Patents by Inventor Cory Watkins

Cory Watkins has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060033056
    Abstract: A method and apparatus for dynamically focusing an imaging mechanism on a moving target surface having a variable geometry is herein disclosed. Apparatus for focusing an imaging mechanism may include an objective, a prism, or another optical device that forms part of an optical train of an imaging mechanism, a sensor for measuring a distance to the target surface, and a mechanism for modifying the depth of focus of the objective, prism or other optical device. Data from the sensor may be used to create a predictive model of the target surface. Data from the sensor is also used to fit or correlate the generated model to an exemplary target. Data from the correlated model is used to drive the mechanism for modifying the depth of focus of the objective, prism, or other optical device to maintain the surface of the exemplary target in focus.
    Type: Application
    Filed: July 11, 2005
    Publication date: February 16, 2006
    Inventors: Cory Watkins, Mark Harless, David Vaughnn, Pat Simpkins, Shaileshkumar Goyal, Gerald Brown, Brian Delsey
  • Publication number: 20060023229
    Abstract: Aspects of the present invention relate to a camera module for use in an optical inspection system. The camera module includes a beamsplitter assembly, a first detector assembly, and a second detector assembly. The beamsplitter assembly defines orthogonally arranged first and second sides that are optically separated by a beamsplitter face. The first detector assembly includes a detector array for sensing an image. The first detector assembly is associated with the first side of the beamsplitter assembly. The second detector assembly similarly includes a detector array for sensing an image. The second detector assembly is associated with the second side of the beamsplitter. Further, the first and second detector assemblies are substantially optically aligned relative to the beamsplitter assembly.
    Type: Application
    Filed: July 11, 2005
    Publication date: February 2, 2006
    Inventors: Cory Watkins, David Vaughnn, Pat Simpkins
  • Publication number: 20050276595
    Abstract: A system for generating a camera trigger that causes a camera to capture image data includes a memory for storing a plurality of trigger values. Each trigger value corresponds to a position of a moving stage. The system includes a controller for receiving position information indicative of a current position of the moving stage, generating a current position value based on the position information, comparing the current position value to at least one of the trigger values, and generating a camera trigger if the current position value matches one of the trigger values.
    Type: Application
    Filed: June 6, 2005
    Publication date: December 15, 2005
    Inventors: Cory Watkins, David Bocek
  • Patent number: 6970287
    Abstract: An inspection device comprises a light source, a pellicle beamsplitter for receiving light from the light source and for redirecting the light, and an aperture array for receiving light from the pellicle beamsplitter. The aperture array is a two dimensional array of pinholes having an x axis and a y axis ninety degrees apart, wherein the distance between pinholes in the x direction is greater than the distance between pinholes in the y direction. The inspection device further comprises an imaging system comprising an object imager including a plurality of lenses, a camera reimager including a plurality of lenses, and a camera for acquiring an image.
    Type: Grant
    Filed: July 16, 2002
    Date of Patent: November 29, 2005
    Assignee: August Technology Corp.
    Inventors: Cory Watkins, David Vaughn
  • Patent number: 6882415
    Abstract: A confocal three dimensional inspection system, and process for use thereof, allows for rapid inspecting of bumps and other three dimensional (3D) features on wafers, other semiconductor substrates and other large format micro topographies. The sensor eliminates out of focus light using a confocal principal to create a narrow depth response in the micron range.
    Type: Grant
    Filed: July 16, 2002
    Date of Patent: April 19, 2005
    Assignee: August Technology Corp.
    Inventors: Cory Watkins, David Vaughn
  • Patent number: 6870609
    Abstract: A confocal three dimensional inspection system, and process for use thereof, allows for inspecting of bumps and other three dimensional (3D) features on wafers and other semiconductor substrates. The sensor eliminates out of focus light using a confocal principal to improve depth response.
    Type: Grant
    Filed: February 11, 2002
    Date of Patent: March 22, 2005
    Assignee: August Technology Corp.
    Inventors: Cory Watkins, David Vaughnn
  • Publication number: 20050052530
    Abstract: An inspection tool includes a camera having a gain value and an offset value set to provide a first camera output indicating a first desired average gray value when the camera is illuminated with a precision light source set at a first light level. The inspection tool includes an inspection light source configured to be set at a second light level such that when the inspection light source illuminates a known target, the camera provides a second output indicating a second desired average gray value.
    Type: Application
    Filed: July 14, 2004
    Publication date: March 10, 2005
    Inventors: Patrick Simpkins, Cory Watkins
  • Publication number: 20050052197
    Abstract: A semiconductor inspection system comprises a first inspection tool communicatively coupled to a network, a second inspection tool communicatively coupled to the network, and a multi-tool manager communicatively coupled to the network. The multi-tool manager is configured to monitor the first inspection tool and the second inspection tool through the network.
    Type: Application
    Filed: July 14, 2004
    Publication date: March 10, 2005
    Inventor: Cory Watkins
  • Publication number: 20050041850
    Abstract: An inspection tool comprises a camera for obtaining images of a wafer and a controller configured for performing light source flat field correction, optical image warping correction, and optical image scale correction of the images.
