: An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc. and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.Type: GrantFiled: August 10, 2004Date of Patent: June 1, 2010Assignee: Rudolph Technologies, Inc.Inventors: Jeffrey O'Dell, Thomas Verburgt, Mark Harless, Cory Watkins
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Patent number: 7703823Abstract: A wafer holding mechanism for holding a wafer of the type used in the manufacture of semiconductor devices is herein described. The mechanism has a first plate having a number of offsets that define at least one lip that extends radially inward of the offsets. A second plate is positioned adjacent the first plate and generally between the first plate and the lip such that one or more fingers coupled to the second plate oppose the lip that depends from the first plate. When the second plate is moved to a closed position, the at least one lip and the one or more fingers cooperatively grasp an edge of a wafer therebetween. The wafer holding mechanism is coupled to a drive that rotates the wafer before an imaging mechanism for capturing images of the wafer as it rotates.Type: GrantFiled: July 11, 2005Date of Patent: April 27, 2010Assignee: Rudolph Technologies, Inc.Inventors: Mark Harless, Cory Watkins, Pat Simpkins, Kevin Barr
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Patent number: 7589783Abstract: An inspection tool includes a camera having a gain value and an offset value set to provide a first camera output indicating a first desired average gray value when the camera is illuminated with a precision light source set at a first light level. The inspection tool includes an inspection light source configured to be set at a second light level such that when the inspection light source illuminates a known target, the camera provides a second output indicating a second desired average gray value.Type: GrantFiled: July 14, 2004Date of Patent: September 15, 2009Assignee: Rudolph Technologies, Inc.Inventors: Patrick Simpkins, Cory Watkins
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Publication number: 20080212084Abstract: A semiconductor inspection tool comprises an edge top camera for obtaining images of a top edge of a wafer, an edge normal camera for obtaining images of a normal edge of the wafer, and a controller for receiving the images of the top edge of the wafer and the images of the normal edge of the wafer and for analyzing the images of the top edge of the wafer and the images of the normal edge of the wafer for wafer edge defects.Type: ApplicationFiled: March 4, 2008Publication date: September 4, 2008Inventors: Cory Watkins, Mark Harless, Francy Abraham
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Patent number: 7340087Abstract: A semiconductor inspection tool comprises an edge top camera for obtaining images of a top edge of a wafer, an edge normal camera for obtaining images of a normal edge of the wafer, and a controller for receiving the images of the top edge of the wafer and the images of the normal edge of the wafer and for analyzing the images of the top edge of the wafer and the images of the normal edge of the wafer for wafer edge defects.Type: GrantFiled: July 14, 2004Date of Patent: March 4, 2008Assignee: Rudolph Technologies, Inc.Inventors: Cory Watkins, Mark Harless, Francy Abraham
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Patent number: 7321108Abstract: A method and apparatus for dynamically focusing an imaging mechanism on a moving target surface having a variable geometry is herein disclosed. Apparatus for focusing an imaging mechanism may include an objective, a prism, or another optical device that forms part of an optical train of an imaging mechanism, a sensor for measuring a distance to the target surface, and a mechanism for modifying the depth of focus of the objective, prism or other optical device. Data from the sensor may be used to create a predictive model of the target surface. Data from the sensor is also used to fit or correlate the generated model to an exemplary target. Data from the correlated model is used to drive the mechanism for modifying the depth of focus of the objective, prism, or other optical device to maintain the surface of the exemplary target in focus.Type: GrantFiled: January 22, 2007Date of Patent: January 22, 2008Assignee: Rudolph Technology, Inc.Inventors: Cory Watkins, Mark Harless, David Vaughnn, Pat Simpkins, Shaileshkumar Goyal, Gerald Brown, Brian Delsey
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Publication number: 20070158535Abstract: A system for capturing color images using monochrome image sensors is herein disclosed. Differences in monochrome pixel intensity are correlated with color using known reflection/transmission ratios of a beam splitter.Type: ApplicationFiled: January 12, 2007Publication date: July 12, 2007Inventor: Cory Watkins
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Publication number: 20070114358Abstract: A method and apparatus for dynamically focusing an imaging mechanism on a moving target surface having a variable geometry is herein disclosed. Apparatus for focusing an imaging mechanism may include an objective, a prism, or another optical device that forms part of an optical train of an imaging mechanism, a sensor for measuring a distance to the target surface, and a mechanism for modifying the depth of focus of the objective, prism or other optical device. Data from the sensor may be used to create a predictive model of the target surface. Data from the sensor is also used to fit or correlate the generated model to an exemplary target. Data from the correlated model is used to drive the mechanism for modifying the depth of focus of the objective, prism, or other optical device to maintain the surface of the exemplary target in focus.Type: ApplicationFiled: January 22, 2007Publication date: May 24, 2007Inventors: Cory Watkins, Mark Harless, David Vaughnn, Pat Simpkins, Shaileshkumar Goyal, Gerald Brown, Brian Delsey
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Patent number: 7196300Abstract: A method and apparatus for dynamically focusing an imaging mechanism on a moving target surface having a variable geometry is herein disclosed. Apparatus for focusing an imaging mechanism may include an objective, a prism, or another optical device that forms part of an optical train of an imaging mechanism, a sensor for measuring a distance to the target surface, and a mechanism for modifying the depth of focus of the objective, prism or other optical device. Data from the sensor may be used to create a predictive model of the target surface. Data from the sensor is also used to fit or correlate the generated model to an exemplary target. Data from the correlated model is used to drive the mechanism for modifying the depth of focus of the objective, prism, or other optical device to maintain the surface of the exemplary target in focus.Type: GrantFiled: July 11, 2005Date of Patent: March 27, 2007Assignee: Rudolph Technologies, Inc.Inventors: Cory Watkins, Mark Harless, David Vaughnn, Pat Simpkins, Shaileshkumar Goyal, Gerald Brown, Brian Delsey
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Publication number: 20060046396Abstract: A wafer holding mechanism for holding a wafer of the type used in the manufacture of semiconductor devices is herein described. The mechanism has a first plate having a number of offsets that define at least one lip that extends radially inward of the offsets. A second plate is positioned adjacent the first plate and generally between the first plate and the lip such that one or more fingers coupled to the second plate oppose the lip that depends from the first plate. When the second plate is moved to a closed position, the at least one lip and the one or more fingers cooperatively grasp an edge of a wafer therebetween. The wafer holding mechanism is coupled to a drive that rotates the wafer before an imaging mechanism for capturing images of the wafer as it rotates.Type: ApplicationFiled: July 11, 2005Publication date: March 2, 2006Inventors: Mark Harless, Cory Watkins, Pat Simpkins, Kevin Barr