    Type: Application
    Filed: July 14, 2004
    Publication date: February 24, 2005
    Inventors: Cory Watkins, Patrick Simpkins
  • Publication number: 20050036671
    Abstract: A semiconductor inspection tool comprises an edge top camera for obtaining images of a top edge of a wafer, an edge normal camera for obtaining images of a normal edge of the wafer, and a controller for receiving the images of the top edge of the wafer and the images of the normal edge of the wafer and for analyzing the images of the top edge of the wafer and the images of the normal edge of the wafer for wafer edge defects.
    Type: Application
    Filed: July 14, 2004
    Publication date: February 17, 2005
    Inventors: Cory Watkins, Mark Harless, Francy Abraham
  • Publication number: 20050038554
    Abstract: A semiconductor inspection tool includes a robot, a first wafer carrier proximate the robot, a first wafer inspection module proximate the robot, a second wafer inspection module proximate the robot, and a controller configured for controlling the robot to pass wafers between the first wafer carrier, the first wafer inspection module, and the second wafer inspection module.
    Type: Application
    Filed: July 14, 2004
    Publication date: February 17, 2005
    Inventor: Cory Watkins
  • Publication number: 20050008218
    Abstract: An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc. and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.
    Type: Application
    Filed: August 10, 2004
    Publication date: January 13, 2005
    Inventors: Jeffrey O'Dell, Thomas Verburgt, Mark Harless, Cory Watkins
  • Patent number: 6826298
    Abstract: An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc. and is specifically intended and designed for second optical wafer inspection, for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.
    Type: Grant
    Filed: April 29, 2000
    Date of Patent: November 30, 2004
    Assignee: August Technology Corp.
    Inventors: Jeffrey O'Dell, Thomas Verburgt, Mark Harless, Cory Watkins
  • Patent number: 6773935
    Abstract: A confocal three dimensional inspection system, and process for use thereof, allows for rapid inspecting of bumps and other three dimensional (3D) features on wafers, other semiconductor substrates and other large format micro topographies. The sensor eliminates out of focus light using a confocal principal to create a narrow depth response in the micron range.
    Type: Grant
    Filed: July 16, 2002
    Date of Patent: August 10, 2004
    Assignee: August Technology Corp.
    Inventors: Cory Watkins, David Vaughnn, Alan Blair
  • Publication number: 20040109600
    Abstract: An inspection system, and process for use thereof, allows for inspecting of semiconductors or like substrates with minimal or no wasted image space.
    Type: Application
    Filed: July 18, 2003
    Publication date: June 10, 2004
    Inventor: Cory Watkins
  • Publication number: 20040102043
    Abstract: A confocal three dimensional inspection system, and process for use thereof, allows for rapid inspecting of bumps and other three dimensional (3D) features on wafers, other semiconductor substrates and other large format micro topographies. The sensor eliminates out of focus light using a confocal principal to create a narrow depth response in the micron range.
    Type: Application
    Filed: October 30, 2003
    Publication date: May 27, 2004
    Applicant: August Technology Corp.
    Inventors: Cory Watkins, David Vaughnn, Alan Blair
  • Publication number: 20040096095
    Abstract: An inspection system, and process for use thereof, allows for inspecting of semiconductors or like substrates with minimal or no wasted image space.
    Type: Application
    Filed: July 18, 2003
    Publication date: May 20, 2004
    Applicant: August Technology Corp.
    Inventor: Cory Watkins
  • Patent number: 6731383
    Abstract: A confocal three dimensional inspection system, and process for use thereof, allows for inspecting of bumps and other three dimensional (3D) features on wafers and other semiconductor substrates. The sensor eliminates out of focus light using a confocal principal to improve depth response. This process and system creates multiple parallel confocal optical paths along a line. The out of focus light is eliminated by placing an aperture at a plane which is a conjugate focal plane to the surface of the sample. The result is that the sensor produces a signal only when the sample surface is in a narrow focal range.
    Type: Grant
    Filed: September 12, 2001
    Date of Patent: May 4, 2004
    Assignee: August Technology Corp.
    Inventors: Cory Watkins, Alan Blair
  • Publication number: 20030052346
    Abstract: A confocal three dimensional inspection system, and process for use thereof, allows for inspecting of bumps and other three dimensional (3D) features on wafers and other semiconductor substrates. The sensor eliminates out of focus light using a confocal principal to improve depth response.
    Type: Application
    Filed: February 11, 2002
    Publication date: March 20, 2003
    Inventors: Cory Watkins, David Vaughnn
  • Publication number: 20030030794
    Abstract: A confocal three dimensional inspection system, and process for use thereof, allows for rapid inspecting of bumps and other three dimensional (3D) features on wafers, other semiconductor substrates and other large format micro topographies. The sensor eliminates out of focus light using a confocal principal to create a narrow depth response in the micron range.
    Type: Application
    Filed: July 16, 2002
    Publication date: February 13, 2003
    Applicant: August Technology Corp.
    Inventors: Cory Watkins, David Vaughnn, Alan Blair